Patents by Inventor Mark M. Doherty
Mark M. Doherty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10869362Abstract: In some embodiments, a wireless local area network (WLAN) front-end can be implemented on a semiconductor die having a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to support the transmit and receive operations.Type: GrantFiled: December 4, 2018Date of Patent: December 15, 2020Assignee: Skyworks Solutions, Inc.Inventors: Chun-Wen Paul Huang, Lui Lam, Mark M. Doherty, Michael Joseph McPartlin
-
Publication number: 20200106395Abstract: Devices and methods related to embedded sensors for dynamic error vector magnitude corrections. In some embodiments, a power amplifier (PA) can include a PA die and an amplification stage implemented on the PA die. The amplification stage can include an array of amplification transistors, with the array being configured to receive and amplify a radio-frequency (RF) signal. The PA can further include a sensor implemented on the PA die. The sensor can be positioned relative to the array of amplification transistors to allow sensing of an operating condition representative of at least some of the amplification transistors. The sensor can be substantially isolated from the RF signal.Type: ApplicationFiled: April 6, 2019Publication date: April 2, 2020Inventors: Anthony Francis QUAGLIETTA, Mark M. DOHERTY, Lui LAM
-
Patent number: 10522617Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.Type: GrantFiled: March 22, 2019Date of Patent: December 31, 2019Assignee: Skyworks Solutions, Inc.Inventors: Michael Joseph McPartlin, Mark M. Doherty
-
Publication number: 20190386619Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.Type: ApplicationFiled: December 18, 2018Publication date: December 19, 2019Inventors: Chun-Wen Paul HUANG, Lui LAM, Mark M. DOHERTY
-
Publication number: 20190319585Abstract: Aspects of this disclosure relate to dynamic error vector magnitude (DEVM) compensation. In one embodiment, an apparatus includes an amplifier, a low pass filter, and a bias circuit. The amplifier, such as a power amplifier, can amplify an input signal. The low pass filter, such as an integrator, can generate a correction signal based at least partly on an indication of a duty cycle of the amplifier. The indication of the duty cycle of the amplifier can be an enable signal for the amplifier, for example. The bias circuit can generate a bias signal based at least partly on the correction signal and provide the bias signal to the amplifier to bias the amplifier.Type: ApplicationFiled: March 14, 2019Publication date: October 17, 2019Inventors: Lui Lam, Mark M. Doherty
-
Publication number: 20190319093Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.Type: ApplicationFiled: March 22, 2019Publication date: October 17, 2019Inventors: Michael Joseph McPartlin, Mark M. Doherty
-
Publication number: 20190182894Abstract: In some embodiments, a wireless local area network (WLAN) front-end can be implemented on a semiconductor die having a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to support the transmit and receive operations.Type: ApplicationFiled: December 4, 2018Publication date: June 13, 2019Inventors: Chun-Wen Paul HUANG, Lui LAM, Mark M. DOHERTY, Michael Joseph MCPARTLIN
-
Patent number: 10263072Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.Type: GrantFiled: October 30, 2017Date of Patent: April 16, 2019Assignee: Skyworks Solutions, Inc.Inventors: Michael Joseph McPartlin, Mark M. Doherty
-
Patent number: 10256774Abstract: Devices and methods related to embedded sensors for dynamic error vector magnitude corrections. In some embodiments, a power amplifier (PA) can include a PA die and an amplification stage implemented on the PA die. The amplification stage can include an array of amplification transistors, with the array being configured to receive and amplify a radio-frequency (RF) signal. The PA can further include a sensor implemented on the PA die. The sensor can be positioned relative to the array of amplification transistors to allow sensing of an operating condition representative of at least some of the amplification transistors. The sensor can be substantially isolated from the RF signal.Type: GrantFiled: November 7, 2017Date of Patent: April 9, 2019Assignee: Skyworks Solutions, Inc.Inventors: Anthony Francis Quaglietta, Mark M. Doherty, Lui Lam
-
Patent number: 10236829Abstract: Aspects of this disclosure relate to dynamic error vector magnitude (DEVM) compensation. In one embodiment, an apparatus includes an amplifier, a low pass filter, and a bias circuit. The amplifier, such as a power amplifier, can amplify an input signal. The low pass filter, such as an integrator, can generate a correction signal based at least partly on an indication of a duty cycle of the amplifier. The indication of the duty cycle of the amplifier can be an enable signal for the amplifier, for example. The bias circuit can generate a bias signal based at least partly on the correction signal and provide the bias signal to the amplifier to bias the amplifier.Type: GrantFiled: October 19, 2017Date of Patent: March 19, 2019Assignee: Skyworks Solutions, Inc.Inventors: Lui Lam, Mark M. Doherty
-
Publication number: 20190079549Abstract: Supply circuits, devices and methods related to radio-frequency amplifiers. In some embodiments, an amplification system can include an amplifier circuit having a plurality of stages and configured to amplify a signal. The amplification system can further include a supply circuit configured to provide a regulated supply voltage to at least one stage of the plurality of stages, and an unregulated supply voltage to at least one stage of the plurality of stages. In some embodiments, the amplifier circuit can be implemented as a power amplifier circuit.Type: ApplicationFiled: September 11, 2018Publication date: March 14, 2019Inventors: Lui LAM, Mark M. DOHERTY
-
Patent number: 10158333Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.Type: GrantFiled: April 17, 2017Date of Patent: December 18, 2018Assignee: Skyworks Solutions, Inc.Inventors: Chun-Wen Paul Huang, Lui Lam, Mark M. Doherty
-
Patent number: 10149347Abstract: Front-end integrated circuit for wireless local area network WLAN applications. In some embodiments, a semiconductor die can include a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to facilitate the transmit and receive operations.Type: GrantFiled: January 6, 2016Date of Patent: December 4, 2018Assignee: Skyworks Solutions, Inc.Inventors: Chun-Wen Paul Huang, Lui Lam, Mark M. Doherty, Michael Joseph McPartlin
-
Publication number: 20180138861Abstract: Aspects of this disclosure relate to dynamic error vector magnitude (DEVM) compensation. In one embodiment, an apparatus includes an amplifier, a low pass filter, and a bias circuit. The amplifier, such as a power amplifier, can amplify an input signal. The low pass filter, such as an integrator, can generate a correction signal based at least partly on an indication of a duty cycle of the amplifier. The indication of the duty cycle of the amplifier can be an enable signal for the amplifier, for example. The bias circuit can generate a bias signal based at least partly on the correction signal and provide the bias signal to the amplifier to bias the amplifier.Type: ApplicationFiled: October 19, 2017Publication date: May 17, 2018Inventors: Lui Lam, Mark M. Doherty
-
Publication number: 20180130876Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.Type: ApplicationFiled: October 30, 2017Publication date: May 10, 2018Inventors: Michael Joseph McPartlin, Mark M. Doherty
-
Publication number: 20180062585Abstract: Devices and methods related to embedded sensors for dynamic error vector magnitude corrections. In some embodiments, a power amplifier (PA) can include a PA die and an amplification stage implemented on the PA die. The amplification stage can include an array of amplification transistors, with the array being configured to receive and amplify a radio-frequency (RF) signal. The PA can further include a sensor implemented on the PA die. The sensor can be positioned relative to the array of amplification transistors to allow sensing of an operating condition representative of at least some of the amplification transistors. The sensor can be substantially isolated from the RF signal.Type: ApplicationFiled: November 7, 2017Publication date: March 1, 2018Inventors: Anthony Francis QUAGLIETTA, Mark M. DOHERTY, Lui LAM
-
Patent number: 9876478Abstract: Apparatus and methods for wireless local area network (WLAN) power amplifiers are provided. In certain configurations, a WLAN power amplifier system includes a WLAN power amplifier, an output impedance matching network, and an envelope tracker. The WLAN power amplifier includes an input that receives a WLAN signal having a fundamental frequency and an output that generates an amplified WLAN signal for transmission over an antenna. The output impedance matching network is electrically connected to the output of the WLAN power amplifier, and can provide a load line impedance between 10? and 35? at the fundamental frequency. The envelope tracker receives an envelope of the WLAN signal, and controls a voltage level of a power supply of the WLAN power amplifier based on the envelope signal.Type: GrantFiled: September 23, 2014Date of Patent: January 23, 2018Assignee: Skyworks Solutions, Inc.Inventors: Hardik Bhupendra Modi, Craig Joseph Christmas, Xuanang Zhu, Mark M. Doherty
-
Publication number: 20170338776Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.Type: ApplicationFiled: April 17, 2017Publication date: November 23, 2017Inventors: Chun-Wen Paul HUANG, Lui LAM, Mark M. DOHERTY
-
Patent number: 9825591Abstract: Aspects of this disclosure relate to dynamic error vector magnitude (DEVM) compensation. In one embodiment, an apparatus includes an amplifier, a low pass filter, and a bias circuit. The amplifier, such as a power amplifier, can amplify an input signal. The low pass filter, such as an integrator, can generate a correction signal based at least partly on an indication of a duty cycle of the amplifier. The indication of the duty cycle of the amplifier can be an enable signal for the amplifier, for example. The bias circuit can generate a bias signal based at least partly on the correction signal and provide the bias signal to the amplifier to bias the amplifier.Type: GrantFiled: October 13, 2016Date of Patent: November 21, 2017Assignee: Skyworks Solutions, Inc.Inventors: Lui Lam, Mark M. Doherty
-
Patent number: 9818821Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.Type: GrantFiled: July 21, 2016Date of Patent: November 14, 2017Assignee: Skyworks Solutions, Inc.Inventors: Michael Joseph McPartlin, Mark M. Doherty