Abstract: A method for fixing an attachment object to a side of a patterned object comprising a plurality of protrusions with tip portions, by pressure-sintering. A deformation uptake means made of a material having a lower yield strength and/or a lower hardness than the tip portions, is arranged between the patterned object and at least a fraction of the tip portions.

Abstract: Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.

Abstract: A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).

Abstract: An apparatus and a method for packaging substantially plate-shaped or cuboid-shaped products in the food industry in a packaging material film, the apparatus having feeding devices for feeding products to a packaging station; guiding devices for feeding a blank of the packaging material film to the packaging station, wherein the product is inserted into the blank such that the packaging material film substantially wraps around the product; discharge devices for discharging the product from the packaging station in a wrapped state; and holding devices being movably configured and arranged to move with the product through the packaging station.

Abstract: A household dishwasher includes a dishwasher cavity for receiving items to be washed for treatment, and a structural unit sized to extend over at least half of a width of the household dishwasher. The structural unit includes an air outlet for blowing air out of the dishwasher cavity, an extensive slotted blow-out opening in an upper region of the structural unit, and a collecting tank in a lower region of the structural unit for collecting condensate.

Abstract: Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.

Abstract: A method for fixing an attachment object to a side of a patterned object comprising a plurality of protrusions with tip portions, by pressure-sintering. A deformation uptake means made of a material having a lower yield strength and/or a lower hardness than the tip portions, is arranged between the patterned object and at least a fraction of the tip portions.

Abstract: A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.

Abstract: A household dishwasher includes a dishwasher cavity for receiving items to be washed for treatment, and a structural unit sized to extend over at least half of a width of the household dishwasher. The structural unit includes an air outlet for blowing air out of the dishwasher cavity, an extensive slotted blow-out opening in an upper region of the structural unit, and a collecting tank in a lower region of the structural unit for collecting condensate.

Abstract: An apparatus and a method for packaging substantially plate-shaped or cuboid-shaped products in the food industry in a packaging material film, the apparatus having feeding devices for feeding products to a packaging station; guiding devices for feeding a blank of the packaging material film to the packaging station, wherein the product is inserted into the blank such that the packaging material film substantially wraps around the product; discharge devices for discharging the product from the packaging station in a wrapped state; and holding devices being movably configured and arranged to move with the product through the packaging station.

Abstract: A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).

Abstract: A dishwasher cavity for a household dishwasher includes a bottom panel having a bottom portion, and a U-shaped dishwasher cavity jacket arranged on the bottom panel and fixedly connected thereto, with the bottom panel and the dishwasher cavity jacket configured to form an attachment flange that encircles the dishwasher cavity. A back panel is attached to the bottom panel and to the dishwasher cavity jacket via the attachment flange. The bottom panel includes a stamped step, which faces in a direction of a top panel of the dishwasher cavity jacket and protrudes out of the bottom portion of the bottom panel, with the attachment flange having a part formed on the stamped step.

Abstract: Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.

Abstract: Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.

Abstract: A household dishwasher includes a dishwasher cavity which includes a base having a first connection flange, a dishwasher cavity casing connected to the base, and a rear wall connected to both the base and the dishwasher cavity casing. The rear wall includes a second connection flange having at least one section resting against the first connection flange. The second connection flange has a deformation region which projects beyond the first connection flange and is bent in a direction oriented away from the first connection flange in such a way that the deformation region rests against the second connection flange.

Abstract: A method for undetachably introducing a guiding aid element into at least one joining location of at least one component is provided. The method includes the acts of: a) perforating the at least one component at the at least one joining location in a first press stroke of a tool press, wherein a preliminary hole is formed at the at least one joining location; b) inserting a joining aid element into the at least one preliminary hole; and c) pressing the at least one joining aid element with the at least one component in a subsequent press stroke or working step to form a material-bonding, form-fitting and/or force-fitting connection between the at least one component and the at least one joining aid element. A component and a composite component produced by such a method are also provided.

Abstract: A rotor, for a turbomachine, in particular a gas turbine, having a first flange and a second flange with recesses that are distributed in a direction of distribution, in particular in the peripheral direction, wherein the second flange is fastened to the first flange, in particular detachably, by at least one fastener, which engage in the first of these recesses of the first and second flanges, wherein second ones of these recesses of the first flange, which are free of a fastener, are covered by the second flange.

Abstract: A dishwasher cavity for a household dishwasher includes a bottom panel having a bottom portion, and a U-shaped dishwasher cavity jacket arranged on the bottom panel and fixedly connected thereto, with the bottom panel and the dishwasher cavity jacket configured to form an attachment flange that encircles the dishwasher cavity. A back panel is attached to the bottom panel and to the dishwasher cavity jacket via the attachment flange. The bottom panel includes a stamped step, which faces in a direction of a top panel of the dishwasher cavity jacket and protrudes out of the bottom portion of the bottom panel, with the attachment flange having a part formed on the stamped step.