Patents by Inventor Marten Oldsen

Marten Oldsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180136064
    Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.
    Type: Application
    Filed: November 9, 2017
    Publication date: May 17, 2018
    Inventors: Rainer Leuschner, Kerstin Kaemmer, Roland Meier, Marten Oldsen, Karolina Zogal
  • Patent number: 9726561
    Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: August 8, 2017
    Assignee: ams International AG
    Inventors: Willem Frederik Adrianus Besling, Iris Bominaar-Silkens, Remco Henricus Wilhelmus Pijnenburg, Marten Oldsen
  • Patent number: 9670057
    Abstract: A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with a semiconductor substrate. The sensor device may include a suspension structure that suspends the MEMS sensor over a back cavity within the semiconductor substrate. The suspension structure may be springs or a spring structure formed from etching the front side of the substrate.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: June 6, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Marten Oldsen
  • Patent number: 9557238
    Abstract: Various exemplary embodiments relate to a pressure sensor including a pressure sensitive membrane suspended over a cavity, wherein the membrane is secured by a set of anchors to a substrate; and a getter material embedded in the membrane, wherein the surface of the getter is in contact with any gas within the cavity, and wherein two end points of the getter material are attached through the substrate by anchors capable of conducting through the substrate an electrical current through the getter material.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: January 31, 2017
    Assignee: ams International AG
    Inventors: Willem Besling, Martijn Goossens, Peter Steeneken, Remco Pijnenburg, Marten Oldsen, Casper van der Avoort
  • Patent number: 9385099
    Abstract: One example embodiment discloses a chip having a chip area, wherein the chip area includes: an overhang area; a rigid coupling area, having a set of rigid coupling points, located on one side of the overhang area; and a flexible coupling area, having a set of flexible coupling points, located on a side of the overhang area opposite to the a rigid coupling area. Another example embodiment discloses a method for fabricating a die interconnect, comprising: fabricating a rigid coupler area, having a set of rigid coupler points, within a chip having a chip area; defining an overhang area within the chip area and abutted to the rigid coupler area; and fabricating a flexible coupler area, having a set of flexible coupler points, within the chip area abutted to a side of the overhang area opposite to the rigid coupler area.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: July 5, 2016
    Assignee: NXP, B.V.
    Inventors: Leonardus Antonius Elisabeth van Gemert, Coenraad Cornelis Tak, Marten Oldsen, Hendrik Bouman
  • Publication number: 20160139038
    Abstract: One example discloses an interferometer device, including: a first side, having a first reflectivity; a second side, having a second reflectivity; a cavity disposed between the first and second sides, and having an opening configured to receive a substance; an electromagnetic source input region configured to receive an electromagnetic signal; and an electromagnetic detector output region configured to output the electromagnetic signal modulated in response to the substance in the cavity.
    Type: Application
    Filed: November 19, 2014
    Publication date: May 19, 2016
    Inventors: Marten Oldsen, Erik Jan Lous, Agata Sakic
  • Patent number: 9340412
    Abstract: Embodiments of a method for forming a suspended membrane include depositing a first electrically conductive material above a sacrificial layer and within a boundary trench. The first electrically conductive material forms a corner transition portion above the boundary trench. The method further includes removing a portion of the first electrically conductive material that removes at least a portion of uneven topography of the first electrically conductive material. The method further includes depositing a second electrically conductive material. The second electrically conductive material extends beyond the boundary trench. The method further includes removing the sacrificial layer through etch openings and forming a cavity below the second electrically conductive material. The first electrically conductive material defines a portion of a sidewall boundary of the cavity.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: May 17, 2016
    Assignee: ams International AG
    Inventors: Willem Besling, Remco Henricus Wilhelmus Pijnenburg, Casper van der Avoort, Marten Oldsen, Martijn Goossens
  • Publication number: 20160025583
    Abstract: Various exemplary embodiments relate to a pressure sensor including a pressure sensitive membrane suspended over a cavity, wherein the membrane is secured by a set of anchors to a substrate; and a getter material embedded in the membrane, wherein the surface of the getter is in contact with any gas within the cavity, and wherein two end points of the getter material are attached through the substrate by anchors capable of conducting through the substrate an electrical current through the getter material.
    Type: Application
    Filed: July 25, 2014
    Publication date: January 28, 2016
    Inventors: Willem Besling, Martijn Goossens, Peter Steeneken, Remco Pijnenburg, Marten Oldsen, Casper van der Avoort
  • Publication number: 20160023893
    Abstract: Embodiments of a method for forming a suspended membrane include depositing a first electrically conductive material above a sacrificial layer and within a boundary trench. The first electrically conductive material forms a corner transition portion above the boundary trench. The method further includes removing a portion of the first electrically conductive material that removes at least a portion of uneven topography of the first electrically conductive material. The method further includes depositing a second electrically conductive material. The second electrically conductive material extends beyond the boundary trench. The method further includes removing the sacrificial layer through etch openings and forming a cavity below the second electrically conductive material. The first electrically conductive material defines a portion of a sidewall boundary of the cavity.
    Type: Application
    Filed: July 28, 2014
    Publication date: January 28, 2016
    Applicant: ams International AG
    Inventors: Willem Besling, Remco Henricus Wilhelmus Pijnenburg, Casper van der Avoort, Marten Oldsen, Martijn Goossens
  • Publication number: 20150279803
    Abstract: One example embodiment discloses a chip having a chip area, wherein the chip area includes: an overhang area; a rigid coupling area, having a set of rigid coupling points, located on one side of the overhang area; and a flexible coupling area, having a set of flexible coupling points, located on a side of the overhang area opposite to the a rigid coupling area. Another example embodiment discloses a method for fabricating a die interconnect, comprising: fabricating a rigid coupler area, having a set of rigid coupler points, within a chip having a chip area; defining an overhang area within the chip area and abutted to the rigid coupler area; and fabricating a flexible coupler area, having a set of flexible coupler points, within the chip area abutted to a side of the overhang area opposite to the rigid coupler area.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 1, 2015
    Applicant: NXP B.V.
    Inventors: Leonardus Antonius Elisabeth van Gemert, Coenraad Cornelis Tak, Marten Oldsen, Hendrik Bouman
  • Publication number: 20140338459
    Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.
    Type: Application
    Filed: April 30, 2014
    Publication date: November 20, 2014
    Applicant: NXP B.V.
    Inventors: Willem Frederik Adrianus Besling, Iris Bominaar-Silkens, Remco Henricus Wilhelmus Pijnenburg, Marten Oldsen
  • Patent number: 8546928
    Abstract: The present application relates to a multiple component which is to be subsequently individualized by forming components containing active structures, in addition to a corresponding component which can be used in microsystem technology systems. The multiple component and/or component comprises a flat substrate and also a flat cap structure which are bound to each other such that they surround at least one first and one second cavity per component, which are sealed against each other and towards the outside. The first of the two cavities is provided with getter material and due to the getter material has a different internal pressure and/or a different gas composition than the second cavity. The present application also relates to a method for producing the type of component and/or components for which gas mixtures of various types of gas have a different absorption ratio in relation to the getter material.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: October 1, 2013
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e. V.
    Inventors: Peter Merz, Wolfgang Reinert, Marten Oldsen, Oliver Schwarzelbach
  • Patent number: 8526098
    Abstract: The invention relates to a microsystem having at least one micromirror (1) and at least one micromirror actuator (2) for pivoting the at least one micromirror (1) about at least one axis from a relaxed resting position, comprising a frame chip and a transparent cover (3) disposed on the frame chip, wherein the frame chip has a chip frame (10), on which the at least one micromirror (1) is articulated in an elastically pivoting manner, wherein the at least one micromirror (1) is further disposed within the chip frame (10) and in a cavity (11) that is formed between the transparent cover (3) and a carrier layer.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: September 3, 2013
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Ulrich Hofmann, Hans-Joachim Quenzer, Marten Oldsen
  • Patent number: 8517545
    Abstract: The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: August 27, 2013
    Assignee: Fraunhofer-Gesellschaft zur Foerferung der angewandten Forschung e.V.
    Inventors: Hans Joachim Quenzer, Marten Oldsen, Ulrich Hofmann
  • Patent number: 8213066
    Abstract: The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: July 3, 2012
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ulrich Hofmann, Marten Oldsen, Bernd Wagner
  • Patent number: 8201452
    Abstract: The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop. Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: June 19, 2012
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Marten Oldsen, Ulrich Hofmann
  • Patent number: 8169678
    Abstract: The present invention relates to a method for producing a micro-mirror actuator and the corresponding actuator. In the method, the actuator is generated from a layered construction made of at least three main layers (101, 103, 107), which are at least sectionally electrically insulated from one another via intermediate layers (102, 104, 106). The layers are structured to form the micro-mirror element and the electrodes, the structuring being performed in such a way that a closed frame (310) is formed from at least the uppermost layer (107) around the inner area of the actuator, which allows a hermetic encapsulation of the inner area by application of a cover plate onto the frame.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: May 1, 2012
    Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Ulrich Hofmann, Marten Oldsen
  • Publication number: 20120075685
    Abstract: The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction.
    Type: Application
    Filed: November 17, 2009
    Publication date: March 29, 2012
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ulrich Hofmann, Marten Oldsen, Bernd Wagner
  • Patent number: 8039950
    Abstract: The invention relates to a cover wafer with a core and with an inside, whereby the inside has one or more annular outer areas, (an) annular area(s), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s), and to a component cover with only one annular outer area on its inside. The invention is characterized in that at least area(s) has/have a buffer layer, which has a wetting angle of <35° for a metallic eutectic solution that melts in a range of >265° C. to 450° C. The invention also relates to a component cover having one of the areas which has said buffer layer in a comparable manner. The invention additionally relates to a wafer component or to a component, which can be inserted using microsystem technology and which has a cover wafer or component cover applied with the aid of a solder material, and to a method for the production thereof.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: October 18, 2011
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Marten Oldsen, Wolfgang Reinert, Peter Merz
  • Publication number: 20100330332
    Abstract: The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.
    Type: Application
    Filed: February 13, 2009
    Publication date: December 30, 2010
    Inventors: Hans Joachim Quenzer, Marten Oldsen, Ulrich Hofmann