Abstract: An illumination system of a microlithographic projection apparatus includes a spatial light modulator having a modulation surface including a plurality of micromirrors. Each micromirror includes a mirror surface having an orientation that can be changed individually for each micromirror. For at least one of the micromirrors, at least one parameter that is related to the mirror surface is measured. The orientation of the mirror surfaces is controlled depending on the at least one measured parameter. A light pattern is produced on the modulation surface, and an image of the light pattern is formed on an optical integrator that has a plurality of light entrance facets. Images of the light entrance facets are superimposed on a mask.

Abstract: An illumination optical unit for EUV projection lithography illuminates an object field, in which an object to be imaged is arrangeable. A first facet mirror of the illumination optical generates secondary light sources as images of an upstream light source. The first facet mirror includes mirrors which include a mirror surface smaller than 2 mm×2 mm. The first facet mirror is a distance |g| from the light source. The illumination optical unit includes a second facet mirror. The two facet mirrors are a distance b? from each other. The individual mirrors of the first facet mirror have a focal length f in a plane of incidence of the illumination light on the individual mirrors such that [0.1 b?g/(g?b?)]<f<[10 b?g/(g?b?)].

Abstract: An optical system of a microlithographic projection exposure apparatus designed for an operating wavelength of at least 150 nm. In one disclosed aspect, the optical system includes an element (11, 21) producing an angular distribution for light incident during the operation of the optical system and a fly's eye condenser (200, 400, 500) which includes two arrangements (210, 220, 410, 420, 510, 520) following one another in the light propagation direction and made of beam-deflecting optical elements (211-213, 221-223, 411-413, 421-423, 511-513, 521-523), which produce a multiplicity of optical channels. No optical element with refractive power is arranged in the beam path between the element (11, 21) producing an angular distribution and the fly's eye condenser (200, 400, 500).

Abstract: A method is provided for controlling a projection exposure apparatus for microlithography, embodied as a scanner, in the exposure operation, in which a reticle is moved along a scanning axis with respect to a frame of the projection exposure apparatus such that the reticle is scanned by an illumination field radiated thereon, and the radiation of the illumination field is guided onto a wafer after interaction with the reticle in order to generate a desired dose distribution on the wafer. The method comprises the following steps: measuring positional changes of the illumination field in the direction of the scanning axis with respect to the frame of the projection exposure apparatus, and correcting the influence of a measured positional change of the illumination field on the dose distribution on the wafer by modifying at least one operational parameter of the projection exposure apparatus.

Abstract: An illumination system of a microlithographic projection exposure apparatus includes a light source to produce projection light beam, and a first and a second diffractive optical element between the light source and a pupil plane of the illumination system. The diffractive effect produced by each diffractive optical element depends on the position of a light field that is irradiated by the projection light on the diffractive optical elements. A displacement mechanism changes the mutual spatial arrangement of the diffractive optical elements. In at least one of the mutual spatial arrangements, which can be obtained with the help of the displacement mechanism, the light field extends both over the first and the second diffractive optical element. This makes it possible to produce in a simple manner continuously variable illumination settings.

Abstract: An illumination system of a microlithographic projection exposure apparatus includes a light source operated in a pulsed manner and a DMD (digital mirror device) or another array of optical elements, which are digitally switchable between two switching positions.

Abstract: An illumination system of a micro-lithographic projection exposure apparatus is provided, which is configured to illuminate a mask positioned in a mask plane. The system includes a pupil shaping optical subsystem and illuminator optics that illuminate a beam deflecting component. For determining a property of the beam deflecting component, an intensity distribution in a system pupil surface of the illumination system is determined. Then the property of the beam deflecting component is determined such that the intensity distribution produced by the pupil shaping subsystem in the system pupil surface approximates the intensity distribution determined before. At least one of the following aberrations are taken into account in this determination: (i) an aberration produced by the illuminator optics; (ii) an aberration produced by the pupil shaping optical subsystem; (iii) an aberration produced by an optical element arranged between the system pupil surface and the mask plane.

Abstract: An illumination system of a microlithographic projection exposure apparatus includes a light source operated in a pulsed fashion and an array of optical elements which are digitally switchable between two switching positions. The array may be produced using MEMS technology.

Abstract: An optical system for a microlithographic projection exposure apparatus and a microlithographic exposure method are disclosed. In an embodiment an optical system for a microlithographic projection exposure apparatus includes at least one mirror arrangement having a plurality of mirror elements which are displaceable independently of each other for altering an angular distribution of the light reflected by the mirror arrangement. The optical system also includes at least one manipulator downstream of the mirror arrangement in the light propagation direction. The manipulator has a raster arrangement of manipulator elements so that light incident on the manipulator during operation of the optical system is influenced differently in its polarization state and/or in its intensity in dependence on the incidence location.

Abstract: A microlithography illumination optical system is used to guide illumination light from a primary light source to an object field. A mirror array of the illumination optical system has a plurality of individual mirrors, which can be tilted independently of one another by actuators and are connected to associated tilting actuators. A controller is used to activate the actuators. A raster module of the illumination optical system has a plurality of raster elements to produce a spatially distributed arrangement of secondary light sources.

Abstract: An illumination system of a microlithographic projection exposure apparatus includes a spatial light modulator which varies an intensity distribution in a pupil surface. The modulator includes an array of mirrors that reflect impinging projection light into directions that depend on control signals applied to the mirrors. A prism, which directs the projection light towards the spatial light modulator, has a double pass surface on which the projection light impinges twice, namely a first time when leaving the prism and before it is reflected by the mirrors, and a second time when entering the prism and after it has been reflected by the mirrors. A pupil perturbation suppressing mechanism is provided that reduces reflections of projection light when it impinges the first time on the double pass surface, and/or prevents that light portions being a result of such reflections contribute to the intensity distribution in the pupil surface.

Abstract: An illumination system of a microlithographic projection exposure apparatus includes a light source operated in a pulsed fashion and an array of optical elements which are digitally switchable between two switching positions. The array may be produced using MEMS technology.

Abstract: An illumination system of a microlithographic projection exposure apparatus includes a pupil forming unit directing light on a spatial light modulator that transmits or reflects impinging light in a spatially resolved manner. An objective images a light exit surface of the spatial light modulator on light entrance facets of an optical integrator so that an image of an object area on the light exit surface completely coincides with one of the light entrance facets. The pupil forming unit and the spatial light modulator are controlled so that the object area is completely illuminated by the pupil forming unit and projection light associated with a point in the object area is at least partially and variably prevented from impinging on the one of the light entrance facets.

Abstract: An illumination system of a microlithographic projection exposure apparatus includes first and second optical raster plates. An irradiance distribution of projection light on the first and second optical raster plates determines an angular light distribution of the projection light exclusively at a first portion and a second portion, respectively, of an illuminated field. The second portion is distinct from and arranged adjacent to the first portion. It is possible to produce different illumination settings in different adjacent portions on the mask. First and second Fourier optics establish a Fourier relationship between the first and second optical raster plates one the one hand and the first and second portion on the other hand. The first and second Fourier optics have a first and second focal length, respectively, that are variable in response to a focal length change command signal from a control unit.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: An illumination system of a micro-lithographic projection exposure apparatus is provided, which is configured to illuminate a mask positioned in a mask plane. The system includes a pupil shaping optical subsystem and illuminator optics that illuminate a beam deflecting component. For determining a property of the beam deflecting component, an intensity distribution in a system pupil surface of the illumination system is determined. Then the property of the beam deflecting component is determined such that the intensity distribution produced by the pupil shaping subsystem in the system pupil surface approximates the intensity distribution determined before. At least one of the following aberrations are taken into account in this determination: (i) an aberration produced by the illuminator optics; (ii) an aberration produced by the pupil shaping optical subsystem; (iii) an aberration produced by an optical element arranged between the system pupil surface and the mask plane.

Abstract: A facet mirror, such as for use as an optical component in a projection exposure apparatus for EUV microlithography, includes at least two mirror modules having individual mirrors and mirror module surfaces and at least on one side a non-reflective edge region and a module edge. Adjacent individual mirrors in the mirror modules are a distance from each other that is less than half the width of the non-reflective edge region. The at least two adjacent module edges of adjacent mirror modules are offset with respect to each other by a height h along the surface normal of one of the two mirror module surfaces.

Abstract: A microlithography optical system includes a projection objective and an illumination system that includes a temperature compensated polarization-modulating optical element. The temperature compensated polarization-modulating optical element includes a first polarization-modulating optical element of optically active material, the first polarization-modulating optical element having a first specific rotation with a sign. The temperature compensated polarization-modulating optical element includes also includes a second polarization-modulating optical element of optically active material, the second polarization-modulating optical element having a second specific rotation with a sign opposite to the sign of the first specific rotation.

Abstract: A collector transfers EUV illumination light from a radiation source region to illumination optics. Imaging optics of the collector image the radiation source region in a downstream focal region. The imaging optics are embodied so that the radiation source is imaged with at least one first imaging scale by the EUV illumination light, which is emitted with beam angles <20° between the radiation source region and the downstream focal region. The imaging optics are also embodied so that the radiation source is imaged with at least one second imaging scale by the illumination light emitted with beam angles >70°. The two imaging scales for the beam angles <20° on the one hand and >70° on the other hand differ by no more than a factor of 2.5. In addition to a corresponding collector, an illumination system contains field facets transfer optics.

Abstract: An illumination system has illumination optics which guide EUV illumination light collected by a collector to an object field. The illumination optics have a field facet mirror and a pupil facet mirror. Pupil facets are part of transfer optics which image the field facets in a manner superposed on one another into the object field. The collector images a radiation source region into an intermediate focal region disposed downstream thereof. The latter constitutes the first image of the radiation source region in the beam path disposed downstream thereof. A constriction region not coinciding with the downstream focal region is situated between the collector and a first component of the illumination optics.