Abstract: The present invention relates to a method for producing a coated object by additive manufacturing in vacuum and to a device for producing a coated object. The method comprises forming a first polymer layer on a workpiece and/or on a printing bed. A first coating layer is formed on at least a part of the first polymer layer by vacuum-based vapor deposition. A second polymer layer is formed on at least a part of the first polymer layer and/or of the first coating layer, wherein the second polymer layer is formed before, during or after forming the first coating layer. The first polymer layer, the first coating layer and the second polymer layer are formed in vacuum at a gas pressure of less than 10?2 mbar.

Abstract: A method of designing a set of contoured implants for fixation to a bone of a patient, includes obtaining a set of virtual bone models of the bone, selecting a plurality of points on an outer surface of each virtual bone model in the set of virtual bone models, manufacturing a set of implants, each implant corresponding to a respective virtual bone model and having fixation holes corresponding to the selected plurality of points on the outer surface of the respective virtual bone model, contouring each implant in the set of implants and selecting a contoured implant from the set of implants for fixation to the bone of the patient such that the selected contoured implant corresponds to a size of the bone of the patient.

Abstract: A humidifier module is provided having a water vapor-permeable membrane having spacers defining a flow field arranged on either side of the membrane and having a yarn stitched into the membrane. The spacers defining the flow field are formed by the yarn stitched into the membrane. A humidifier, a method for making a humidifier module and a method for making a humidifier are also provided.

Abstract: Resistive memory cells, precursors thereof, and methods of making resistive memory cells are described. In some embodiments, the resistive memory cells are formed from a resistive memory precursor that includes a switching layer precursor containing a plurality of oxygen vacancies that are present in a controlled distribution therein, optionally without the use of an oxygen exchange layer. In these or other embodiments, the resistive memory precursors described may include a second electrode formed on a switching layer precursor, wherein the second electrode is includes a second electrode material that is conductive but which does not substantially react with oxygen. Devices including resistive memory cells are also described.

Abstract: A method of designing a set of contoured implants for fixation to a bone of a patient, includes obtaining a set of virtual bone models of the bone, selecting a plurality of points on an outer surface of each virtual bone model in the set of virtual bone models, manufacturing a set of implants, each implant corresponding to a respective virtual bone model and having fixation holes corresponding to the selected plurality of points on the outer surface of the respective virtual bone model, contouring each implant in the set of implants and selecting a contoured implant from the set of implants for fixation to the bone of the patient such that the selected contoured implant corresponds to a size of the bone of the patient.

Abstract: Resistive memory cells, precursors thereof, and methods of making resistive memory cells are described. In some embodiments, the resistive memory cells are formed from a resistive memory precursor that includes a switching layer precursor containing a plurality of oxygen vacancies that are present in a controlled distribution therein, optionally without the use of an oxygen exchange layer. In these or other embodiments, the resistive memory precursors described may include a second electrode formed on a switching layer precursor, wherein the second electrode is includes a second electrode material that is conductive but which does not substantially react with oxygen. Devices including resistive memory cells are also described.

Abstract: Resistive memory cells, precursors thereof, and methods of making resistive memory cells are described. In some embodiments, the resistive memory cells are formed from a resistive memory precursor that includes a switching layer precursor containing a plurality of oxygen vacancies that are present in a controlled distribution therein, optionally without the use of an oxygen exchange layer. In these or other embodiments, the resistive memory precursors described may include a second electrode formed on a switching layer precursor, wherein the second electrode is includes a second electrode material that is conductive but which does not substantially react with oxygen. Devices including resistive memory cells are also described.

Abstract: The invention relates to a surgical retaining instrument for bone plates. The retaining instrument comprises a carrying element and two plate retaining jaws arranged on the carrying element. The mutual distance of the plate retaining jaws can be changed in order to pick up or release a bone plate. Furthermore, an actuating device is provided, which has two arms, which can be moved relative to each other and which are designed to change the mutual distance of the plate retaining jaws. The carrying element is rotatably mounted relative to the arms.

Abstract: A compact unit has an electric motor accommodated in housing parts (7, 55) of a unit housing (45) and driving at least one hydraulic pump and giving off heat at the same time, an air heat-exchanging device, and a fan (19) drivable to produce an air flow. A flow-conducting device (47, 55) divides the air flow at least in a first partial flow flowing around the electric motor and a second partial flow flowing to the heat-exchanging device in the unit housing (45). Alternatively, arranged in series, the air flow first flows against the electric motor and then the heat-exchanging device, or that the incidence of the air flow occurs at least partially in the reverse direction.

Abstract: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins. The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

Abstract: Resistive memory cells, precursors thereof, and methods of making resistive memory cells are described. In some embodiments, the resistive memory cells are formed from a resistive memory precursor that includes a switching layer precursor containing a plurality of oxygen vacancies that are present in a controlled distribution therein, optionally without the use of an oxygen exchange layer. In these or other embodiments, the resistive memory precursors described may include a second electrode formed on a switching layer precursor, wherein the second electrode is includes a second electrode material that is conductive but which does not substantially react with oxygen. Devices including resistive memory cells are also described.

Abstract: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins. The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

Abstract: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

Abstract: A method and a device made according to the method. The method comprises providing a substrate including a first material, and providing a fin including a second material, the fin being disposed on the substrate and having a device active portion, the first material and the second material presenting a lattice mismatch between respective crystalline structures thereof. Providing the fin includes providing a biaxially strained film including the second material on the substrate; and removing parts of the biaxially strained film to form a substantially uniaxially strained fin therefrom.

Abstract: The invention relates to a compact unit, at least consisting of an electric motor, which is accommodated in housing parts (7, 55) of a unit housing (45) and which drives at least one hydraulic pump and gives off heat at the same time, an air heat-exchanging device, and a fan (19), which can be driven in order t o produce an air flow. The compact unit is characerized in that a flow-conducting device (47, 55) that divides off from the air flow at least a first partial flow flowing around the electric motor and a second partial flow flowing to the heat-exchanging device is present in the unit housing (45), or that, arranged in series, the air flow first flows against the electric motor and then the heat-exchanging device, or that the incidence of the air flow occurs at least partially in the reverse direction.

Abstract: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

Abstract: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins. The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

Abstract: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins. The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

Abstract: Techniques are disclosed for enabling multi-sided condensation of semiconductor fins. The techniques can be employed, for instance, in fabricating fin-based transistors. In one example case, a strain layer is provided on a bulk substrate. The strain layer is associated with a critical thickness that is dependent on a component of the strain layer, and the strain layer has a thickness lower than or equal to the critical thickness. A fin is formed in the substrate and strain layer, such that the fin includes a substrate portion and a strain layer portion. The fin is oxidized to condense the strain layer portion of the fin, so that a concentration of the component in the strain layer changes from a pre-condensation concentration to a higher post-condensation concentration, thereby causing the critical thickness to be exceeded.

Abstract: A plate system for bone fixation including intermaxillary fixation which has at least one plate with one opening and at least one bone screw for securing the plate to an adjacent bone and/or other anatomical structures (e.g., the gingival) with space maintained in between. The plate system provides a fixed connection at both the plate and the bone. A method for achieving fixation while maintaining space between the plate and bone includes placement of a spacer over the desired bone screw insertion point, followed by placement of the plate over the spacer so that the bone screw may be inserted through the plate while the spacer is held in position.