Patents by Inventor Mark R. Jones
Mark R. Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6929404Abstract: A connector for making an optical connection underwater or in a wet environment, including first and second connector parts adapted to be interengaged, the first connector part having a probe and the second connector part having a chamber containing fluid media. The probe has a forward portion for entry into the chamber of the second part containing fluid media during interengagement of the connector parts, so that when the connector parts are interengaged the probe provides an optical path between the first connector part and the chamber of the second connector part and passing into the chamber of the second connector part at a slant to the axial direction. The probe slides axially through the opening in sliding engagement with a seal and continues to do so as the forward portion of the probe advances into the chamber containing fluid media.Type: GrantFiled: October 31, 2001Date of Patent: August 16, 2005Assignee: Tronic LimitedInventors: Mark R. Jones, Gillian A. McKinnon
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Publication number: 20040151628Abstract: A system is described for automatic retrieval of microplates from a carousel. The system includes an effector arm that retrieves a selected microplate from the carousel, a microplate retainer that receives the selected microplate from the effector arm, and a controller that directs the effector arm to the carousel for retrieval of the selected microplate and directs the effector arm to the microplate retainer so that it may receive the selected microplate. The carousel may revolve around a vertical axis. A system also is described for washing depositing elements used to spot biological materials on a substrate. Graphical user interfaces also are described for enabling a user to determine which microplates will be used to provide biological probe materials, and in what patterns those probe materials should be deposited on the substrate. The interfaces enable the user to place multiple fractions of biological materials on a same location on a substrate.Type: ApplicationFiled: November 1, 2003Publication date: August 5, 2004Inventors: Peter D Honkanen, Timothy J Woolaver, Eric D McKenzie, David P Bradbury, Mark R Jones
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Patent number: 6561268Abstract: An underwater or severe environment electrical connector, in which first and second connector parts are brought together in longitudinal alignment to establish electrical contact between respective contact portions of the first and second connector parts. The connector parts are relatively rotatable about a longitudinal axis when the connector parts are disconnected, and the contact portions are laterally spaced from the longitudinal axis and arranged to make electrical contact when the connector parts are connected, irrespective of the relative rotational positions of the first and second connector parts about the longitudinal axis.Type: GrantFiled: July 5, 2001Date of Patent: May 13, 2003Assignee: Tronic LimitedInventor: Mark R. Jones
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Patent number: 6548756Abstract: A packaging and interconnection for connecting a contact structure to an outer component. The packaging and interconnection is formed of a contact structure mounted on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end and provided with a contact pad at another end, a print circuit board (PBS) pad provided on a PCB board substrate, a conductive lead for electrically connecting an upper surface of the contact pad and the connector, an elastomer provided under contact substrate, and a support structure provided between the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof.Type: GrantFiled: January 18, 2001Date of Patent: April 15, 2003Assignee: Advantest Corp.Inventors: Mark R. Jones, Theodore A. Khoury
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Patent number: 6534710Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection is formed of a contact structure mounted on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end and provided with a contact pad at another end, a connector for establishing electrical connection with the contact pad on the contact trace, a conductive lead for electrically connecting an upper surface of the contact pad and the connector, an elastomer provided under said contact substrate, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof.Type: GrantFiled: January 18, 2001Date of Patent: March 18, 2003Assignee: Advantest Corp.Inventors: Mark R. Jones, Theodore A. Khoury
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Patent number: 6472890Abstract: A method of producing a contact structure for electrical communication with a contact target. The method includes the steps of providing a silicon substrate cut in a (100) crystal plane, applying a first photolithography process on an upper surface of the silicon substrate for forming an etch stop layer, forming a first insulation layer on the etch stop layer, forming a second insulation layer on a bottom surface of the silicon substrate, applying a second photolithography process on the second insulation layer for forming an etch window, performing an anisotropic etch on the silicon substrate through the etch window for forming a base portion of a contactor, depositing conductive material on the first insulation layer for forming a conductive layer in a beam shape projected from the base portion, and mounting a plurality of contactors produced in the foregoing steps on a contact substrate in predetermined diagonal directions.Type: GrantFiled: January 28, 2002Date of Patent: October 29, 2002Assignee: Advantest, Corp.Inventors: Theodore A. Khoury, Mark R. Jones, James W. Frame
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Patent number: 6466043Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and projected from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a contact beam is created by the insulation layer and the conductive layer. The contact beam exhibits a spring force in a transversal direction of the contact beam to establish a contact force when the tip of the beam portion pressed against a contact target.Type: GrantFiled: January 28, 2002Date of Patent: October 15, 2002Assignee: Advantest Corp.Inventors: Theodore A. Khoury, Mark R. Jones, James W. Frame
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Patent number: 6452407Abstract: A probe contactor is formed on a planar surface of a substrate by a photolithography technology. The probe contactor is configured by a substrate having an interconnect trace thereon which is an electric conductive path, and a contactor formed on the substrate through a photolithography process. The contactor has a base portion vertically formed on the substrate, a horizontal portion, one end of which is formed on the base portion, and a contact portion formed on another end of the horizontal portion. A spring force of the horizontal portion of the contactor provides a contact force when the probe contactor is pressed against a contact target. The contact portion of the contactor is sharpened so that when the contactor is pressed against the contact target, it scrubs a surface of the contact target.Type: GrantFiled: December 18, 2000Date of Patent: September 17, 2002Assignee: Advantest Corp.Inventors: Theodore A. Khoury, Mark R. Jones, R. Keith Lee
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Patent number: 6453345Abstract: A network security and surveillance system passively monitors and records the traffic present on a local area network, wide area network, or other type of computer network, without interrupting or otherwise interfering with the flow of the traffic. Raw data packets present on the network are continuously routed (with optional packet encryption) to a high-capacity data recorder to generate low-level recordings for archival purposes. The raw data packets are also optionally routed to one or more cyclic data recorders to generate temporary records that are used to automatically monitor the traffic in near-real-time. A set of analysis applications and other software routines allows authorized users to interactively analyze the low-level traffic recordings to evaluate network attacks, internal and external security breaches, network problems, and other types of network events.Type: GrantFiled: May 7, 1997Date of Patent: September 17, 2002Assignee: Datadirect Networks, Inc.Inventors: Milan V. Trcka, Kenneth T. Fallon, Mark R. Jones, Ronald W. Walker
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Patent number: 6420884Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed of contact beams and a contact substrate. The contact beam is configured by a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer having a planar shape and formed on the silicon base and projected from the inclined support, and a conductive layer having a planar shape and made of conductive material formed on one surface of the insulation layer so that a beam portion is created by the insulation layer and the conductive layer. The insulation layer and the conductive layer have substantially the same length. The beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.Type: GrantFiled: January 29, 1999Date of Patent: July 16, 2002Assignee: Advantest Corp.Inventors: Theodore A. Khoury, Mark R. Jones, James W. Frame
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Publication number: 20020089343Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.Type: ApplicationFiled: January 28, 2002Publication date: July 11, 2002Applicant: Advantest Corp.Inventors: Theodore A. Khoury, Mark R. Jones, James W. Frame
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Publication number: 20020089322Abstract: A high density connector that connects devices under test and a test head that includes coaxial cable connectors on a first end, and connection points located on a male connector portion at a second end, with a waveguide member connecting respective cable connectors and connection points to create a communication pathway having an isolated ground and a 1:1 signal-to-ground ratio. The connector is a PCB, with the waveguides being in a ground-signal-ground configuration with a signal distance between adjacent waveguides being 0.2 inches or less. The coaxial cable connections are modular, allowing cables from the devices under test to be plugged without soldering. This non-solder connection also allows the cables to be unplugged and replugged as necessary. The male connector portion is connected to a female low insertion force connector on the test head in order to complete the connection between the devices under test and the test head.Type: ApplicationFiled: January 11, 2001Publication date: July 11, 2002Inventors: James Warren Frame, Mark R. Jones
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Publication number: 20020089342Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.Type: ApplicationFiled: January 28, 2002Publication date: July 11, 2002Applicant: Advantest Corp.Inventors: Theodore A. Khoury, Mark R. Jones, James W. Frame
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Patent number: 6384616Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection includes a contact structure made of conductive material and formed on a contact substrate, a contact trace formed on the contact substrate and connected to the contact structure, a contact pad formed on a bottom surface of the contact substrate and connected to the contact structure through a via hole and the contact trace, a contact target provided at an outer periphery of the contact structure to be electrically connected with the contact pad, and a conductive member for connecting the contact pad and the contact target.Type: GrantFiled: August 13, 2001Date of Patent: May 7, 2002Assignee: Advantest Corp.Inventors: Mark R. Jones, Theodore A. Khoury
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Publication number: 20020027444Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.Type: ApplicationFiled: August 13, 2001Publication date: March 7, 2002Applicant: Advantest Corp.Inventors: Mark R. Jones, Theodore A. Khoury
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Publication number: 20020024348Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.Type: ApplicationFiled: August 13, 2001Publication date: February 28, 2002Applicant: Advantest Corp.Inventors: Mark R. Jones, Theodore A. Khoury
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Patent number: 6351133Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection includes a contact structure made of conductive material and formed on a contact substrate, a contact trace horizontally extended on the contact substrate and connected to the contact structure, a contact pad formed on a bottom surface of the contact substrate remote from the contact structure, a contact target provided at an outer periphery of the contact structure in a side-by-side fashion to be electrically connected with the contact pad, a conductive lead for electrically connecting the contact pad and the contact target, an elastomer for achieving flexibility, and a support structure for supporting the contact structure, contact substrate and elastomer.Type: GrantFiled: March 31, 1999Date of Patent: February 26, 2002Assignee: Adoamtest Corp.Inventors: Mark R. Jones, Theodore A. Khoury
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Publication number: 20020014336Abstract: An underwater or severe environment electrical connector, comprising first and second connector parts which are to be brought together in longitudinal alignment to establish electrical contact between respective contact portions of the first and second connector parts, the connector parts being relatively rotatable about a longitudinal axis when the connector parts are disconnected, and the contact portions being laterally spaced from said longitudinal axis and being arranged to make said electrical contact when the connector parts are connected, irrespective of the relative rotational positions of the first and second connector parts about said longitudinal axis.Type: ApplicationFiled: July 5, 2001Publication date: February 7, 2002Inventor: Mark R. Jones
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Publication number: 20010026166Abstract: A probe contactor for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contactor is formed of a substrate having an interconnect trace thereon which is an electric conductive path, and a contactor formed on the substrate through a photolithography process. The contactor has a base portion vertically formed on the substrate, a horizontal portion, one end of which is formed on the base portion, and a contact portion formed on another end of the horizontal portion. A spring force of the horizontal portion of the contactor provides a contact force when the probe contactor is pressed against the device to be tested.Type: ApplicationFiled: December 18, 2000Publication date: October 4, 2001Inventors: Theodore A. Khoury, Mark R. Jones, R. Keith Lee
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Patent number: 6297164Abstract: A production method for forming contact structures on a planar surface of a substrate and removing therefrom to mount the contact structures on a contact substrate. The contact structure is formed of a base beam which is attached to a surface of the contact substrate in a vertical direction, a horizontal beam which is connected to the base beam at one end, and a top beam formed on another end of the horizontal beam and is oriented in the vertical direction. The production method includes the steps of forming a sacrificial layer on a silicon substrate, forming, exposing and developing a photoresist layer, depositing conductive material on the photoresist layer to form the contact structures, and removing the photoresist layer and the sacrificial layer to separate the contact structures from the silicon substrate.Type: GrantFiled: November 30, 1998Date of Patent: October 2, 2001Assignee: Advantest Corp.Inventors: Theodore A. Khoury, Mark R. Jones, James W. Frame