Abstract: A method, system, and computer program product for coupled noise timing violation avoidance in detailed routing of an integrated circuit design are provided. The method includes calculating a noise induced timing violation sensitivity (NITVS) metric for nets in the integrated circuit design as a measure of sensitivity to a timing violation relative to a coupled noise delay adder, prioritizing routing isolation as a function of the NITVS metric for each of the nets to avoid coupled noise timing violations, and outputting the routing isolation priority.

Abstract: The invention relates to a method and a system for placing electric circuits in integrated circuit chip design. Specifically, the invention encompasses performing a global placement step (112) placing the cells (11) into bins (12, 14, 16A, 16B) on the chip (10), as well as a detailed placement process (116) which arranges the cells in the bins (12, 14, 16A, 16B) to obtain a legal arrangement while generating simply connected free space (21, 21A, 21B) for routing channels (18?, 26).

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: A design structure for reducing coupling between wires of an electronic circuit is proposed, wherein sets of nets are classified according to their coupling characteristics, and spacing between wires assigned to the sets of nets is chosen according to the coupling characteristics.

Abstract: An integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is substantially axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is substantially axially aligned with the third via. The second, third, and fourth vias, and the third and Fourth wires form a path between the first and second wires redundant to the first via.

Abstract: A routing method for reducing coupling between wires of an electronic circuit is proposed, wherein sets of nets are classified according to their coupling characteristics, and spacing between wires assigned to the sets of nets is chosen according to the coupling characteristics.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: An integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is substantially axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is substantially axially aligned with the third via. The second, third, and fourth vias, and the third and fourth wires form a path between the first and second wires redundant to the first via.

Abstract: The present invention relates to a method for designing fan-out nets connecting a signal source and a plurality of net elements in an integrated circuit. In order to make fan-out nets more robust against opens while keeping the risk due to short circuits in an acceptable degree, the method comprises the steps of: a) implementing a routing section in a closed structure comprising a plurality of signal receiving pins, wherein said receiving pins connect to further net elements, b) implementing on said closed structure a plurality of buffer elements to provide multiple signals derived from said source signal for driving said plurality of net elements, and c) limiting the distance and number of receiving cells between two buffer elements below predetermined values in order to keep a short circuit current given in case of an open tolerably small and within a worst case skew time delay.

Abstract: Embodiments herein provide a method and computer program product for optimizing router settings to increase IC yield. A method begins by reviewing yield data in an IC manufacturing line to identify structure-specific mechanisms that impact IC yield. Next, the method establishes a structural identifier for each structure-specific mechanism, wherein the structural identifiers include wire codes, tags, and/or unique identifiers. Different structural identifiers are established for wires having different widths. Furthermore, the method establishes a weighting factor for each structure-specific mechanism, wherein higher weighting factors are established for structure-specific mechanisms comprising thick wires proximate to multiple thick wires. The method establishes the structural identifiers and the weighting factors for incidence of spacing between single wide lines, double wide lines, and triple wide lines and for incidence of wires above large metal lands.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: Disclosed is a method and system for inserting redundant paths into an integrated circuit. Particularly, the invention provides a method for identifying a single via in a first path connecting two elements, determining if an alternate route is available for connecting the two elements (other than a redundant via), and for inserting a second path into the available alternate route. The combination of the first and second paths provides greater redundancy than inserting a redundant via alone. More importantly, such redundant paths provide for redundancy when congestion prevents a redundant via from being inserted adjacent to the single via. An embodiment of the method further comprises removing the single via and any redundant wire segments, if all of the additional vias used to form the second path can be made redundant.

Abstract: An integrated chip die comprises a data source connected to a data sink by way of a signal path wherein one or more pipeline latches are automatically inserted into the signal path at predetermined intervals when the length of the signal path is greater than a predetermined maximum signal propagation length.

Abstract: A disk prosthesis for cervical vertebrae. The prosthesis includes a spherical cap formed on a first insert, while a spherical cup is formed on a second inset, two inserts made of ceramic material, one of the inserts being mounted on a first plate while the other insert is mounted on a second plate in such a manner that the center of rotation of the joint is substantially centered relative to the edges of the plates, a spherical cup possessing a contact surface area that is not less than that of the spherical cap and being connected via an annular molding to the base of the insert, and a plate provided with the insert having the spherical cap includes an annular setback to leave clearance for the annular molding.

Abstract: A disk prosthesis for cervical vertebrae. The prosthesis includes a spherical cap formed on a first insert, while a spherical cup is formed on a second inset, two inserts made of ceramic material, one of the inserts being mounted on a first plate while the other insert is mounted on a second plate in such a manner that the center of rotation of the joint is substantially centered relative to the edges of the plates, a spherical cup possessing a contact surface area that is not less than that of the spherical cap and being connected via an annular molding to the base of the insert, and a plate provided with the insert having the spherical cap includes an annular setback to leave clearance for the annular molding.