Patents by Inventor Mark O. Maxson
Mark O. Maxson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20160283823Abstract: Aspects of the present disclosure are directed towards environmental based location monitoring. Environmental based location monitoring can include collecting, a first set of image data that corresponds to a first set of environmental characteristics existing within a bounded area encompassing a hardware element of the computer and determining an environmental difference based on a difference between a first location corresponding to a geographic position of the hardware element relative to the first set of environmental characteristics and a second location corresponding to an approved geographic position of the hardware element. Environmental based location monitoring can include determining that the environmental difference does not satisfy a threshold and executing a reaction sequence in the computer, in response to determining that the environmental difference does not satisfy the threshold.Type: ApplicationFiled: March 23, 2015Publication date: September 29, 2016Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark O. Maxson
-
Publication number: 20160285887Abstract: Aspects of the present disclosure are directed towards environmental based location monitoring. Environmental based location monitoring can include collecting, a first set of image data that corresponds to a first set of environmental characteristics existing within a bounded area encompassing a hardware element of the computer and determining an environmental difference based on a difference between a first location corresponding to a geographic position of the hardware element relative to the first set of environmental characteristics and a second location corresponding to an approved geographic position of the hardware element. Environmental based location monitoring can include determining that the environmental difference does not satisfy a threshold and executing a reaction sequence in the computer, in response to determining that the environmental difference does not satisfy the threshold.Type: ApplicationFiled: December 21, 2015Publication date: September 29, 2016Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark O. Maxson
-
Patent number: 9438606Abstract: Aspects of the present disclosure are directed towards environmental based location monitoring. Environmental based location monitoring can include collecting, a first set of image data that corresponds to a first set of environmental characteristics existing within a bounded area encompassing a hardware element of the computer and determining an environmental difference based on a difference between a first location corresponding to a geographic position of the hardware element relative to the first set of environmental characteristics and a second location corresponding to an approved geographic position of the hardware element. Environmental based location monitoring can include determining that the environmental difference does not satisfy a threshold and executing a reaction sequence in the computer, in response to determining that the environmental difference does not satisfy the threshold.Type: GrantFiled: December 21, 2015Date of Patent: September 6, 2016Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark O. Maxson
-
Publication number: 20160173105Abstract: Systems and methods to obstruct analysis of a microchip may include an electrical component of a microchip and a photodetector positioned within the microchip. The photodetector may be configured to sense electromagnetic radiation. Circuitry in electrical communication with the photodetector may be configured to initiate an action to obstruct analysis of the electrical component in response to a change in a level of the electromagnetic radiation.Type: ApplicationFiled: December 18, 2014Publication date: June 16, 2016Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark O. Maxson
-
Publication number: 20160174388Abstract: Systems and methods to obstruct analysis of a microchip may include an electrical component of a microchip and a photodetector positioned within the microchip. The photodetector may be configured to sense electromagnetic radiation. Circuitry in electrical communication with the photodetector may be configured to initiate an action to obstruct analysis of the electrical component in response to a change in a level of the electromagnetic radiation.Type: ApplicationFiled: December 15, 2014Publication date: June 16, 2016Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark O. Maxson
-
Patent number: 9341670Abstract: A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded.Type: GrantFiled: May 20, 2014Date of Patent: May 17, 2016Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Philip R. Germann, Mark O. Maxson
-
Publication number: 20150342057Abstract: A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded.Type: ApplicationFiled: May 20, 2014Publication date: November 26, 2015Applicant: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Philip R. Germann, Mark O. Maxson
-
Publication number: 20150338457Abstract: A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded.Type: ApplicationFiled: August 19, 2014Publication date: November 26, 2015Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Philip R. Germann, Mark O. Maxson
-
Patent number: 9003559Abstract: Apparatus, method and program product detect an attempt to tamper with a microchip by determining that an electrical path comprising one or more connections and a metal plate attached to the backside of a microchip has become disconnected or otherwise altered. A tampering attempt may also be detected in response to the presence of an electrical path that should not be present, as may result from the microchip being incorrectly reconstituted. Actual and/or deceptive paths may be automatically selected and monitored to further confound a reverse engineering attempt.Type: GrantFiled: July 29, 2008Date of Patent: April 7, 2015Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson, Carl-Otto Nilsen
-
Patent number: 8332659Abstract: Method and apparatus and associated method of detecting microchip tampering may include a conductive element in electrical communication with multiple sensors for verifying that signal degradation occurs at an expected region of the conductive element. A detected variance from the expected region may automatically trigger an action for impeding an integrated circuit exploitation process.Type: GrantFiled: July 29, 2008Date of Patent: December 11, 2012Assignee: International Business Machines CorporationInventors: Gerald K Bartley, Darryl J Becker, Paul E Dahlen, Philip R Germann, Andrew B Maki, Mark O Maxson
-
Patent number: 8214657Abstract: A method, program product and apparatus include resistance structures positioned proximate security sensitive microchip circuitry. Alteration in the position, makeup or arrangement of the resistance structures may be detected and initiate an action for defending against a reverse engineering or other exploitation effort. The resistance structures may be automatically and selectively designated for monitoring. Some of the resistance structures may have different resistivities. The sensed resistance may be compared to an expected resistance, ratio or other resistance-related value. The structures may be intermingled with false structures, and may be overlapped or otherwise arranged relative to one another to further complicate unwelcome analysis.Type: GrantFiled: July 29, 2008Date of Patent: July 3, 2012Assignee: International Business Machines CorporationInventors: Gerald K Bartley, Darryl J Becker, Paul E Dahlen, Philip R Germann, Andrew B Maki, Mark O Maxson, John E. Sheets, II
-
Patent number: 8172140Abstract: A method and apparatus include conductive material doped within a microchip that accumulates a detectable charge in the presence of ions. Such ions may result from a focused ion beam or other unwelcome technology exploitation effort. Circuitry sensing the charge buildup in the embedded, doped material may initiate a defensive action intended to defeat the tampering operation.Type: GrantFiled: July 29, 2008Date of Patent: May 8, 2012Assignee: International Business Machines CorporationInventors: Gerald K Bartley, Darryl J. Becker, Todd A. Christensen, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson, John E. Sheets, II
-
Patent number: 7952478Abstract: An apparatus and method detect microchip tampering by including a capacitance circuit that comprises a protective cover. Dielectric material may be sandwiched between the cover and a backside metal layer, which may be proximate a protected surface of the microchip. Changes in the capacitance of the above circuit caused by alteration of the cover or other component of the capacitance circuit may be sensed and prompt defensive action.Type: GrantFiled: July 29, 2008Date of Patent: May 31, 2011Assignee: International Business Machines CorporationInventors: Gerald K Bartley, Darryl J Becker, Paul E Dahlen, Philip R Germann, Andrew B Maki, Mark O Maxson
-
Patent number: 7884625Abstract: Apparatus, method and program product may detect an attempt to tamper with a microchip by detecting an unacceptable alteration in a measured capacitance associated with capacitance structures proximate the backside of a microchip. The capacitance structures typically include metallic shapes and may connect using through-silicon vias to active sensing circuitry within the microchip. In response to the sensed change, a shutdown, spoofing, self-destruct or other defensive action may be initiated to protect security sensitive circuitry of the microchip.Type: GrantFiled: July 29, 2008Date of Patent: February 8, 2011Assignee: International Business Machines CorporationInventors: Gerald K Bartley, Darryl J Becker, Paul E Dahlen, Philip R Germann, Andrew B Maki, Mark O Maxson
-
Patent number: 7838336Abstract: A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed between the die and the carrier via the through hole.Type: GrantFiled: September 24, 2007Date of Patent: November 23, 2010Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson
-
Patent number: 7810065Abstract: System and method for designing an electronic package. A placement manager receives a physical design of an electronic package from a packaging design tool. The placement manager receives design constraints regarding the physical design for the electronic package. The placement manager inserts specifications for at least one de-gassing opening in the physical design for the electronic package, wherein the specification for at least one de-gassing opening are created in accordance with said design constraints regarding said physical design of said electronic package. The placement manager outputs an updated physical design of the electronic package.Type: GrantFiled: August 24, 2007Date of Patent: October 5, 2010Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson, Trevor J. Timpane
-
Patent number: 7701244Abstract: An integrated circuit assembly and associated method of detecting microchip tampering may include multiple connections in electrical communication with a conductive layer. Defensive circuitry may inhibit analysis of the microchip where a connection no longer connects to the conductive layer. The defensive circuitry may similarly be initiated where a connection unintended to be in electrical communication with the conductive layer is nonetheless connected.Type: GrantFiled: July 29, 2008Date of Patent: April 20, 2010Assignee: International Business Machines CorporationInventors: Gerald K Bartley, Darryl J Becker, Paul E Dahlen, Philip R Germann, Andrew B Maki, Mark O Maxson, John E. Sheets, II
-
Patent number: 7667487Abstract: A circuit assembly includes a functional chip and a first capacitor. The functional chip includes a first logic island and a second logic island. The first capacitor is configured to be selectively coupled (e.g., at different times) to a first power supply terminal of the first logic island and a second power supply terminal of the second logic island.Type: GrantFiled: January 10, 2008Date of Patent: February 23, 2010Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson
-
Publication number: 20100026326Abstract: A method, program product and apparatus include resistance structures positioned proximate security sensitive microchip circuitry. Alteration in the position, makeup or arrangement of the resistance structures may be detected and initiate an action for defending against a reverse engineering or other exploitation effort. The resistance structures may be automatically and selectively designated for monitoring. Some of the resistance structures may have different resistivities. The sensed resistance may be compared to an expected resistance, ratio or other resistance-related value. The structures may be intermingled with false structures, and may be overlapped or otherwise arranged relative to one another to further complicate unwelcome analysis.Type: ApplicationFiled: July 29, 2008Publication date: February 4, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gerald K. Bartley, Darryl J. Becker, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson, John E. Sheets, II
-
Publication number: 20100026313Abstract: Apparatus, method and program product may detect an attempt to tamper with a microchip by detecting an unacceptable alteration in a measured capacitance associated with capacitance structures proximate the backside of a microchip. The capacitance structures typically comprise metallic shapes and may connect using through-silicon vias to active sensing circuitry within the microchip. In response to the sensed change, a shutdown, spoofing, self-destruct or other defensive action may be initiated to protect security sensitive circuitry of the microchip.Type: ApplicationFiled: July 29, 2008Publication date: February 4, 2010Applicant: International Business Machines CorporationInventors: Gerald K. Bartley, Darryl J. Becker, Paul E. Dahlen, Philip R. Germann, Andrew B. Maki, Mark O. Maxson