Abstract: A post socket includes a housing, a compressible sleeve within the housing, the sleeve being moveable between a first position in which the sleeve has a first internal width and a second position in which the sleeve has a second internal width, a linkage pivotably connected to the sleeve, and an actuator for actuating the linkage to move the sleeve from the first position to the second position to grip a post therein, the linkage including a linkage body connected to the actuator, the linkage further including at least one arm including a first end and a second end, the actuator being configured so that its actuation moves the linkage body to thereby move the first end and the second end of the at least one arm and thus move the sleeve from the first position to the second position.

Abstract: A post socket includes a housing, a compressible sleeve within the housing, the sleeve being moveable between a first position in which the sleeve has a first internal width and a second position in which the sleeve has a second internal width, a linkage pivotably connected to the sleeve, and an actuator for actuating the linkage to move the sleeve from the first position to the second position to grip a post therein, the linkage including a linkage body connected to the actuator, the linkage further including at least one arm including a first end and a second end, the actuator being configured so that its actuation moves the linkage body to thereby move the first end and the second end of the at least one arm and thus move the sleeve from the first position to the second position.

Abstract: Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl]4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.

Abstract: Amino benzoates have been found to be useful curing agents for epoxy resins particularly para amino benzoates containing at least two primary amine groups and at least two carboxyl moieties, the amino benzoates are particularly useful as curatives in prepregs.

Abstract: One or more layers of structured thermoplastic polymer, such as a light weight veil of thermoplastic polymer fibers, are located within the interleaf zone of laminates that are composed of fibrous layers and thermosetting resin. The thermoplastic veils are used in the interleaf zones as a replacement for thermoplastic toughening particles. The structured thermoplastic polymer may be coated with a conductive material to improve electrical conductivity through the laminate.

Abstract: A resin composition for producing a composite, wherein the composition comprises (a) resin component comprising a glycidyl bisphenol Z epoxy resin, and (b) a curing agent.

Abstract: A mailer can include an envelope and an enclosure. A method can include: a) providing a blank with envelope and enclosure portions connected by a joint; b) folding and securing the blank such that the envelope portion forms a pouch, the pouch substantially containing the enclosure portion, the pouch being open at one end and having major surfaces, one major surface including the joint at or adjacent the open end, and another major surface including a closure flap extending from the open end beyond the joint; c) reversibly deflecting the flap away from the joint to thereby expose the joint; d) severing the joint while it is exposed; e) folding the closure flap and securing it to the one major surface to close the pouch and secure the enclosure within the pouch. An apparatus can be configured to carry out the above method.

Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: Amino benzoates have been found to be useful curing agents for epoxy resins particularly para amino benzoates containing at least two primary amine groups and at least two carboxyl moieties, the amino benzoates are particularly useful as curatives in prepregs.

Abstract: Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl] 4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.

Abstract: Liquid alkoxy-substituted methylene bis anilines have been found to be useful curing agents for epoxy resins and have also been found to be more readily formulated with epoxy resins, the substituents on the aromatic groups of the methylene bis anilines include an alkoxy group and/or the mixtures of materials are selected in order to obtain the liquid products.

Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.

Abstract: A prepreg comprising resin and at least one fiber layer and further comprising an electrically insulating layer and an electrically conducting layer is provided, and particularly wherein the conductive layer is at or near the top surface, beneath that is the insulating layer and beneath that is a fiber/resin interleaf structure.

Abstract: The invention provides a prepreg comprising matrix and fibers, having deposited thereon a plurality of regions raised at least 5 micrometers relative to the surface of the matrix, a method of preparing such a prepreg, a method of curing a laminate of a plurality of such preprags and the cured laminate produced by such a method.

Abstract: A prepreg comprising a single structural layer of electrically conductive unidirectional fibres and a first outer layer of curable resin substantially free of structural fibres, and optionally a second outer layer of curable resin substantially free of structural fibres, the sum of the thicknesses of the first and second outer resin layers at a given point having an average of at least 10 micrometres and varying over at least the range of from 50% to 120% of the average value, and wherein the first outer layer comprises electrically conductive particles.

Abstract: A prepreg comprising a fibre reinforced curable resin, the prepreg containing electrically conductive particles in the range of from 0.5 to 10% by weight based on the resin, the electrically conductive particles comprising potato shaped graphite.

Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.