Patents by Inventor Marten Oldsen
Marten Oldsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11774308Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.Type: GrantFiled: September 17, 2020Date of Patent: October 3, 2023Assignee: Infineon Technologies AGInventors: Rainer Leuschner, Kerstin Kaemmer, Roland Meier, Marten Oldsen, Karolina Zogal
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Publication number: 20230251154Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.Type: ApplicationFiled: April 21, 2023Publication date: August 10, 2023Inventors: Rainer Leuschner, Kerstin Kaemmer, Roland Meier, Marten Oldsen, Karolina Zogal
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Patent number: 11703681Abstract: A method for producing a MEMS device comprises fabricating a first semiconductor layer and selectively depositing a second semiconductor layer over the first semiconductor layer, wherein the second semiconductor layer comprises a first part composed of monocrystalline semiconductor material and a second part composed of polycrystalline semiconductor material. The method furthermore comprises structuring at least one of the semiconductor layers, wherein the monocrystalline semiconductor material of the first part and underlying material of the first semiconductor layer form a spring element of the MEMS device and the polycrystalline semiconductor material of the second part and underlying material of the first semiconductor layer form at least one part of a comb drive of the MEMS device.Type: GrantFiled: May 17, 2021Date of Patent: July 18, 2023Assignee: Infineon Technologies AGInventors: Stephan Gerhard Albert, Marten Oldsen
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Patent number: 11428661Abstract: In accordance with an embodiment, a method for producing a moisture sensor includes providing a substrate arrangement, applying a sensor structure, applying a first cover layer on the sensor structure, locally removing the planar cover layer arrangement to expose portions of an insulation layer, applying a third cover layer on the exposed portions of the insulation layer, exposing the planar cover layer arrangement covering the sensor structure, and applying a moisture-absorbing layer element on the planar cover layer arrangement covering the sensor structure to obtain the moisture sensor.Type: GrantFiled: November 22, 2019Date of Patent: August 30, 2022Assignee: INFINEON TECHNOLOGIES AGInventors: Marco Haubold, Heiko Froehlich, Thoralf Kautzsch, Olga Khvostikova, Marten Oldsen, Bernhard Straub
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Publication number: 20220033249Abstract: The semiconductor device includes a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface, a first glass-based substrate, on which the MEMS chip is arranged by its first main surface, and a second substrate, which is arranged on the second main surface of the MEMS chip, wherein the MEMS chip has a first recess connected to the surroundings by way of a plurality of perforation holes arranged in the first substrate.Type: ApplicationFiled: July 15, 2021Publication date: February 3, 2022Applicant: Infineon Technologies AGInventors: Andre BROCKMEIER, Barbara Angela GLANZER, Marten OLDSEN, Francesco SOLAZZI, Carsten VON KOBLINSKI
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Publication number: 20210373322Abstract: A method for producing a MEMS device comprises fabricating a first semiconductor layer and selectively depositing a second semiconductor layer over the first semiconductor layer, wherein the second semiconductor layer comprises a first part composed of monocrystalline semiconductor material and a second part composed of polycrystalline semiconductor material. The method furthermore comprises structuring at least one of the semiconductor layers, wherein the monocrystalline semiconductor material of the first part and underlying material of the first semiconductor layer form a spring element of the MEMS device and the polycrystalline semiconductor material of the second part and underlying material of the first semiconductor layer form at least one part of a comb drive of the MEMS device.Type: ApplicationFiled: May 17, 2021Publication date: December 2, 2021Inventors: Stephan Gerhard ALBERT, Marten OLDSEN
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Publication number: 20210003466Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.Type: ApplicationFiled: September 17, 2020Publication date: January 7, 2021Inventors: Rainer Leuschner, Kerstin Kaemmer, Roland Meier, Marten Oldsen, Karolina Zogal
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Publication number: 20200385264Abstract: In a method of generating a microelectromechanical system, MEMS, device, a MEMS substrate including a movable element is provided. A glass cover member including a glass cover is formed by hot embossing. The glass cover member is bonded to the MEMS substrate so as to hermetically seal by the glass cover a cavity in which the movable element is arranged.Type: ApplicationFiled: June 2, 2020Publication date: December 10, 2020Applicant: Infineon Technologies AGInventors: Andre BROCKMEIER, Rafael JANSKI, Boris KIRILLOV, Marten OLDSEN, Clemens ROESSLER, Francisco Javier SANTOS RODRIGUEZ, Sokratis SGOURIDIS, Kurt SORSCHAG
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Patent number: 10859457Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.Type: GrantFiled: November 9, 2017Date of Patent: December 8, 2020Assignee: INFINEON TECHNOLOGIES AGInventors: Rainer Leuschner, Kerstin Kaemmer, Roland Meier, Marten Oldsen, Karolina Zogal
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Publication number: 20200166471Abstract: In accordance with an embodiment, a method for producing a moisture sensor includes providing a substrate arrangement, applying a sensor structure, applying a first cover layer on the sensor structure, locally removing the planar cover layer arrangement to expose portions of an insulation layer, applying a third cover layer on the exposed portions of the insulation layer, exposing the planar cover layer arrangement covering the sensor structure, and applying a moisture-absorbing layer element on the planar cover layer arrangement covering the sensor structure to obtain the moisture sensor.Type: ApplicationFiled: November 22, 2019Publication date: May 28, 2020Inventors: Marco Haubold, Heiko Froehlich, Thoralf Kautzsch, Olga Khvostikova, Marten Oldsen, Bernhard Straub
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Publication number: 20180136064Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.Type: ApplicationFiled: November 9, 2017Publication date: May 17, 2018Inventors: Rainer Leuschner, Kerstin Kaemmer, Roland Meier, Marten Oldsen, Karolina Zogal
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Patent number: 9726561Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.Type: GrantFiled: April 30, 2014Date of Patent: August 8, 2017Assignee: ams International AGInventors: Willem Frederik Adrianus Besling, Iris Bominaar-Silkens, Remco Henricus Wilhelmus Pijnenburg, Marten Oldsen
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Patent number: 9670057Abstract: A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with a semiconductor substrate. The sensor device may include a suspension structure that suspends the MEMS sensor over a back cavity within the semiconductor substrate. The suspension structure may be springs or a spring structure formed from etching the front side of the substrate.Type: GrantFiled: January 29, 2016Date of Patent: June 6, 2017Assignee: INFINEON TECHNOLOGIES AGInventor: Marten Oldsen
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Patent number: 9557238Abstract: Various exemplary embodiments relate to a pressure sensor including a pressure sensitive membrane suspended over a cavity, wherein the membrane is secured by a set of anchors to a substrate; and a getter material embedded in the membrane, wherein the surface of the getter is in contact with any gas within the cavity, and wherein two end points of the getter material are attached through the substrate by anchors capable of conducting through the substrate an electrical current through the getter material.Type: GrantFiled: July 25, 2014Date of Patent: January 31, 2017Assignee: ams International AGInventors: Willem Besling, Martijn Goossens, Peter Steeneken, Remco Pijnenburg, Marten Oldsen, Casper van der Avoort
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Patent number: 9385099Abstract: One example embodiment discloses a chip having a chip area, wherein the chip area includes: an overhang area; a rigid coupling area, having a set of rigid coupling points, located on one side of the overhang area; and a flexible coupling area, having a set of flexible coupling points, located on a side of the overhang area opposite to the a rigid coupling area. Another example embodiment discloses a method for fabricating a die interconnect, comprising: fabricating a rigid coupler area, having a set of rigid coupler points, within a chip having a chip area; defining an overhang area within the chip area and abutted to the rigid coupler area; and fabricating a flexible coupler area, having a set of flexible coupler points, within the chip area abutted to a side of the overhang area opposite to the rigid coupler area.Type: GrantFiled: March 28, 2014Date of Patent: July 5, 2016Assignee: NXP, B.V.Inventors: Leonardus Antonius Elisabeth van Gemert, Coenraad Cornelis Tak, Marten Oldsen, Hendrik Bouman
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Publication number: 20160139038Abstract: One example discloses an interferometer device, including: a first side, having a first reflectivity; a second side, having a second reflectivity; a cavity disposed between the first and second sides, and having an opening configured to receive a substance; an electromagnetic source input region configured to receive an electromagnetic signal; and an electromagnetic detector output region configured to output the electromagnetic signal modulated in response to the substance in the cavity.Type: ApplicationFiled: November 19, 2014Publication date: May 19, 2016Inventors: Marten Oldsen, Erik Jan Lous, Agata Sakic
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Patent number: 9340412Abstract: Embodiments of a method for forming a suspended membrane include depositing a first electrically conductive material above a sacrificial layer and within a boundary trench. The first electrically conductive material forms a corner transition portion above the boundary trench. The method further includes removing a portion of the first electrically conductive material that removes at least a portion of uneven topography of the first electrically conductive material. The method further includes depositing a second electrically conductive material. The second electrically conductive material extends beyond the boundary trench. The method further includes removing the sacrificial layer through etch openings and forming a cavity below the second electrically conductive material. The first electrically conductive material defines a portion of a sidewall boundary of the cavity.Type: GrantFiled: July 28, 2014Date of Patent: May 17, 2016Assignee: ams International AGInventors: Willem Besling, Remco Henricus Wilhelmus Pijnenburg, Casper van der Avoort, Marten Oldsen, Martijn Goossens
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Publication number: 20160023893Abstract: Embodiments of a method for forming a suspended membrane include depositing a first electrically conductive material above a sacrificial layer and within a boundary trench. The first electrically conductive material forms a corner transition portion above the boundary trench. The method further includes removing a portion of the first electrically conductive material that removes at least a portion of uneven topography of the first electrically conductive material. The method further includes depositing a second electrically conductive material. The second electrically conductive material extends beyond the boundary trench. The method further includes removing the sacrificial layer through etch openings and forming a cavity below the second electrically conductive material. The first electrically conductive material defines a portion of a sidewall boundary of the cavity.Type: ApplicationFiled: July 28, 2014Publication date: January 28, 2016Applicant: ams International AGInventors: Willem Besling, Remco Henricus Wilhelmus Pijnenburg, Casper van der Avoort, Marten Oldsen, Martijn Goossens
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Publication number: 20160025583Abstract: Various exemplary embodiments relate to a pressure sensor including a pressure sensitive membrane suspended over a cavity, wherein the membrane is secured by a set of anchors to a substrate; and a getter material embedded in the membrane, wherein the surface of the getter is in contact with any gas within the cavity, and wherein two end points of the getter material are attached through the substrate by anchors capable of conducting through the substrate an electrical current through the getter material.Type: ApplicationFiled: July 25, 2014Publication date: January 28, 2016Inventors: Willem Besling, Martijn Goossens, Peter Steeneken, Remco Pijnenburg, Marten Oldsen, Casper van der Avoort
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Publication number: 20150279803Abstract: One example embodiment discloses a chip having a chip area, wherein the chip area includes: an overhang area; a rigid coupling area, having a set of rigid coupling points, located on one side of the overhang area; and a flexible coupling area, having a set of flexible coupling points, located on a side of the overhang area opposite to the a rigid coupling area. Another example embodiment discloses a method for fabricating a die interconnect, comprising: fabricating a rigid coupler area, having a set of rigid coupler points, within a chip having a chip area; defining an overhang area within the chip area and abutted to the rigid coupler area; and fabricating a flexible coupler area, having a set of flexible coupler points, within the chip area abutted to a side of the overhang area opposite to the rigid coupler area.Type: ApplicationFiled: March 28, 2014Publication date: October 1, 2015Applicant: NXP B.V.Inventors: Leonardus Antonius Elisabeth van Gemert, Coenraad Cornelis Tak, Marten Oldsen, Hendrik Bouman