Abstract: An improved electronic oscillator circuit suitable for use in an isolating DC-to-DC converter circuit, and an improved isolating DC-to-DC converter circuit. In one embodiment, an integrated circuit coupled to a transformer includes an oscillator and an output driver. The integrated circuit is preferably fabricated using a silicon-on-insulator technology. The oscillator outputs an alternating pulse signal defined by electrical characteristics of components other than the transformer. The alternating pulse signal is coupled to the output driver, the alternating output of which is coupled to corresponding legs of the primary winding of the transformer. The secondary winding of the transformer provides an electromagnetically coupled isolated output which may be rectified and filtered to produce a DC output voltage. Additional functionality, such as current protection circuitry for the improved circuits, may be readily added to the integrated circuit at little or no increase in cost.

Abstract: A DC-DC converter includes an insulating substrate; a magnetic core embedded in the insulating substrate, the magnetic core having non-zero x, y and z dimensions of less than or equal to about 5.4 mm by about 5.4 mm by about 1.8 mm; separate primary and secondary transformer windings surrounding first and second regions of the magnetic core; and a control circuit including: an oscillator; a drive circuit coupled to the oscillator; and one or more switches coupled to the drive circuit; the drive circuit providing a switching signal to the one or more switches and energizing the one or more switches to provide a drive voltage to the primary transformer winding. The one or more switches are Field Effect Transistors implemented in a Silicon-on-Insulator configuration or as a Silicon-on-Sapphire configuration.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.

Abstract: Programmable multi-reflective phase shifters which provide reduced root-mean-square phase error, can be optimized for a desired frequency band, can compensate for process variations arising during manufacture, and can help offset system level performance shortfalls. Embodiments include a hybrid coupler (e.g., a Lange hybrid coupler) in combination with a multi-reflective reactance-based terminating circuit with a number of different configurations that permit various modes of operation, including a thermometric mode, a phase overlap mode with interstitial phase shift states, an extended range phase shift mode, and a “tweak bit” mode. A number of programmable or selectable RF phase shifters can be series or parallel connected to provide a desired gamut of phase shift.

Abstract: An extension of conventional IC fabrication processes to include some of the concepts of flip-chip assemblies while producing a final “non-flip chip” circuit structure suitable for conventional packaging or for direct usage by customers. Multiple IC dies are fabricated on a semiconductor wafer in a conventional fashion, solder bumped, and singulated. The singulated dies are then flip-chip assembled onto a single tile substrate of thin-film material which has been patterned with vias, peripheral connection pads, and one or more ground planes. Once dies are flip-chip mounted to the thin-film tile, all of the dies on the entire tile may be probed using automated testing equipment. Once test probing is complete, the dies and tile are singulated into die/tile assemblies.

Abstract: The present invention relates to stable and high-producing site-specific integration (SSI) host cells, e.g. Chinese hamster ovary (CHO)-derived host cells, methods to produce and to use them.

Abstract: The present invention relates to novel human antibodies specifically directed against human immunoglobulin E (anti-IgE). The present invention also relates to pharmaceutical compositions and methods for treating asthma, in particular allergic asthma, as well as other IgE-mediated disorders including allergic rhinitis and food allergies.

Abstract: The present invention relates to novel human antibodies specifically directed against human immunoglobulin E (anti-IgE). The present invention also relates to pharmaceutical compositions and methods for treating asthma, in particular allergic asthma, as well as other IgE-mediated disorders including allergic rhinitis and food allergies.

Abstract: The present invention relates to novel human antibodies specifically directed against human immunoglobulin E (anti-IgE). The present invention also relates to pharmaceutical compositions and methods for treating asthma, in particular allergic asthma, as well as other IgE-mediated disorders including allergic rhinitis and food allergies.

Abstract: The present invention relates to antibodies including human antibodies and antigen-binding portions thereof that bind to P-cadherin, and that function to inhibit P-cadherin. The invention also relates to heavy and light chain immunoglobulins derived from human P-cadherin antibodies and nucleic acid molecules encoding such immunoglobulins. The present invention also relates to methods of making human P-cadherin antibodies, compositions comprising these antibodies and methods of using the antibodies and compositions. The invention also relates to transgenic animals or plants comprising nucleic acid molecules of the present invention.

Abstract: The present invention provides a switchable gain amplifier comprising a high-pass filter pole. The switchable gain amplifier comprises first and second input nodes for receiving first and second components of a differential input signal. A first input terminal of a first differential amplifier is coupled to the first input node, and a first input terminal of a second differential amplifier is coupled to the second input node. A first variable resistance is coupled between the first input terminal of the first differential amplifier and a second input terminal of the first differential amplifier. A second variable resistance is coupled between the first input terminal of the second differential amplifier and a second input terminal of the second differential amplifier. A differential capacitor is coupled between the second input terminal of the first differential amplifier and the second input terminal of the second differential amplifier.

Abstract: The present invention provides a reconfigurable filter having a bandwidth and frequency offset that are independently configured, thereby allowing the filter to realize any filter pole. In general, the filter includes a filtering stage and a reverse gain stage. The filtering stage has a bandwidth configured by a bandwidth control signal from control logic and a frequency offset configured by an offset control signal. The reverse gain stage provides the offset control signal to the filtering stage based a reverse gain control signal from the control logic and the output signal. Based on the bandwidth control signal and the reverse gain control signal, the bandwidth of the filter is configured independently from the frequency offset of the filter and the frequency offset is configured independently from the bandwidth.