Patents by Inventor Martin Simmons
Martin Simmons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8900486Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.Type: GrantFiled: June 5, 2009Date of Patent: December 2, 2014Assignee: Hexcel Composites LimitedInventors: Martin Simmons, John Cawse
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Patent number: 8866790Abstract: A method of tracking multiple touches over time on a touch sensor, for example a capacitive touch screen. The method analyzes first and second touch data sets from adjacent first and second time frames. First, the touch data sets are analyzed to determine the closest touch in the second time frame to each of the touches in the first time frame, and calculating the separation between each such pair of touches. Then, starting with the pair of touches having the smallest separation, each pair is validated until a pairing is attempted between touches for which the touch in the second time frame has already been paired. At this point, the as-yet unpaired touches from the first and second touch data sets are re-processed by re-applying the computations but only including the as-yet unpaired touches. This re-processing is iterated until no further pairings need to be made. The method avoids complex algebra and floating point operations, and has little memory requirement.Type: GrantFiled: October 21, 2008Date of Patent: October 21, 2014Assignee: Atmel CorporationInventors: Martin Simmons, Daniel Pickett
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Patent number: 8823656Abstract: The examples enable tracking of a touch gesture that may extend across a discontinuity between two or more touch screens of a mobile device or the like.Type: GrantFiled: August 30, 2010Date of Patent: September 2, 2014Assignee: Atmel CorporationInventor: Martin Simmons
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Publication number: 20140217332Abstract: A prepreg comprising a fibre reinforced curable resin, the curable resin being composed of 25 to 35 weight percent tetrafunctional epoxy resin based on the total weight of the curable resin; 18 to 28 weight percent difunctional epoxy resin; 4 to 18 weight percent polyether sulfone; 2 to 10 weight percent polyamide 12 particles; 2 to 10 weight percent polyamide 11 particles; 1 to 8 weight percent potato shaped graphite particles; and 17.4 to 27.4 weight percent of a curing agent for said curable resin.Type: ApplicationFiled: April 10, 2014Publication date: August 7, 2014Applicants: HEXCEL CORPORATION, HEXCEL COMPOSITES LIMITEDInventors: Martin Simmons, Dana Blair, David Tilbrook, Maureen Boyle
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Patent number: 8659557Abstract: A method of determining touches from a data set output from a touch screen comprising an array of sensing nodes. The method comprises analyzing the dataset and identifies a node with a maximum signal value among all unassigned nodes, and, if present, assigns that node to a touch. A logical test is applied to each node that is a neighbor to the assigned node to determine if that node should also be assigned to the touch and the logical test is repeatedly applied to the unassigned neighbors of each newly assigned node until there are no more newly assigned nodes, or no more unassigned nodes, thereby assigning a group of nodes to the touch defining its area. This process can be repeated until all of the nodes of a touch panel are assigned to a touch. The method is ideally suited to implementation on a microcontroller.Type: GrantFiled: October 21, 2008Date of Patent: February 25, 2014Assignee: Atmel CorporationInventors: Martin Simmons, David Pickett
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Publication number: 20140047710Abstract: A composite material, the composite material comprising a prepreg, said prepreg comprising at least one polymeric resin and at least one conductive fibrous reinforcement, electrically conducting particles dispersed in the polymeric resin and a top layer of a metal-coated carbon fibre comprising a further resin component, wherein the metal comprises one or more metals selected from nickel, copper, gold, platinum, palladium, indium and silver.Type: ApplicationFiled: August 22, 2013Publication date: February 20, 2014Applicant: Hexcel Corposites LimitedInventors: Martin Simmons, John Cawse
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Publication number: 20130330514Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and glassy carbon particles dispersed in the polymeric resin.Type: ApplicationFiled: August 9, 2013Publication date: December 12, 2013Applicant: Hexcel Composites LimitedInventors: John Cawse, Martin Simmons, George Green
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Patent number: 8517300Abstract: A composite material, the composite material comprising a prepreg, said prepreg comprising at least one polymeric resin and at least one conductive fibrous reinforcement, electrically conducting particles dispersed in the polymeric resin and a top layer of a metal-coated carbon fiber comprising a further resin component, wherein the metal comprises one or more metals selected from nickel, copper, gold, platinum, palladium, indium and silver.Type: GrantFiled: March 6, 2009Date of Patent: August 27, 2013Assignee: Hexcel Composites LimitedInventors: Martin Simmons, John Cawse
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Publication number: 20130071626Abstract: A prepreg comprising a single structural layer of electrically conductive unidirectional fibers and a first outer layer of curable resin substantially free of structural fibers, and optionally a second outer layer of curable resin substantially free of structural fibers, the sum of the thicknesses of the first and second outer resin layers at a given point having an average of at least 10 micrometers and varying over at least the range of from 50% to 120% of the average value, and wherein the first outer layer comprises electrically conductive particles.Type: ApplicationFiled: December 20, 2011Publication date: March 21, 2013Applicant: HEXCEL COMPOSITES LIMITEDInventors: Martin Simmons, John Ellis
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Patent number: 8313825Abstract: A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a solution of a reducing agent and a solution of a metal ion, the reducing agent and metal ion undergoing chemical reaction activated by the activator to form an electrically conductive metal region on the surface, and method of forming is provided.Type: GrantFiled: September 19, 2007Date of Patent: November 20, 2012Assignees: Hexcel Composites Limited, Conductive Inkjet Technology LimitedInventors: Martin Simmons, John Leslie Cawse, Ian Rees, Xiuyan Sun
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Patent number: 8263503Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.Type: GrantFiled: December 22, 2010Date of Patent: September 11, 2012Assignee: Hexcel Composites, Ltd.Inventors: John L. Cawse, Martin Simmons, George Green
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Publication number: 20120141763Abstract: A curable prepreg comprising a structural layer of conductive fibres and a first outer layer of thermosetting resin, the resin layer comprising thermoplastic particles and glassy carbon particles provides improved electrical conductivity and excellent mechanical properties.Type: ApplicationFiled: September 2, 2010Publication date: June 7, 2012Applicant: HEXCEL COMPOSITES, LTD.Inventors: John Cawse, Martin Simmons
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Publication number: 20120050177Abstract: The examples enable tracking of a touch gesture that may extend across a discontinuity between two or more touch screens of a mobile device or the like.Type: ApplicationFiled: August 30, 2010Publication date: March 1, 2012Inventor: Martin SIMMONS
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Patent number: 8105964Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.Type: GrantFiled: December 20, 2010Date of Patent: January 31, 2012Assignee: Hexcel Composites, Ltd.Inventors: John L. Cawse, Martin Simmons, George Green
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Publication number: 20110294387Abstract: One or more layers of structured thermoplastic polymer, such as a light weight veil of thermoplastic polymer fibers, are located within the interleaf zone of laminates that are composed of fibrous layers and thermosetting resin. The thermoplastic veils are used in the interleaf zones as a replacement for thermoplastic toughening particles. The structured thermoplastic polymer may be coated with a conductive material to improve electrical conductivity through the laminate.Type: ApplicationFiled: June 22, 2011Publication date: December 1, 2011Applicant: Hexcel Composites, Ltd.Inventors: Martin Simmons, Dana Blair, Steve Mortimer
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Publication number: 20110174522Abstract: A prepreg comprising resin and at least one fibre layer and further comprising an electrically insulating layer and an electrically conducting layer is provided, and particularly wherein the conductive layer is at or near the top surface, beneath that is the insulating layer and beneath that is a fibre/resin interleaf structure.Type: ApplicationFiled: September 11, 2009Publication date: July 21, 2011Applicant: Hexcel Composites, Ltd.Inventors: Martin Simmons, Michael Jeschke
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Publication number: 20110163275Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.Type: ApplicationFiled: June 5, 2009Publication date: July 7, 2011Applicant: Hexcel Composites, Ltd.Inventors: Martin Simmons, John Cawse
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Publication number: 20110091718Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.Type: ApplicationFiled: December 20, 2010Publication date: April 21, 2011Applicant: Hexcel Composites, Ltd.Inventors: John L. Cawse, Martin Simmons, George Green
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Publication number: 20110088923Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.Type: ApplicationFiled: December 22, 2010Publication date: April 21, 2011Applicant: Hexcel Composites, Ltd.Inventors: John L. Cawse, Martin Simmons, George Green
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Publication number: 20110091719Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.Type: ApplicationFiled: December 20, 2010Publication date: April 21, 2011Applicant: Hexcel Composites, Ltd.Inventors: John L. Cawse, Martin Simmons, George Green