Abstract: A display system includes a housing having at least one optical window and at least one charge-controlled spatial light-modulator disposed within the housing. The at least one spatial light-modulator is configured to project an image-bearing light beam to a viewing surface through the at least one optical window. The system further includes at least one electron gun selectively positioned at a predetermined angle with respect to the at least one spatial light-modulator. The electron gun is configured to project an electron beam into the housing to impinge a front surface of the at least one spatial light-modulator.

Abstract: One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.

Abstract: A light modulator array includes a plurality of light modulator devices, each the light modulator device including a resistor, a conductor coupled to a first end of the resistor, a post coupled to a second end of the resistor, and a reflective plate supported by the post, an insulator separating a first of the modulator devices from an adjacent light modulator device, and an energy penetration reducer configured to prevent the insulator from becoming conductive in a region between a resistor of the first light modulator device and a conductor of the adjacent device.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: A reflective member is formed and spaced from a provided partial reflective layer. The reflective member is movable relative to the partial reflective layer.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced stops in the first side of the substrate, partially forming a first portion of the opening in the substrate from the second side by a first process, further forming the first portion of the opening in the substrate from the second side by a second process, including forming the first portion of the opening to the spaced stops, and forming a second portion of the opening in the substrate from the first side, including forming the second portion of the opening between the spaced stops.

Abstract: A process for creating and an apparatus employing reentrant (pointing or directed inward) shaped orifices in a semiconductor substrate. A layer of graded dielectric material is deposited on the semiconductor substrate. A masked photoimagable material is deposited upon the graded dielectric material and exposed to electromagnetic energy such that a patterned photoimagable material is created. The patterned photoimagable material is developed to unveil the graded dielectric material which is then anisotropically etched. The bore in the graded dielectric material is then isotropically etched to complete the creation of holes in the substrate.

Abstract: A process for creating and an apparatus employing reentrant (pointing or directed inward) shaped orifices in a semiconductor substrate. A layer of graded dielectric material is deposited on the semiconductor substrate. A masked photoimagable material is deposited upon the graded dielectric material and exposed to electromagnetic energy such that a patterned photoimagable material is created. The patterned photoimagable material is developed to unveil the graded dielectric material which is then anisotropically etched. The bore in the graded dielectric material is then isotropically etched to complete the creation of holes in the substrate.

Abstract: A process for creating and an apparatus employing reentrant (pointing or directed inward) shaped orifices in a semiconductor substrate. A layer of graded dielectric material is deposited on the semiconductor substrate. A masked photoimagable material is deposited upon the graded dielectric material and exposed to electromagnetic energy such that a patterned photoimagable material is created. The patterned photoimagable material is developed to unveil the graded dielectric material which is then anisotropically etched. The bore in the graded dielectric material is then isotropically etched to complete the creation of holes in the substrate.