Patents by Inventor Martin Jeff Salinas

Martin Jeff Salinas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110094683
    Abstract: Apparatus for plasma processing are provided. In some embodiments, an RF feed structure includes a first RF feed to couple RF power to a plurality of symmetrically arranged stacked first RF coil elements; a second RF feed coaxially disposed about the first RF feed and electrically insulated therefrom, the second RF feed to couple RF power to a plurality of symmetrically arranged stacked second RF coil elements coaxially disposed with respect to the first RF coil elements. In some embodiments, a plasma processing apparatus includes a first RF coil; a second RF coil coaxially disposed with respect to the first RF coil; a first RF feed coupled to the first RF coil to provide RF power thereto; and a second RF feed coaxially disposed with respect to the first RF feed and electrically insulated therefrom, the second RF feed coupled to the second RF coil to provide RF power thereto.
    Type: Application
    Filed: June 23, 2010
    Publication date: April 28, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: ZHIGANG CHEN, SHAHID RAUF, KENNETH S. COLLINS, MARTIN JEFF SALINAS, SAMER BANNA, VALENTIN N. TODOROW
  • Publication number: 20110097901
    Abstract: Embodiments of dual mode inductively coupled plasma reactors and methods of use of same are provided herein. In some embodiments, a dual mode inductively coupled plasma processing system may include a process chamber having a dielectric lid and a plasma source assembly disposed above the dielectric lid. The plasma source assembly includes a plurality of coils configured to inductively couple RF energy into the process chamber to form and maintain a plasma therein, a phase controller for adjusting the relative phase of the RF current applied to each coil in the plurality of coils, and an RF generator coupled to the phase controller and the plurality of coils.
    Type: Application
    Filed: June 23, 2010
    Publication date: April 28, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: SAMER BANNA, VALENTIN N. TODOROW, KENNETH S. COLLINS, ANDREW NGUYEN, MARTIN JEFF SALINAS, ZHIGANG CHEN, ANKUR AGARWAL, ANNIRUDDHA PAL, TSE-CHIANG WANG, SHAHID RAUF
  • Patent number: 7741585
    Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: June 22, 2010
    Assignee: Sokudo Co., Ltd.
    Inventors: David H. Quach, Martin Jeff Salinas
  • Patent number: 7601934
    Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: October 13, 2009
    Assignee: Sokudo Co., Ltd.
    Inventors: David H. Quach, Martin Jeff Salinas
  • Publication number: 20090032522
    Abstract: A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned sig
    Type: Application
    Filed: August 15, 2008
    Publication date: February 5, 2009
    Applicant: SOKUDO CO., LTD.
    Inventors: Martin Jeff Salinas, David H. Quach
  • Publication number: 20080260966
    Abstract: Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a method of controlling a plasma in a process chamber includes providing a chamber for processing a substrate and having a processing volume defined therein wherein a plasma is to be formed during operation, the chamber further having a plasma control magnet assembly comprising a plurality of magnets that provide a magnetic field having a magnitude is greater than about 10 Gauss in an upper region of the processing volume and less than about 10 Gauss in a lower region of the processing volume proximate a substrate to be processed; supplying a process gas to the chamber; and forming a plasma in the processing volume from the process gas.
    Type: Application
    Filed: April 22, 2007
    Publication date: October 23, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hiroji Hanawa, Andrew Nguyen, Keiji Horioka, Kallol Bera, Kenneth S. Collins, Lawrence Wong, Martin Jeff Salinas, Roger Alan Lindley, Hong S. Yang
  • Publication number: 20080257261
    Abstract: Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a plasma control magnet assembly includes a plurality of magnets arranged in a predetermined pattern that generate a magnetic field having a strength greater than 10 Gauss in a region proximate the assembly and less than 10 Gauss in a region remote from the assembly.
    Type: Application
    Filed: April 22, 2007
    Publication date: October 23, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hiroji Hanawa, Andrew Nguyen, Keiji Horiaka, Kallol Bera, Kenneth S. Collins, Lawrence Wong, Martin Jeff Salinas, Roger Alan Lindley, Hong S. Yang
  • Patent number: 7427728
    Abstract: A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned sig
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: September 23, 2008
    Assignee: Sokudo Co., Ltd.
    Inventors: Martin Jeff Salinas, David H. Quach
  • Publication number: 20080145191
    Abstract: A substrate transport module adapted to transport a substrate in a processing chamber of a semiconductor processing apparatus. The substrate transport module includes a substrate cooling surface and a plurality of coolant channels disposed in the substrate transport module and in thermal communication with the substrate cooling surface. The substrate transport module also includes a plurality of vacuum channels disposed in the substrate transport module and a plurality of proximity pins extending to a predetermined height above the substrate cooling surface. Each of the plurality of proximity pins is in fluid communication with one or more of the plurality of vacuum channels.
    Type: Application
    Filed: March 21, 2007
    Publication date: June 19, 2008
    Applicant: SOKUDO CO., LTD.
    Inventors: Martin Jeff Salinas, Tetsuya Ishikawa, David H. Quach, Natarajan Ramanan
  • Publication number: 20080006619
    Abstract: A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned sig
    Type: Application
    Filed: July 7, 2006
    Publication date: January 10, 2008
    Applicant: Applied Materials, INC.
    Inventors: Martin Jeff Salinas, David H. Quach
  • Patent number: 7297906
    Abstract: An integrated thermal unit comprises a bake station comprising a bake plate configured to hold and heat a substrate; a chill station comprising a chill plate configured to hold and cool a substrate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the chill plate along a horizontally linear path within the thermal unit and raise and lower substrates along a vertical path within the integrated thermal unit.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: November 20, 2007
    Assignee: Sokudo Co., Ltd.
    Inventors: David H. Quach, Martin Jeff Salinas
  • Patent number: 7282675
    Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: October 16, 2007
    Assignee: Sokudo Co., Ltd.
    Inventors: David H. Quach, Martin Jeff Salinas