Abstract: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

Abstract: A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis.

Abstract: A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.

Abstract: A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

Abstract: A method and system for cooling a heat source are presented. The system includes a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat rejector configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in a cooling system to enhance the cooling efficiency of the system.

Abstract: A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

Abstract: An apparatus and method of manufacturing an apparatus for circulating a cooling material within a heat exchanger is disclosed. The apparatus comprises a manifold layer and an interface layer. The interface layer comprises one or more narrowing trenches. The manifold layer comprises a plurality of apertures, each positioned on either side of a narrowing trench. In operation, a cooling material is transmitted to an apertures, through a channel defined by the narrowing trench and a bottom surface of the manifold layer, and out an aperture, thereby cooling a heat-generating source coupled to a bottom surface of the interface layer. The method comprises forming a narrowing trench in an interface layer, which exhibits anisotropic etching, by etching the interface layer to form a trench having sloping sidewalls. The method further comprises coupling the interface layer to a manifold layer.

Abstract: A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Abstract: A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

Abstract: A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

Abstract: An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.

Abstract: An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with electrical components embedded therein to provide a desired surface dimension thereof. The described system embodiment comprises a non-abrasive lapping plate having a lapping surface with a plurality of grooves therein, a support structure for supporting a workpiece such that an air bearing surface thereof is exposed, and a non-abrasive liquid. When the non-abrasive liquid is dispensed between the air bearing surface and the lapping plate, the lapping plate contacts the air bearing surface such that the air bearing surface is lapped solely by the grooves in the lapping plate. The electrical components of the air bearing surface are lapped such that they are substantially uniform in dimension relative to the air bearing surface.

Abstract: A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Abstract: A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Abstract: An apparatus and method of manufacturing an apparatus for circulating a cooling material within a heat exchanger is disclosed. The apparatus comprises a manifold layer and an interface layer. The interface layer comprises one or more narrowing trenches. The manifold layer comprises a plurality of apertures, each positioned on either side of a narrowing trench. In operation, a cooling material is transmitted to an apertures, through a channel defined by the narrowing trench and a bottom surface of the manifold layer, and out an aperture, thereby cooling a heat-generating source coupled to a bottom surface of the interface layer. The method comprises forming a narrowing trench in an interface layer, which exhibits anisotropic etching, by etching the interface layer to form a trench having sloping sidewalls. The method further comprises coupling the interface layer to a manifold layer.

Abstract: A method and apparatus for cooling a hat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer couple to the first layer and in contact with the second side of the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.

Abstract: A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

Abstract: A force/torque transducer including a first rigid member, a second rigid member, one or more flexural beams connected between the first rigid member and the second rigid member, the first and second members and the beam having a center point, the flexural beams having respective decoupling points that are symmetrical with respect to the center point, the flexural beams having symmetrical strain fields located on the flexural beams such that first and second strain fields achieve strain responses to a load of a single axis of magnitude equal to each other and third and fourth strain fields achieve strain responses to the load of the single axis of magnitude equal to each other, two of the responses being one sign and two being the other sign, the strain responses of the strain fields to loads of all other axes being capable of being cancelled out when the responses of one of the first and second fields and one of the third and fourth fields are given opposite sign and the responses of like axes are added toget