Abstract: A polymer hybrid material, a film comprising the polymer hybrid material, the use of the polymer hybrid material, a splitting method using the polymer hybrid material, and a method for producing the polymer hybrid material are provided for increasing the total yield, i.e. the efficiency with respect to the raw materials used and other resources such as energy and workforce, of a splitting method. The polymer hybrid material for use in a splitting method has at least two solid-body sections produced from a solid-body starting material. The polymer hybrid material comprises a polymer matrix and a first filler and a second filler embedded into the polymer matrix.

Abstract: A method and apparatus are provided. In an example, a volume portion of the solid body is exposed to light waves of different wavelengths, wherein the light waves are partly reflected at surfaces of the solid body. Light parameters of the reflected light waves are at least partly acquired using a sensor device. Distance information and/or intensity information are/is ascertained from at least a portion of the acquired light parameters. A thickness and/or a transmittance of the solid body in the volume portion are/is determined based upon the distance information and/or the intensity information. Laser radiation is introduced into the volume portion to produce a modification in the interior of the solid body, wherein at least one laser parameter of the laser radiation is set at least depending on the thickness and/or the transmittance such that the modification is at a predefined distance from a surface of the solid body.

Abstract: The invention relates to a production facility (40) for detaching wafers (2) from donor substrates (4).

Abstract: The present invention relates to a method, according to claim 1, for separating at least one solid body layer (1), particularly a solid body disk, from a donor substrate (2).

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The present invention relates to a method for separating at least one solid-body layer (4) from at least one solid body (1). Thereby, the method as claimed in the invention comprises the steps: creating a plurality of modifications (9) by means of laser beams within the interior space of the solid body (1) to form a detachment plane (8), producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid body (1), wherein the exposed surface (5) is an integral part of the solid-body layer (4) to be separated, introducing an external force into the solid body (1) for generating tensions within the solid body (1), wherein the external force is so strong that the tensions initialize a crack propagation along the detachment plane (8), wherein the modifications for forming the detachment plane (8) are created before producing the composite structure.

Abstract: A method includes: providing a semiconductor body having a generation plane and crystal lattice planes which intersect the generation plane at intersecting lines; generating modifications in the semiconductor body by multiphoton excitation and which are spaced apart from one another, the modifications altering a physical property of the semiconductor body so as to form subcritical cracks in the generation plane; and separating a solid-state layer from the semiconductor body by connecting the subcritical cracks in the generation plane.

Abstract: The present invention relates to a method for creating modifications in a solid state, wherein a crack guidance region for guiding a crack for separating a solid-state portion, in particular a solid-state layer, from the solid state body, is predetermined by the modifications. The method according to the invention preferably comprises the steps: Moving the solid state (1) relative to a laser processing system, then generating a plurality of laser beams by means of the laser processing system for creating at least one modification, wherein the laser processing system is adjusted for defined focusing of the laser beams continuously as a function of a plurality of parameters, in particular at least two parameters.

Abstract: A method for producing microcracks in an interior of a composite structure includes: providing or producing the composite structure which has a solid body and at least one metallic coating and/or electrical components situated or provided on one side of the solid body, the solid body containing or being made of silicon carbide (SiC); and producing modifications in the interior of the solid body. Laser radiation is introduced into a flat surface of the solid body to cause multiphoton excitation which brings about plasma generation. The modifications are effected by the plasma in the form of a material transformation which generates compressive stresses in the solid body, thereby developing subcritical cracks in a surrounding area of a particular modification. The laser radiation is introduced into the solid body in pulses having an intensity which reaches a maximum within 10 ns after a start of a particular pulse.

Abstract: The present invention relates to a method for generating control data for the secondary machining of a solid body (1), in particular wafer, which is modified by means of laser beams (10). The interior of said solid body (1) has multiple modifications (12), said modifications (12) having been produced by means of laser beams (10).

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the center (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The invention relates to a method for detaching at least one solid body layer (14) from a solid body (1), wherein by means of the modifications (2) a crack guiding region (4) is provided for guiding a crack in order to detach a solid body portion (6), in particular a solid body layer, from the solid body (1).

Abstract: A polymer hybrid material, a film comprising the polymer hybrid material, the use of the polymer hybrid material, a splitting method using the polymer hybrid material, and a method for producing the polymer hybrid material are provided for increasing the total yield, i.e. the efficiency with respect to the raw materials used and other resources such as energy and workforce, of a splitting method. The polymer hybrid material for use in a splitting method has at least two solid-body sections produced from a solid-body starting material. The polymer hybrid material comprises a polymer matrix and a first filler and a second filler embedded into the polymer matrix.

Abstract: The invention relates to a method for separating solid-body slices (1) from a donor substrate (2).

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The invention relates to an apparatus (1) for treating solid bodies (2). The apparatus according to the invention comprises at least one receiving device (4) having a receiving portion (6) for receiving the solid body (2) and a holding portion (10) for holding the receiving portion (6), wherein the receiving portion (6) can be continuously driven by means of a drive device, a laser device (14) for providing laser beams (16) to generate modifications (18) in the solid body (8) or on a surface (20) of the solid body (2), and an optical system (20) for guiding the laser beams (16), wherein the laser beams (16) can be deflected by means of the optical system (20) such that one or more solid bodies (2) can be impinged by the laser beams (16) at different positions.