Patents by Inventor Markus Heinrici

Markus Heinrici has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process
    Publication number: 20150214095
    Abstract: A method for producing a metal layer on a wafer is described. In one embodiment the method comprises providing a semiconductor wafer including a coating, printing a metal particle paste on the semiconductor wafer thereby forming a metal layer and heating the metal layer in a reductive gas for sintering the metal particle paste or for annealing a sintered metal particle paste in an oven.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 30, 2015
    Inventors: Martin Mischitz, Manfred Schneegans, Markus Heinrici