Patents by Inventor Marten Oldsen
Marten Oldsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140338459Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.Type: ApplicationFiled: April 30, 2014Publication date: November 20, 2014Applicant: NXP B.V.Inventors: Willem Frederik Adrianus Besling, Iris Bominaar-Silkens, Remco Henricus Wilhelmus Pijnenburg, Marten Oldsen
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Patent number: 8546928Abstract: The present application relates to a multiple component which is to be subsequently individualized by forming components containing active structures, in addition to a corresponding component which can be used in microsystem technology systems. The multiple component and/or component comprises a flat substrate and also a flat cap structure which are bound to each other such that they surround at least one first and one second cavity per component, which are sealed against each other and towards the outside. The first of the two cavities is provided with getter material and due to the getter material has a different internal pressure and/or a different gas composition than the second cavity. The present application also relates to a method for producing the type of component and/or components for which gas mixtures of various types of gas have a different absorption ratio in relation to the getter material.Type: GrantFiled: April 4, 2007Date of Patent: October 1, 2013Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e. V.Inventors: Peter Merz, Wolfgang Reinert, Marten Oldsen, Oliver Schwarzelbach
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Patent number: 8526098Abstract: The invention relates to a microsystem having at least one micromirror (1) and at least one micromirror actuator (2) for pivoting the at least one micromirror (1) about at least one axis from a relaxed resting position, comprising a frame chip and a transparent cover (3) disposed on the frame chip, wherein the frame chip has a chip frame (10), on which the at least one micromirror (1) is articulated in an elastically pivoting manner, wherein the at least one micromirror (1) is further disposed within the chip frame (10) and in a cavity (11) that is formed between the transparent cover (3) and a carrier layer.Type: GrantFiled: July 10, 2008Date of Patent: September 3, 2013Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventors: Ulrich Hofmann, Hans-Joachim Quenzer, Marten Oldsen
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Patent number: 8517545Abstract: The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.Type: GrantFiled: February 13, 2009Date of Patent: August 27, 2013Assignee: Fraunhofer-Gesellschaft zur Foerferung der angewandten Forschung e.V.Inventors: Hans Joachim Quenzer, Marten Oldsen, Ulrich Hofmann
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Patent number: 8213066Abstract: The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction.Type: GrantFiled: November 17, 2009Date of Patent: July 3, 2012Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Ulrich Hofmann, Marten Oldsen, Bernd Wagner
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Patent number: 8201452Abstract: The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop. Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.Type: GrantFiled: January 17, 2008Date of Patent: June 19, 2012Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Marten Oldsen, Ulrich Hofmann
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Patent number: 8169678Abstract: The present invention relates to a method for producing a micro-mirror actuator and the corresponding actuator. In the method, the actuator is generated from a layered construction made of at least three main layers (101, 103, 107), which are at least sectionally electrically insulated from one another via intermediate layers (102, 104, 106). The layers are structured to form the micro-mirror element and the electrodes, the structuring being performed in such a way that a closed frame (310) is formed from at least the uppermost layer (107) around the inner area of the actuator, which allows a hermetic encapsulation of the inner area by application of a cover plate onto the frame.Type: GrantFiled: December 11, 2007Date of Patent: May 1, 2012Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.Inventors: Ulrich Hofmann, Marten Oldsen
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Publication number: 20120075685Abstract: The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction.Type: ApplicationFiled: November 17, 2009Publication date: March 29, 2012Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Ulrich Hofmann, Marten Oldsen, Bernd Wagner
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Patent number: 8039950Abstract: The invention relates to a cover wafer with a core and with an inside, whereby the inside has one or more annular outer areas, (an) annular area(s), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s), and to a component cover with only one annular outer area on its inside. The invention is characterized in that at least area(s) has/have a buffer layer, which has a wetting angle of <35° for a metallic eutectic solution that melts in a range of >265° C. to 450° C. The invention also relates to a component cover having one of the areas which has said buffer layer in a comparable manner. The invention additionally relates to a wafer component or to a component, which can be inserted using microsystem technology and which has a cover wafer or component cover applied with the aid of a solder material, and to a method for the production thereof.Type: GrantFiled: November 8, 2006Date of Patent: October 18, 2011Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.Inventors: Marten Oldsen, Wolfgang Reinert, Peter Merz
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Publication number: 20100330332Abstract: The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.Type: ApplicationFiled: February 13, 2009Publication date: December 30, 2010Inventors: Hans Joachim Quenzer, Marten Oldsen, Ulrich Hofmann
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Publication number: 20100296151Abstract: The invention relates to a microsystem having at least one micromirror (1) and at least one micromirror actuator (2) for pivoting the at least one micromirror (1) about at least one axis from a relaxed resting position, comprising a frame chip and a transparent cover (3) disposed on the frame chip, wherein the frame chip has a chip frame (10), on which the at least one micromirror (1) is articulated in an elastically pivoting manner, wherein the at least one micromirror (1) is further disposed within the chip frame (10) and in a cavity (11) that is formed between the transparent cover (3) and a carrier layer.Type: ApplicationFiled: July 10, 2008Publication date: November 25, 2010Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÕRDERUNG DER ANGEWANDInventors: Ulrich Hofmann, Hans-Joachim Quenzer, Marten Oldsen
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Publication number: 20100277782Abstract: A micromechanical apparatus includes a moving element which comprises a controllable heating apparatus for introduction of a defined amount of heat into the moving element, wherein the apparatus furthermore has a control unit which is designed to control the heating apparatus as a function of an instantaneous temperature and/or of an instantaneous amount of heat that is introduced. The apparatus can be designed to project electromagnetic radiation when the moving element is in the form of a beam deflection unit for deflection of radiation, which originates from a radiation source, onto a projection surface.Type: ApplicationFiled: July 10, 2008Publication date: November 4, 2010Inventors: Hans-Joachim Quenzer, Ulrich Hofmann, Marten Oldsen
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Publication number: 20100085622Abstract: The present invention relates to a method for producing a micro-mirror actuator and the corresponding actuator. In the method, the actuator is generated from a layered construction made of at least three main layers (101, 103, 107), which are at least sectionally electrically insulated from one another via intermediate layers (102, 104, 106). The layers are structured to form the micro-mirror element and the electrodes, the structuring being performed in such a way that a closed frame (310) is formed from at least the uppermost layer (107) around the inner area of the actuator, which allows a hermetic encapsulation of the inner area by application of a cover plate onto the frame.Type: ApplicationFiled: December 11, 2007Publication date: April 8, 2010Inventors: Ulrich Hofmann, Marten Oldsen
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Publication number: 20100061073Abstract: The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop. Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.Type: ApplicationFiled: January 17, 2008Publication date: March 11, 2010Inventors: Marten Oldsen, Ulrich Hofmann
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Publication number: 20100025845Abstract: The present application relates to a multiple component which is to be subsequently individualized by forming components containing active structures, in addition to a corresponding component which can be used in microsystem technology systems. The multiple component and/or component comprises a flat substrate and also a flat cap structure which are bound to each other such that they surround at least one first and one second cavity per component, which are sealed against each other and towards the outside. The first of the two cavities is provided with getter material and due to the getter material has a different internal pressure and/or a different gas composition than the second cavity. The present application also relates to a method for producing the type of component and/or components for which gas mixtures of various types of gas have a different absorption ratio in relation to the getter material.Type: ApplicationFiled: April 4, 2007Publication date: February 4, 2010Inventors: Peter Merz, Wolfgang Reinert, Marten Oldsen, Oliver Schwarzelbach
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Publication number: 20080317995Abstract: The invention relates to a cover wafer with a core (1) and with an inside (7, 10, 11), whereby the inside has one or more annular outer areas (7), (an) annular area(s) (10), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s) (11), and to a component cover with only one annular outer area on its inside. The invention is characterized in that at least area(s) (10) has/have a buffer layer, which has a wetting angle of <35° for a metallic eutectic solution that melts in a range of >265° C. to 450° C. The invention also relates to a component cover having one of the areas (7), (10) and (11), which has said buffer layer in a comparable manner. The invention additionally relates to a wafer component or to a component, which can be inserted using microsystem technology and which has a cover wafer or component cover applied with the aid of the solder material, and to a method for the production thereof.Type: ApplicationFiled: November 8, 2006Publication date: December 25, 2008Inventors: Marten Oldsen, Wolfgang Reinert, Peter Merz
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Patent number: 7410828Abstract: A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.Type: GrantFiled: July 12, 2007Date of Patent: August 12, 2008Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.Inventors: Hans Joachim Quenzer, Peter Merz, Marten Oldsen, Wolfgang Reinert