Abstract: A pre-impregnated yarn including a bundle of reinforcing fiber filaments having a bundle interior and a bundle outer side, a first resin composition, and a second resin composition. The first resin composition includes at least one urethane resin, H1, produced from a reaction of a bifunctional aromatic epoxy compound based on bisphenol A, an aromatic polyisocyanate, and a polyalkylene glycol; an oxyalkylated bisphenol A resin, H2; and aromatic polyhydroxy ether P1. The filaments are impregnated with and at least partially connected via the first resin composition. The first resin composition is present in a concentration of 0.1 to 4 wt % relative to a total weight of the pre-impregnated yarn. The second resin composition is on the bundle outer side in the form of particles or drops adhering to the filaments, and is in a concentration of 0.5 to 14 wt % relative to the total weight of the pre-impregnated yarn.

Abstract: A deposition device for controlled deposition of reinforcing fiber bundles on a surface, including a deposition head and a controllable positioning unit, means for providing at least one strand of reinforcing fibers provided with a binder, and a first conveying device, arranged on the deposition head conveys the at least one strand to the deposition head, wherein, when viewed in the conveying direction, means for spreading the at least one strand are arranged on the deposition head, and the deposition head has a second conveying device arranged after the first conveying device, a longitudinal splitting device, arranged between the first and second conveying devices, with at least one splitting element for splitting the at least one strand along the longitudinal extension thereof into two or more partial strands, and a cut-to-length unit arranged after the second conveying device for cutting-to-length the two or more partial strands into fiber bundles.

Abstract: An optoelectronic semiconductor component includes a carrier which has an upper side and a lower side opposite to the upper side. At least one radiation-emitting semiconductor device is disposed on the upper side and has a radiation emission surface, through which at least a portion of the electromagnetic radiation, which is generated during operation of the semiconductor device, leaves the semiconductor device. A radiation-absorbing layer is arranged to absorb ambient light, which impinges upon the component, such that an outer surface of the component facing away from the carrier appears black at least in places.

Abstract: Described is a method for producing a fiber preform by deposition of reinforcing fiber bundles onto a surface including: supplying at least one continuous strand of reinforcing fibers provided with a binder to a deposition head, spreading the at least one strand in a spreader unit and conveying using a first conveying device to a longitudinal splitting device, cutting the at least one strand in the longitudinal splitting device along the longitudinal extension thereof into at least two partial strands by means of a splitting element, conveying the partial strands by means of a second conveying device to a cut-to-length unit, cutting the partial strands by means of the cut-to-length unit into reinforcing fiber bundles, and depositing the reinforcing fiber bundles onto a surface and/or reinforcing fiber bundles deposited on the surface and fixing the reinforcing fiber bundles to form the fiber preform.

Abstract: A method for producing an optoelectronic assembly (12) is provided, in which an optoelectronic component (16) is arranged on a carrier (14). Electrical terminals of the optoelectronic component (16) are electrically coupled to electrical contacts of the carrier (14) corresponding thereto. A dummy body (20) is arranged on a first side of the optoelectronic component (16) facing away from the carrier (14). A potting material (22) is arranged on the carrier (14), which potting material at least partially encloses the optoelectronic component (16) and at least partially encloses the dummy body (20). The dummy body (20) is removed, after the potting material (22) is dimensionally stable, whereby a recess (23) results, which is at least partially enclosed by the dimensionally stable potting material (22). An optically functional material (24) is decanted into the recess (23).

Abstract: A method for producing an optoelectronic assembly (12) is provided, in which an optoelectronic component (16) is arranged on a carrier (14). Electrical terminals of the optoelectronic component (16) are electrically coupled to electrical contacts of the carrier (14) corresponding thereto. A dummy body (20) is arranged on a first side of the optoelectronic component (16) facing away from the carrier (14). A potting material (22) is arranged on the carrier (14), which potting material at least partially encloses the optoelectronic component (16) and at least partially encloses the dummy body (20). The dummy body (20) is removed, after the potting material (22) is dimensionally stable, whereby a recess (23) results, which is at least partially enclosed by the dimensionally stable potting material (22). An optically functional material (24) is decanted into the recess (23).

Abstract: An optoelectronic semiconductor component includes a carrier with a carrier top, at least one optoelectronic semiconductor chip mounted on the carrier top and having a radiation-transmissive substrate and a semiconductor layer sequence which includes at least one active layer that generates electromagnetic radiation, and a reflective potting material, wherein, starting from the carrier top, the potting material surrounds the semiconductor chip in a lateral direction at least up to half the height of the substrate.

Abstract: A fiber preform for producing fiber composite structures, a wall thereof including a first zone made from reinforcing fiber bundles having a first resin composition and a second zone made from at least one fiber tape comprising at least one unidirectionally directed reinforcing yarn strand having a second resin composition. The reinforcing fiber bundles in the first zone are oriented in different spatial directions to each other when viewed in a direction parallel to the extension of the thickness. Each reinforcing fiber has a length of from 3 to 50 mm, and contains the first resin composition in a concentration of from 1 to 10 wt % of the fiber weight. The wall of the fiber preform has a proportion of reinforcing fibers of more than 35 vol %, and the second zone forms a discrete region when viewed in a direction perpendicular to the thickness extension of the wall.

Abstract: In at least one embodiment, an optoelectronic semiconductor component includes an optoelectronic semiconductor chip. The semiconductor component includes a conversion element that is arranged to convert at least some radiation emitted by the semiconductor chip into radiation of a different wavelength. The conversion element comprises at least one luminescent substance and scattering particles and also at least one matrix material. The scattering particles are embedded in the matrix material. A difference in the refractive index between the matrix material and a material of the scattering particles at a temperature of 300 K is at the most 0.15. The difference in the refractive index between the matrix material and the material of the scattering particles at a temperature of 380 K is greater than at a temperature of 300 K.

Abstract: A pre-impregnated yarn having a bundle made of reinforcing fiber filaments impregnated with a first resin composition infiltrated into the pre-impregnated yarn and at least partially connected via the first resin composition. The first resin composition contains at least two bisphenol A epichlorohydrin resins H1 and H2 in a weight ratio H1:H2 of 1.1 to 1.4, and an aromatic polyhydroxy ether P1. The pre-impregnated yarn has a second resin composition on the bundle outer side in the form of adhesive particles or drops. The second resin composition is solid at ambient temperatures and has a melting temperature in the range from 80 to 150° C. The bundle interior and at least 50% of the surface of the bundle outer side are free of the second resin composition.

Abstract: A process for producing fiber preforms for composite material components makes it possible to directly produce complex geometries in a flexible and low-cost manner by applying a plurality of dry fiber rovings independently of one another even in spatially uneven contours. It is no longer necessary to use cut fabric strips since fiber preforms are produced straight from the dry fiber rovings. This obviates the need to carry out production, transport and order picking processes. It is not necessary to cut fiber strips to size, and therefore a saving may be made on material. In addition, it is possible to increase the mechanical characteristic values in the composite material because it is not necessary to sew fiber webs. The described process can also readily be scaled since the number of dry fiber rovings arranged next to one another make it possible to vary the area which can be covered.

Abstract: A method and associated safety system are provided for the recognition of defects in a drive system of a motor vehicle, having an electronically controllable brake control system and having at least one electronically controlled driving engine, an electronically controllable clutch and/or having an electronically controllable transmission. An electronic braking control device is assigned to the brake control system, which braking control device is connected with an independent monitoring module. The independent monitoring module checks for an occurrence of an implausible braking torque, for detecting a defect in the drive system.

Abstract: An optoelectronic semiconductor component includes a carrier which has an upper side and a lower side opposite to the upper side. At least one radiation-emitting semiconductor device is disposed on the upper side and has a radiation emission surface, through which at least a portion of the electromagnetic radiation, which is generated during operation of the semiconductor device, leaves the semiconductor device. A radiation-absorbing layer is arranged to absorb ambient light, which impinges upon the component, such that an outer surface of the component facing away from the carrier appears black at least in places.

Abstract: A fiber preform for producing fiber composite structures, a wall thereof including a first zone made from reinforcing fiber bundles having a first resin composition and a second zone made from at least one fiber tape comprising at least one unidirectionally directed reinforcing yarn strand having a second resin composition. The reinforcing fiber bundles in the first zone are oriented in different spatial directions to each other when viewed in a direction parallel to the extension of the thickness. Each reinforcing fiber has a length of from 3 to 50 mm, and contains the first resin composition in a concentration of from 1 to 10 wt % of the fiber weight. The wall of the fiber preform has a proportion of reinforcing fibers of more than 35 vol %, and the second zone forms a discrete region when viewed in a direction perpendicular to the thickness extension of the wall.

Abstract: An optoelectronic semiconductor component includes a carrier with a carrier top, at least one optoelectronic semiconductor chip mounted on the carrier top and having a radiation-transmissive substrate and a semiconductor layer sequence which includes at least one active layer that generates electromagnetic radiation, and a reflective potting material, wherein, starting from the carrier top, the potting material surrounds the semiconductor chip in a lateral direction at least up to half the height of the substrate.

Abstract: A yarn includes reinforcing fiber filaments and a resin that is infiltrated into the yarn and can be repeatedly melted and solidified by cooling to room temperature, wherein the filaments of the yarn are at least partially bound to one another by the resin, wherein the yarn contains 2.5 to 25 wt.% of infiltrated resin relative to its total weight, and wherein the infiltrated resin includes a mixture of at least two epoxy resins E1 and E2, E1 having an epoxy value in the range of 2,000 to 2,300 mmol/kg of resin and E2 having an epoxy value in the range of 500 to 650 mmol/kg of resin, and the weight ratio E1:E2 of the epoxy resins E1 and E2 in the mixture is chosen so that the infiltrated resin mixture has an epoxy value between 550 and 2,100 mmol/kg of resin. A preform comprising the yarn, a method for producing the preform and its use in producing a composite are also described.

Abstract: A setting information distribution apparatus belonging to a first network, comprises: authentication unit that receives and authenticates an authentication request from a user terminal which requires an access authentication by using a network access authentication procedure between the user terminal and the first network; transmitting unit that transmits an authentication cooperation request which requires setting data to be set to the user terminal to another, network by using the network access authentication procedure and an authentication cooperation procedure between a plurality of networks; and distribution unit that distributes a first response message added with setting data to the user terminal by producing the first response message corresponding to the authentication request by adding the setting data included in a second response message corresponding to the authentication cooperation request.

Abstract: Thread having at least two strands of continuous carbon fiber that are twisted around one another, whereby the carbon fibers of the strands are arranged approximately parallel to the thread direction. The at least two strands of continuous carbon fiber are twisted around one another and produced by direct cabling. A method for the production of the thread includes twisting each of the at least two strands of continuous carbon fiber around one another by direct cabling. An eyelet assembly with an eyelet that has a radius of at least 4 mm in the area of contact between the strands and the eyelet assembly. The thread is used as a sewing thread or a thread for reinforcing polymers, elastomers, rubber or concrete.

Abstract: Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

Abstract: A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).