Abstract: Devices and methods related to embedded sensors for dynamic error vector magnitude corrections. In some embodiments, a power amplifier (PA) can include a PA die and an amplification stage implemented on the PA die. The amplification stage can include an array of amplification transistors, with the array being configured to receive and amplify a radio-frequency (RF) signal. The PA can further include a sensor implemented on the PA die. The sensor can be positioned relative to the array of amplification transistors to allow sensing of an operating condition representative of at least some of the amplification transistors. The sensor can be substantially isolated from the RF signal.

Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.

Abstract: Aspects of this disclosure relate to dynamic error vector magnitude (DEVM) compensation. In one embodiment, an apparatus includes an amplifier, a low pass filter, and a bias circuit. The amplifier, such as a power amplifier, can amplify an input signal. The low pass filter, such as an integrator, can generate a correction signal based at least partly on an indication of a duty cycle of the amplifier. The indication of the duty cycle of the amplifier can be an enable signal for the amplifier, for example. The bias circuit can generate a bias signal based at least partly on the correction signal and provide the bias signal to the amplifier to bias the amplifier.

Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

Abstract: Aspects of this disclosure relate to dynamic error vector magnitude (DEVM) compensation. In one embodiment, an apparatus includes an amplifier, a low pass filter, and a bias circuit. The amplifier, such as a power amplifier, can amplify an input signal. The low pass filter, such as an integrator, can generate a correction signal based at least partly on an indication of a duty cycle of the amplifier. The indication of the duty cycle of the amplifier can be an enable signal for the amplifier, for example. The bias circuit can generate a bias signal based at least partly on the correction signal and provide the bias signal to the amplifier to bias the amplifier.

Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

Abstract: Front-end integrated circuit for wireless local area network WLAN applications. In some embodiments, a semiconductor die can include a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to facilitate the transmit and receive operations.

Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.

Abstract: Devices and methods related to embedded sensors for dynamic error vector magnitude corrections. In some embodiments, a power amplifier (PA) can include a PA die and an amplification stage implemented on the PA die. The amplification stage can include an array of amplification transistors, with the array being configured to receive and amplify a radio-frequency (RF) signal. The PA can further include a sensor implemented on the PA die. The sensor can be positioned relative to the array of amplification transistors to allow sensing of an operating condition representative of at least some of the amplification transistors. The sensor can be substantially isolated from the RF signal.

Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

Abstract: Aspects of this disclosure relate to dynamic error vector magnitude (DEVM) compensation. In one embodiment, an apparatus includes an amplifier, a low pass filter, and a bias circuit. The amplifier, such as a power amplifier, can amplify an input signal. The low pass filter, such as an integrator, can generate a correction signal based at least partly on an indication of a duty cycle of the amplifier. The indication of the duty cycle of the amplifier can be an enable signal for the amplifier, for example. The bias circuit can generate a bias signal based at least partly on the correction signal and provide the bias signal to the amplifier to bias the amplifier.

Abstract: Apparatus and methods for wide local area network (WLAN) power amplifiers are provided. In certain configurations, a WLAN power amplifier system includes a WLAN power amplifier, an output impedance matching network, and an envelope tracker. The WLAN power amplifier includes an input that receives a WLAN signal having a fundamental frequency and an output that generates an amplified WLAN signal for transmission over an antenna. The output impedance matching network is electrically connected to the output of the WLAN power amplifier, and can provide a load line impedance between 10? and 35? at the fundamental frequency. The envelope tracker receives an envelope of the WLAN signal, and controls a voltage level of a power supply of the WLAN power amplifier based on the envelope signal.

Abstract: A system and method are provided for reducing dynamic EVM of an integrated circuit power amplifier (PA) used for RF communication. In a multistage PA, the largest amplification stage is biased with a high amplitude current pulse upon receipt of a Tx enable, before receipt of the RF signal data burst. The high amplitude current pulse causes a large portion of the total ICQ budget of the multistage PA to pass through the largest amplification stage causing the entire integrated circuit to rapidly approach steady-state operating conditions. A smoothing bias current is applied to the largest amplification stage after the pulse decays to compensate for transient bias current levels while standard bias circuitry is still approaching steady-state temperature.

Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

Abstract: Built in test circuitry for an array transmitter. The circuitry includes a directional coupler with directivity equal to the mutual coupling between adjacent antenna elements. The direct input port of the coupler is connected to the antenna element and the direct output port of the coupler is connected to the circuitry generating the signal transmitted by the antenna element. The coupled port of the coupler feeds a detector which in turn provides an input to a control circuit. This circuit can be controlled to test, for each antenna element, the RF power driving each antenna element, the effective power radiated from each element, and the operation of the phase shifter coupled to each antenna element.

Abstract: Stabilized polymer dispersions in which the principal polymer contains a core component of acrylic polymers and stabilizer components which are polymers of ethylenically unsaturated monomers and which are grafted to the core component at the stabilizer ends, can be prepared using a catalytic chain transfer agent containing Co.sup.+2.