Patents by Inventor Martin W. Bayes

Martin W. Bayes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Seed layer repair method
    Patent number: 6531046
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: March 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, III, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
  • Electrochemical co-deposition of metals for electronic device manufacture
    Publication number: 20020127847
    Abstract: New compositions and methods for electrolytic deposition of metal layers, including metal traces, (e.g. circuit patterns) that are electrically segregated from adjacent traces in an electronic device, such as a semiconductor wafer or a printed circuit board. The invention includes providing the segregated traces by compositionally modulated plating methods, i.e. for example where a single plating bath (electrolyte) is employed to deposit two different metals at differing current densities or reduction potentials.
    Type: Application
    Filed: November 3, 2001
    Publication date: September 12, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Eric R. Alling, Martin W. Bayes
  • Plating bath
    Publication number: 20020090484
    Abstract: Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 11, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald R. Storjohann
  • Seed layer repair bath
    Publication number: 20020088713
    Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 11, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Seed layer
    Publication number: 20020084193
    Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 4, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Method for replenishing baths
    Patent number: 6372055
    Abstract: Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: April 16, 2002
    Assignee: Shipley Company, L.L.C.
    Inventors: Joseph R. Montano, Kimberly B. Wynja, Edward C. Couble, Martin W. Bayes
  • Seed layer repair method
    Publication number: 20020000382
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Application
    Filed: December 15, 2000
    Publication date: January 3, 2002
    Applicant: Shipley Company, L.L.C. of Marlborough
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
  • Composition for circuit board manufacture
    Patent number: 6261466
    Abstract: A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterized by elimination of a surfactant from solution.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: July 17, 2001
    Assignee: Shipley Company, L.L.C.
    Inventors: Martin W. Bayes, Peter W. Hinkley, John P. Cahalen, Peter A. Benson
  • Methods for manufacture of electronic devices
    Patent number: 6139762
    Abstract: The present invention relates to new methods for manufacturing electronic packaging devices, particularly printed circuit boards. Methods of the invention include use of reduced pH sweller and etch treatments that can produce printed circuit boards and other devices that are substantially more robust and reliable than produced by prior methods.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: October 31, 2000
    Assignee: Shipley Company, L.L.C.
    Inventors: Christopher P. Esposito, Takahiro Kobayashi, Masaki Kondoh, Martin W. Bayes
  • Process for the treatment of copper oxide in the preparation of printed circuit boards
    Patent number: 4717439
    Abstract: A composition and process is disclosed for improving the leach resistance of the copper oxide coating on the copper circuitry of printed circuit boards to solutions used in their preparation which comprises contacting the copper oxide of the circuit board with a solution containing an amphoteric element which forms an acidic oxide, such as selenium dioxide.
    Type: Grant
    Filed: October 24, 1985
    Date of Patent: January 5, 1988
    Assignee: Enthone, Incorporated
    Inventors: Juan Hajdu, Martin W. Bayes