Abstract: An automated one touch cooker device that automatically cooks food items in a pot and the same pot can be used as a serving container. The automated one touch cooker comprises of a cooking vessel, a water reservoir and a body frame wherein the cooking vessel is used for cooking a food item, the water reservoir holds fresh water for cooking, and the body frame houses the water reservoir and the cooking vessel. The body frame further holds a water pump, a water heater, and other elements required to run the cooker device.

Abstract: A vented campfire tarp is provided that includes a base portion and a plurality of vents formed in the base portion, wherein each vent allows for air, smoke, and carbon dioxide to pass through the vent from one side of the base portion to the other. The vented campfire tarp also includes securing devices to couple the base portion to a ground surface over a campfire. In use, the vented campfire tarp covers a campfire and controls a burn rate of wood of the campfire in response to controlling airflow through the plurality of vents of the vented campfire tarp.

Abstract: An instrument panel having a deployable cover for an airbag module, the instrument panel including: a substrate layer with a tear seam formed therein; a bi-laminate layer comprising a foam layer and an outer layer with a tear seam formed therein, the tear seam of the bi-laminate layer of being aligned with the tear seam of the substrate layer, wherein the substrate layer and the bi-laminate layer are secured to each other and wherein the tear seam of the substrate layer and the tear seam of the bi-laminate layer are each separately formed prior to the substrate layer and the bi-laminate layer being secured to each other.

Abstract: Deicing compositions are described for reducing an amount of ice formed on a surface. The deicing compositions may include about 1 wt. % to about 15 wt. % of a salt of citric acid. The compositions may further include about 23 wt. % to about 28 wt. % sodium chloride when the deicing composition forms an aqueous solution.

Abstract: Apparatuses, systems and methods for effective cooling of electronic devices are presented herein. More specifically, embodiments of the present invention comprise one or more heat pipes thermally coupled to electronic components and to a first heat sink and a second heat sink. The heat pipes are constructed to transfer heat generated at the one or more electronic components to the first heat sink and to the second heat sink. The first heat sink is operable to transfer heat energy to the ambient air using dissipation or advection. The second heat sink is able to transfer heat energy to the ambient air using dissipation. A controller is operable to switch between a passive mode of operation and an active mode of operation.

Abstract: A cyclone apparatus for separating a mixture containing at least one fluid and a further constituent based on the densities of the mixture constituents. The apparatus includes a first hollow pressure vessel having an overflow plate positioned at an overflow end of the first hollow pressure vessel and an end plate for sealing the overflow plate. The cyclone apparatus also comprises an underflow plate positioned at an under-flow end of the first hollow pressure vessel and a hollow pressure vessel with one end being sealed against the under-flow plate and another end being closed. The overflow plate and the end plate are shaped such that when they are brought together they form separate adjacent overflow compartments between them. The underflow plate and the second hollow pressure vessel are shaped such that when they are brought together they form separate adjacent under-flow compartments between them which correspond to the overflow compartments.

Abstract: Apparatuses, systems and methods for effective cooling of electronic devices are presented herein. More specifically, embodiments of the present invention comprise one or more heat pipes thermally coupled to electronic components and to a first heat sink and a second heat sink. The heat pipes are constructed to transfer heat generated at the one or more electronic components to the first heat sink and to the second heat sink. The first heat sink is operable to transfer heat energy to the ambient air using dissipation or advection. The second heat sink is able to transfer heat energy to the ambient air using dissipation. A controller is operable to switch between a passive mode of operation and an active mode of operation.

Abstract: A disk drive data storage system comprising at least one data storage disk and a sensor assembly proximate the data storage disk. The sensor assembly further comprises circuitry for writing data to the data storage disk and circuitry for reading data from the data storage disk. The system also comprises circuitry for controlling the circuitry for reading data during different time periods so that the circuitry for reading data consumes different levels of power while the circuitry for writing data is writing data to the data storage disk.

Abstract: Cooling systems for computers are disclosed. In particular, embodiment of such cooling solutions may effectively be used in conjunction with mobile computers that have a polymer (or other type of) chassis. More specifically, embodiments of the present invention use micro vapor plates to conduct the heat generated by one or more electronic components of a mobile computer to the chassis of the mobile computer such that the heat from the electronic components is conducted into, and spread over, at least a portion of the surface of the chassis. The mobile computer can then be cooled by convection or radiation.

Abstract: An instrument panel having a deployable cover for an airbag module, the instrument panel including: a substrate layer with a tear seam formed therein; a bi-laminate layer comprising a foam layer and an outer layer with a tear seam formed therein, the tear seam of the bi-laminate layer of being aligned with the tear seam of the substrate layer, wherein the substrate layer and the bi-laminate layer are secured to each other and wherein the tear seam of the substrate layer and the tear seam of the bi-laminate layer are each separately formed prior to the substrate layer and the bi-laminate layer being secured to each other.

Abstract: A cyclone apparatus for separating a mixture containing at least one fluid and a further constituent based on the densities of the mixture constituents, the apparatus comprising a first hollow pressure vessel open at each end, having at least one inlet located on its body, an overflow plate positioned at an overflow end of the first hollow pressure vessel, an end plate for sealing the overflow plate. The cyclone apparatus also comprises an underflow plate positioned at an under-flow end of the first hollow pressure vessel and a hollow pressure vessel with one end being sealed against the under-flow plate and another end being closed. The overflow plate and under-flow plate are both provided with through holes for supporting, in use, cyclone liners which pass there through, each cyclone liner having an inlet located between the overflow and underflow plate.

Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.

Abstract: A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

Abstract: A circuit module includes a printed circuit board (PCB) having a first side, a second side, and a bottom perimeter edge. The PCB exhibits a first thickness along the bottom perimeter edge. The first side includes a recessed area and, in that recessed area, the PCB has a second thickness that is less than the first thickness. A plurality of integrated circuits (ICs) are fixed to the PCB in the recessed area. A plurality of module contacts are connected to the ICs and are disposed along at least one of the first and second sides and are configured to provide electrical connection between the circuit module and an edge connector.

Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.

Abstract: A disk drive data storage system comprising at least one data storage disk and a sensor assembly proximate the data storage disk. The sensor assembly further comprises circuitry for writing data to the data storage disk and circuitry for reading data from the data storage disk. The system also comprises circuitry for controlling the circuitry for reading data during different time periods so that the circuitry for reading data consumes different levels of power while the circuitry for writing data is writing data to the data storage disk.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.