Patents by Inventor Mark O. Neisser
Mark O. Neisser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070298349Abstract: The present invention relates to a novel antireflective coating composition for forming an underlayer for a photoresist comprising an acid generator and a novel siloxane polymer, where the siloxane polymer comprises at least one absorbing chromophore and at least one self-crosslinking functionality of structure (1), where m is 0 or 1, W and W? are independently a valence bond or a connecting group linking the cyclic ether to the silicon of the polymer and L is selected from hydrogen, W? and W, or L and W? are combined to comprise a cycloaliphatic linking group linking the cyclic ether to the silicon of the polymer. The invention also relates to a process for imaging the photoresist coated over the novel antireflective coating composition and provides good lithographic results. The invention further relates to a novel siloxane polymer, where the siloxane polymer comprises at least one absorbing chromophore and at least one self-crosslinking functionality of structure (1).Type: ApplicationFiled: June 22, 2006Publication date: December 27, 2007Inventors: Ruzhi Zhang, Mark O. Neisser, Woo-Kyu Kim, David J. Abdallah, Francis Houlihan, Ping-Hung Lu, Hong Zhuang
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Patent number: 7264913Abstract: The present invention relates to a novel antireflective coating composition comprising a polymer, a crosslinking agent and an acid generator. The present invention further relates to a process for using the novel composition, particularly at 193 nm. The polymer of the present invention contains at least one unit selected from structures 1, 2 and 3, where, Y is a hydrocarbyl linking group of 1 to about 10 carbon atoms, R, R1, R? and R? are independently hydrogen, hydrocarbyl group of 1 to about 10 carbon atoms, halogen, —O(CO)Z, —C(CF3)2Z, —C(CF3)2(CO)OZ, —SO2CF3, —(CO)OZ, —SO3Z, —COZ, —OZ, —NZ2, —SZ, —SO2Z, —NHCOZ, —NZCOZ or —SO2NZ2, where Z is H or a hydrocarbyl group of 1 to about 10 carbon atoms, n=1–4, X is O, CO, S, COO, CH2O, CH2COO, SO2, NH, NL, OWO, OW, W, and where L and W are independently hydrocarbyl groups of 1 to about 10 carbon atoms, and m=0–3.Type: GrantFiled: November 21, 2002Date of Patent: September 4, 2007Assignee: AZ Electronic Materials USA Corp.Inventors: Hengpeng Wu, Shuji Ding-Lee, Zhong Xiang, Joseph E. Oberlander, Mark O. Neisser, Eleazar Gonzalez, Jainhui Shan
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Patent number: 7081511Abstract: The present invention relates to a process for making a polyester where a dianhydride is reacted with a diol. The resulting polyester can be further reacted with a compound selected from aromatic oxides, aliphatic oxides, alkylene carbonates, alcohols, and mixtures thereof.Type: GrantFiled: April 5, 2004Date of Patent: July 25, 2006Assignee: AZ Electronic Materials USA Corp.Inventors: Hengpeng Wu, Jianhui Shan, Shuji Sue Ding-Lee, Zhong Xhiang, Eleazor B. Gonzalez, Mark O. Neisser
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Patent number: 7070914Abstract: Disclosed is a process for forming an image on a substrate, comprising the steps of: (a) coating on the substrate a first layer of a radiation sensitive, antireflective composition; (b) coating a second layer of a photoresist composition onto the first layer of the antireflective composition; (c) selectively exposing the coated substrate from step (b) to actinic radiation; and (d) developing the exposed coated substrate from step (c) to form an image; wherein both the photoresist composition and the antireflective composition are exposed in step (c); both are developed in step (d) using a single developer; wherein the antireflective composition of step (a) is a first minimum bottom antireflective coating (B.A.R.C.) composition, having a solids content of up to about 8% solids, and a maximum coating thickness of the coated substrate of ? 2 ? n wherein ? is the wavelength of the actinic radiation of step (c) and n is the refractive index of the B.A.R.C. composition.Type: GrantFiled: January 9, 2002Date of Patent: July 4, 2006Assignee: AZ Electronic Materials USA Corp.Inventors: Mark O. Neisser, Joseph E. Oberlander, Medhat A. Toukhy, Raj Sakamuri, Shuji Ding-Lee
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Patent number: 6844131Abstract: The present invention relates to a novel absorbing, photoimageable and aqueous developable positive-working antireflective coating composition comprising a photoacid generator and a polymer comprising at least one unit with an acid labile group and at least one unit with an absorbing chromophore. The invention further relates to a process for using such a composition. The present invention also relates to a novel absorbing, photoimageable and aqueous alkali developable positive-working antireflective coating composition comprising a polymer comprising at least one unit with an acid labile group, a dye and a photoacid generator. The invention further relates to a process for using such a composition. The invention also relates to a novel process for forming a positive image with a positive photoresist and a novel photoimageable and aqueous developable positive-working antireflective coating composition, where the antireflective coating comprises a polymer comprising an acid labile group.Type: GrantFiled: January 9, 2002Date of Patent: January 18, 2005Assignee: Clariant Finance (BVI) LimitedInventors: Joseph E. Oberlander, Ralph R. Dammel, Shuji Ding-Lee, Mark O. Neisser, Medhat A. Toukhy
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Patent number: 6800415Abstract: The invention relates to a novel negative, aqueous photoresist composition comprising a polyvinylacetal polymer, a water-soluble photoactive compound and a crosslinking agent. The water-soluble photoactive compound is preferably a sulfonium salt. The invention also relates to forming a negative image from the novel photoresist composition.Type: GrantFiled: September 28, 2001Date of Patent: October 5, 2004Assignee: Clariant Finance (BVI) LtdInventors: Ping-Hung Lu, Mark O. Neisser, Ralph R. Dammel, Hengpeng Wu
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Publication number: 20040101779Abstract: The present invention relates to a novel antireflective coating composition comprising a polymer, a crosslinking agent and an acid generator. The present invention further relates to a process for using the novel composition, particularly at 193 nm.Type: ApplicationFiled: November 21, 2002Publication date: May 27, 2004Inventors: Hengpeng Wu, Shuji Ding-Lee, Zhong Xiang, Joseph E. Oberlander, Mark O. Neisser, Eleazar Gonzalez, Jainhui Shan
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Publication number: 20030215736Abstract: The present invention relates to novel negative-working, photoimageable, and aqueous developable antireflective coating compositions and their use in image processing by forming a thin layer of the novel antireflective coating composition between a reflective substrate and a photoresist coating. The negative bottom photoimageable antireflective coating composition is capable of being developed in an alkaline developer and is coated below a negative photoresist.Type: ApplicationFiled: December 18, 2002Publication date: November 20, 2003Inventors: Joseph E. Oberlander, Ralph R. Dammel, Shuji Ding-Lee, Mark O. Neisser, Medhat A. Toukhy
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Publication number: 20030129531Abstract: The present invention relates to a novel absorbing, photoimageable and aqueous developable positive-working antireflective coating composition comprising a photoacid generator and a polymer comprising at least one unit with an acid labile group and at least one unit with an absorbing chromophore. The invention further relates to a process for using such a composition. The present invention also relates to a novel absorbing, photoimageable and aqueous alkali developable positive-working antireflective coating composition comprising a polymer comprising at least one unit with an acid labile group, a dye and a photoacid generator. The invention further relates to a process for using such a composition. The invention also relates to a novel process for forming a positive image with a positive photoresist and a novel photoimageable and aqueous developable positive-working antireflective coating composition, where the antireflective coating comprises a polymer comprising an acid labile group.Type: ApplicationFiled: January 9, 2002Publication date: July 10, 2003Inventors: Joseph E. Oberlander, Ralph R. Dammel, Shuji Ding-Lee, Mark O. Neisser, Medhat A. Toukhy
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Publication number: 20030129547Abstract: Disclosed is a process for forming an image on a substrate, comprising the steps of: (a) coating on the substrate a first layer of a radiation sensitive, antireflective composition; (b) coating a second layer of a photoresist composition onto the first layer of the antireflective composition; (c) selectively exposing the coated substrate from step (b) to actinic radiation; and (d) developing the exposed coated substrate from step (c) to form an image; wherein both the photoresist composition and the antireflective composition are exposed in step (c); both are developed in step (d) using a single developer; wherein the antireflective composition of step (a) is a first minimum bottom antireflective coating (B.A.R.C.Type: ApplicationFiled: January 9, 2002Publication date: July 10, 2003Inventors: Mark O. Neisser, Joseph E. Oberlander, Medhat A. Toukhy, Raj Sakamuri, Shuji Ding-Lee
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Publication number: 20030077539Abstract: The invention relates to a novel negative, aqueous photoresist composition comprising a polyvinylacetal polymer, a water-soluble photoactive compound and a crosslinking agent. The water-soluble photoactive compound is preferably a sulfonium salt. The invention also relates to forming a negative image from the novel photoresist composition.Type: ApplicationFiled: September 28, 2001Publication date: April 24, 2003Inventors: Ping-Hung Lu, Mark O. Neisser, Ralph R. Dammel, Hengpeng Wu
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Patent number: 6346979Abstract: A process and apparatus for dynamically adjusting the exposure dose on a photosensitive coating at a localized area within an exposure field in a step-and-scan lithography system. The process and apparatus form a pattern on a photosensitive substrate, such as used in the integrated circuit manufacturing industry. The exposure dose is adjusted at a localized area by a segmented slit system or an array of light-transmitting pixels located across the exposure field. The slit segments or individual pixels are automatically controlled in response to data obtained regarding the uniformity of the projection optics system or the mask pattern.Type: GrantFiled: March 17, 1999Date of Patent: February 12, 2002Assignee: International Business Machines CorporationInventors: Christopher P. Ausschnitt, Scott M. Mansfield, Mark O. Neisser, Christopher D. Wait
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Patent number: 5795685Abstract: A method and apparatus for correcting defects in a phase shift mask to be used in photolithography. More specifically, the method of the invention includes creating a second repair mask which contains phase shifters. Regions surrounding the defects on the first mask are made opaque. The design circuitry located in these defective regions is copied onto the second mask. During a second exposure the design circuitry is placed onto the semiconductor wafer. Therefore, this method and apparatus provides an inexpensive solution to a difficult problem.Type: GrantFiled: January 14, 1997Date of Patent: August 18, 1998Assignee: International Business Machines CorporationInventors: Lars W. Liebmann, Burn Jeng Lin, Mark O. Neisser
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Patent number: 5563012Abstract: The preferred embodiment of the present invention is a method of enhancing normally unenhanced features types. Pattern shapes are placed on two or more relatively simple, modified masks instead of using a single mask containing diverse feature types. On these modified masks, (hereinafter "overlay masks"), all of the features are the type normally enhanced. A composite pattern is printed into photoresist through successive exposure to the overlay masks.Type: GrantFiled: June 30, 1994Date of Patent: October 8, 1996Assignee: International Business Machines CorporationInventor: Mark O. Neisser
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Patent number: 5337475Abstract: Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.Type: GrantFiled: December 17, 1992Date of Patent: August 16, 1994Assignee: International Business Machines CorporationInventors: Farid Y. Aoude, Emanuel I. Cooper, Peter R. Duncombe, Shaji Farooq, Edward A. Giess, Young-Ho Kim, Sarah H. Knickerbocker, Friedel Muller-Landau, Mark O. Neisser, Jae M. Park, Robert R. Shaw, Robert A. Rita, Thomas M. Shaw, Rao Vallabhaneni, Jon A. Van Hise, George F. Walker, Jungihl Kim, James M. Brownlow, deceased
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Patent number: 5283104Abstract: Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.Type: GrantFiled: March 20, 1991Date of Patent: February 1, 1994Assignee: International Business Machines CorporationInventors: Farid Y. Aoude, Emanuel I. Cooper, Peter R. Duncombe, Shaji Farooq, Edward A. Giess, Young-Ho Kim, Sarah H. Knickerbocker, Friedel Muller-Landau, Mark O. Neisser, Jae M. Park, Robert R. Shaw, Robert A. Rita, Thomas M. Shaw, Rao Vallabhaneni, Jon A. Van Hise, George F. Walker, Jungihl Kim, James M. Brownlow, deceased
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Patent number: 5213704Abstract: A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.Type: GrantFiled: September 13, 1991Date of Patent: May 25, 1993Assignee: International Business Machines CorporationInventors: Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark O. Neisser, Harbans S. Sachdev, Mark A. Takacs
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Patent number: 5094769Abstract: A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.Type: GrantFiled: May 13, 1988Date of Patent: March 10, 1992Assignee: International Business Machines CorporationInventors: Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark O. Neisser, Harbans S. Sachdev, Mark A. Takacs
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Patent number: 4663186Abstract: Disclosed is a screening paste for covering a selected portion of a metallurgical pattern on a substrate while leaving other metallurgy uncovered. The paste is free of polymers and consists, in one example, of 75-80% of a ceramic particulate (such as alumina), 2-8% amorphous fumed silica and 15-20% of linear alcohol. The linear alcohol serves as a vehicle to deliver the solid particles in the paste. In use, after covering the selected portion of the metallurgical pattern with the paste, the alcohol content therein is expelled by subjecting to vacuum treatment at room temperature or heating to a low temperature below about 275.degree. C. thereby obtaining an inert, dry and crack-free protective coating. Upon evaporation of a new metal layer onto the substrate and removal of the protective coating and new metal layer from everywhere except the uncovered metallurgy, the metallurgical pattern is selectively coated with the new metal.Type: GrantFiled: April 24, 1986Date of Patent: May 5, 1987Assignee: International Business Machines CorporationInventors: Richard F. Indyk, Francisco J. Lamelas, Mark O. Neisser