Abstract: In one embodiment, a fluid ejector structure includes: a chamber for containing a fluid; a flexible membrane forming one wall of the chamber; a plurality of piezoelectric elements; a backing operatively connected to the piezoelectric elements such that an expansion and/or contraction of a piezoelectric element causes the piezoelectric element to bend; a rigid plate overlaying a center portion of the membrane; a post coupling the piezoelectric elements to the plate through the backing such that a movement of each piezoelectric element toward the chamber is transmitted to the plate through the post. The plate is configured to transmit movement of the post to the membrane in a rigid, or substantially rigid, piston-like manner.

Abstract: In one embodiment, a fluid ejector structure includes an orifice sub-structure and an ejector element sub-structure direct contact bonded together along a direct contact bonding interface. The orifice sub-structure has a plurality of orifices therein. Each orifice is positioned adjacent to a corresponding one of a plurality of fluid ejection elements on the ejector element sub-structure.

Abstract: In one embodiment, a fluid ejector structure includes: a chamber for containing a fluid; a flexible membrane forming one wall of the chamber; a plurality of piezoelectric elements; a backing operatively connected to the piezoelectric elements such that an expansion and/or contraction of a piezoelectric element causes the piezoelectric element to bend; a rigid plate overlaying a center portion of the membrane; a post coupling the piezoelectric elements to the plate through the backing such that a movement of each piezoelectric element toward the chamber is transmitted to the plate through the post. The plate is configured to transmit movement of the post to the membrane in a rigid, or substantially rigid, piston-like manner.

Abstract: In one embodiment a method of making an electrostatic actuator includes: forming a first conductor over a first substrate to form a first structure; forming a flexible second conductor over a second substrate to form a second structure; forming an etch stop over the first conductor as part of the first structure or over the second conductor as part of the second structure; forming a spacer on the etch stop, the spacer selectively etchable with respect to the etch stop; etching the spacer through to the etch stop at a location of a gap between the first conductor and the second conductor; and bonding the first structure and the second structure together such that the first conductor is located opposite the second conductor across the gap.

Abstract: In one embodiment, a fluid ejector structure includes an orifice sub-structure and an ejector element sub-structure direct contact bonded together along a direct contact bonding interface. The orifice sub-structure has a plurality of orifices therein. Each orifice is positioned adjacent to a corresponding one of a plurality of fluid ejection elements on the ejector element sub-structure.

Abstract: In one embodiment a method of making an electrostatic actuator includes: forming a first conductor over a first substrate to form a first structure; forming a flexible second conductor over a second substrate to form a second structure; forming an etch stop over the first conductor as part of the first structure or over the second conductor as part of the second structure; forming a spacer on the etch stop, the spacer selectively etchable with respect to the etch stop; etching the spacer through to the etch stop at a location of a gap between the first conductor and the second conductor; and bonding the first structure and the second structure together such that the first conductor is located opposite the second conductor across the gap.

Abstract: One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.

Abstract: A light modulator array includes a plurality of light modulator devices, each the light modulator device including a resistor, a conductor coupled to a first end of the resistor, a post coupled to a second end of the resistor, and a reflective plate supported by the post, an insulator separating a first of the modulator devices from an adjacent light modulator device, and an energy penetration reducer configured to prevent the insulator from becoming conductive in a region between a resistor of the first light modulator device and a conductor of the adjacent device.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.

Abstract: The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling slot.

Abstract: A display system includes a housing having at least one optical window and at least one charge-controlled spatial light-modulator disposed within the housing. The at least one spatial light-modulator is configured to project an image-bearing light beam to a viewing surface through the at least one optical window. The system further includes at least one electron gun selectively positioned at a predetermined angle with respect to the at least one spatial light-modulator. The electron gun is configured to project an electron beam into the housing to impinge a front surface of the at least one spatial light-modulator.

Abstract: One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.

Abstract: A light modulator array includes a plurality of light modulator devices, each the light modulator device including a resistor, a conductor coupled to a first end of the resistor, a post coupled to a second end of the resistor, and a reflective plate supported by the post, an insulator separating a first of the modulator devices from an adjacent light modulator device, and an energy penetration reducer configured to prevent the insulator from becoming conductive in a region between a resistor of the first light modulator device and a conductor of the adjacent device.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: A reflective member is formed and spaced from a provided partial reflective layer. The reflective member is movable relative to the partial reflective layer.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One embodiment includes a substrate, and a slot received in the substrate. The slot has a central region and one or more terminal region(s). The central region extends at least in part along a pair of sidewalls. Individual terminal region(s) being defined by a terminal sidewall at least a portion of which extends away from both sidewalls of the central region.