Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is provided with a contact pad for establishing packaging and interconnection from an upper surface thereof, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is provided with a contact pad for establishing packaging and interconnection from an upper surface thereof, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component with a short signal pass length to achieve a high frequency operation.

Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component with a short signal pass length to achieve a high frequency operation. The packaging and interconnection is formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is extended toward an edge of the contact substrate, a connection target provided at an outer periphery of the contact structure to be electrically connected with the other end of the contact trace, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between for supporting the contact structure, the contact substrate and the elastomer.

Abstract: A high performance IC package provides high density electrical interconnection and packaging for a high speed and high bandwidth IC chip and is easily connected to or disconnected from a printed circuit board. The IC package includes an enclosure; an integrated circuit chip having a front face and a back face wherein the back face is attached to an inner ceiling of the enclosure; contacts formed on die pads on the front face through a photolithography process where each of the contacts has a base portion vertically formed on the die pad, a horizontal portion whose one end is formed on the base portion, and a contact portion vertically formed on another end of the horizontal portion; and an encapsulant provided on the front face of the integrated circuit chip for air tightly sealing. The contacts are projected through the encapsulant, and the horizontal portion of each of the contacts produces a contact force when the contact is pressed against a contact target.

Abstract: A production method for forming contact structures on a planar surface of a substrate.

Abstract: A controller of the cross sectional area and shape of an X-ray beam includes two or more disks disposed in the center of the path of the beam, each disk being radio-opaque except for a window centered on the beam. One or more of the disks has a tracks at each side of the window in which shutters can slide between positions in which they close or open the window and select the size and shape of the X-ray beam passed through the controller and a subject to an image intensifier or other X-ray utilization device. One of the disks has a cam track which is engaged by a cam following element attached to a shutter on the other disk. The disks are mounted for relative rotation by drive motors which causes the shutter with the cam follower to change position and alter the size or shape of the transmitted beam cross section. With the shutter in desired position the disks can be rotated together to reorient the shaped beam around its central axis.

Abstract: Although known because of high packaging inductances and thought to be wholly unsuitable for RF amplifiers, high voltage power switching MOSFETs of the type having coplanar leads having inductances on the order of between 8 nH and 15 nH are used in an RF amplifier. The individual devices operate on a high impedance load line to render the high inductance insignificant. The circuit configuration presents a high impedance to the output, eliminating the need for expensive combiners and low inductance packaging.

Abstract: An expandable mandrel for mounting a core for winding, in which inner elements are moved inwardly by a floating screw to cam outer elements outwardly to grip the core. The screw is not fixed in the axial direction. Each of the inner elements has a tapered surface slidably positioned in operative relationship with an opposed tapered surface on each of the outer elements. As the inner elements move inwardly the sliding contact of these tapered surfaces cam the outer elements into gripping contact with the inner surface of the core.