Abstract: A sensor module assembly for a respiratory therapy apparatus may be configured for a seal-based securement within a respiratory therapy device that includes a separable pneumatic block to make assembly or replacement more efficient. The sensor module assembly may include a flow manifold. The flow manifold may have an inlet and an outlet and a main pneumatic path between the inlet and the outlet. The assembly may have a sensor module with sensor(s) on a printed circuit board. The sensor module may be pneumatically and fixedly coupled to the flow manifold. The inlet of the flow manifold may be configured for removable coupling with an outlet of the pneumatic block assembly. Moreover, the outlet of the flow manifold may be configured for removable coupling with a pneumatic path of a housing panel of the respiratory therapy apparatus. The pneumatic path is adapted for supplying breathable gas to a patient interface.

Abstract: Circuits and methods for providing at least a startup voltage for reversed-operation unidirectional power converters or bi-modal power converters sufficient to power at least an auxiliary circuit of such power converters while the normal supply voltage to at least the auxiliary circuit is insufficient to enable operation of the auxiliary circuit. Embodiments of the invention utilize an initial startup charge pump circuit to create a suitable startup voltage while the normal supply voltage to the auxiliary circuit is less than a specified voltage VMIN. Embodiments of the present invention also provide additional benefits, including small size since the initial startup charge pump circuit omits the use of an inductor, and high efficiency since the initial startup charge pump circuit may be disabled when the normal supply voltage to the auxiliary circuit is equal to or greater than VMIN.

Abstract: The present invention relates to stable and high-producing site-specific integration (SSI) host cells, e. g. Chinese hamster ovary (CHO)-derived host cells, methods to produce and to use them.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: A DC-DC converter includes an insulating substrate; a magnetic core embedded in the insulating substrate, the magnetic core having non-zero x, y and z dimensions of less than or equal to about 5.4 mm by about 5.4 mm by about 1.8 mm; separate primary and secondary transformer windings surrounding first and second regions of the magnetic core; and a control circuit including: an oscillator; a drive circuit coupled to the oscillator; and one or more switches coupled to the drive circuit; the drive circuit providing a switching signal to the one or more switches and energizing the one or more switches to provide a drive voltage to the primary transformer winding. The one or more switches are Field Effect Transistors implemented in a Silicon-on-Insulator configuration or as a Silicon-on-Sapphire configuration.

Abstract: A high efficiency concurrent bidirectional charge balancing circuit (BCBC) for battery balancing that does not require high voltage transistors and which automatically transfers charge from a higher voltage cell to a lower voltage cell within a battery pack of multiple series-connected cells using a bi-phase charge pump, which may be an adiabatic-enabled bi-phase charge pump. The BCBC requires no complex external control logic to determine how the BCBCs are to be connected, charge balancing is performed without disturbing the series connections of the cells in a battery pack, and there is constant charge balancing across the entire charge range of cells in a battery pack. Because each BCBC spans only two cells, the voltage across each BCBC is the sum of the voltages from only those two cells; accordingly, the BCBC scales up to a large number of cells without requiring increasingly larger and more expensive high voltage transistors.

Abstract: Circuits and methods for providing at least a startup voltage for reversed-operation unidirectional power converters or bi-modal power converters sufficient to power at least an auxiliary circuit of such power converters while the normal supply voltage to at least the auxiliary circuit is insufficient to enable operation of the auxiliary circuit. Embodiments of the invention utilize an initial startup charge pump circuit to create a suitable startup voltage while the normal supply voltage to the auxiliary circuit is less than a specified voltage VMIN. Embodiments of the present invention also provide additional benefits, including small size since the initial startup charge pump circuit omits the use of an inductor, and high efficiency since the initial startup charge pump circuit may be disabled when the normal supply voltage to the auxiliary circuit is equal to or greater than VMIN.

Abstract: Circuits and methods for providing at least a startup voltage for reversed-operation unidirectional power converters or bi-modal power converters sufficient to power at least an auxiliary circuit of such power converters while the normal supply voltage to at least the auxiliary circuit is insufficient to enable operation of the auxiliary circuit. Embodiments of the invention utilize an initial startup charge pump circuit to create a suitable startup voltage while the normal supply voltage to the auxiliary circuit is less than a specified voltage VMIN. Embodiments of the present invention also provide additional benefits, including small size since the initial startup charge pump circuit omits the use of an inductor, and high efficiency since the initial startup charge pump circuit may be disabled when the normal supply voltage to the auxiliary circuit is equal to or greater than VMIN.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: An improved electronic oscillator circuit suitable for use in an isolating DC-to-DC converter circuit, and an improved isolating DC-to-DC converter circuit. In one embodiment, an integrated circuit coupled to a transformer includes an oscillator and an output driver. The integrated circuit is preferably fabricated using a silicon-on-insulator technology. The oscillator outputs an alternating pulse signal defined by electrical characteristics of components other than the transformer. The alternating pulse signal is coupled to the output driver, the alternating output of which is coupled to corresponding legs of the primary winding of the transformer. The secondary winding of the transformer provides an electromagnetically coupled isolated output which may be rectified and filtered to produce a DC output voltage. Additional functionality, such as current protection circuitry for the improved circuits, may be readily added to the integrated circuit at little or no increase in cost.

Abstract: The present disclosure relates to a site-specific integration (SSI) mammalian cell that comprises at least two distinct recombination target sites (RTS) wherein two RTS are chromosomally-integrated within the NL1 locus or the NL2 locus. The disclosure also relates to a SSI mammalian cell comprising at least four distinct RTS wherein two RTS are chromosomally-integrated within the NL1 or the NL2 locus and two RTS are chromosomally-integrated within a separate locus. The disclosure also relates to methods for using the SSI mammalian cell to produce recombinant protein expression cell lines that can express difficult to express proteins.

Abstract: An improved electronic oscillator circuit suitable for use in an isolating DC-to-DC converter circuit, and an improved isolating DC-to-DC converter circuit. In one embodiment, an integrated circuit coupled to a transformer includes an oscillator and an output driver. The integrated circuit is preferably fabricated using a silicon-on-insulator technology. The oscillator outputs an alternating pulse signal defined by electrical characteristics of components other than the transformer. The alternating pulse signal is coupled to the output driver, the alternating output of which is coupled to corresponding legs of the primary winding of the transformer. The secondary winding of the transformer provides an electromagnetically coupled isolated output which may be rectified and filtered to produce a DC output voltage. Additional functionality, such as current protection circuitry for the improved circuits, may be readily added to the integrated circuit at little or no increase in cost.

Abstract: The present invention relates to stable and high-producing site-specific integration (SSI) host cells, e. g. Chinese hamster ovary (CHO)-derived host cells, methods to produce and to use them.

Abstract: An improved electronic oscillator circuit suitable for use in an isolating DC-to-DC converter circuit, and an improved isolating DC-to-DC converter circuit. In one embodiment, an integrated circuit coupled to a transformer includes an oscillator and an output driver. The integrated circuit is preferably fabricated using a silicon-on-insulator technology. The oscillator outputs an alternating pulse signal defined by electrical characteristics of components other than the transformer. The alternating pulse signal is coupled to the output driver, the alternating output of which is coupled to corresponding legs of the primary winding of the transformer. The secondary winding of the transformer provides an electromagnetically coupled isolated output which may be rectified and filtered to produce a DC output voltage. Additional functionality, such as current protection circuitry for the improved circuits, may be readily added to the integrated circuit at little or no increase in cost.

Abstract: The present invention relates to stable and high-producing site-specific integration (SSI) host cells, e. g. Chinese hamster ovary (CHO)-derived host cells, methods to produce and to use them.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped or the like, and singulated. The singulated dies, which may be of different sizes and functionality, are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Sets of dies of different functionality may be tested as a system or subsystem. Once test probing is complete, the dies (or sets of dies) and tile are singulated into die/tile assemblies.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.

Abstract: Programmable multi-reflective phase shifters which provide reduced root-mean-square phase error, can be optimized for a desired frequency band, can compensate for process variations arising during manufacture, and can help offset system level performance shortfalls. Embodiments include a hybrid coupler (e.g., a Lange hybrid coupler) in combination with a multi-reflective reactance-based terminating circuit with a number of different configurations that permit various modes of operation, including a thermometric mode, a phase overlap mode with interstitial phase shift states, an extended range phase shift mode, and a “tweak bit” mode. A number of programmable or selectable RF phase shifters can be series or parallel connected to provide a desired gamut of phase shift.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.