Abstract: One or more LIMMS devices on a substrate, possibly having same-surface signal conductors, are hermetically sealed by either: (a) Enclosing each entire LIMMS device beneath a common or respective outer cover that is separate from the LIMMS device(s) and impervious to contaminants; or (b) Fabricating each LIMMS device such that its individual cover block (which is already a component of the LIMMS and is not a separate outer cover) can be hermetically sealed against the substrate. Each case must limit the effects of the hermetic seal upon impedances. In case (a) the substrate is covered with a layer of dielectric material matching the ribbon-like footprint of the perimeter of the separate outer cover. In case (b), the entire (solid) footprint of the LIMMS cover block on the substrate receives a layer of dielectric material, which may itself then be covered, save for near its perimeter, with suitable adhesive. In case (a) the outer cover may be soldered to the perimeter footprint.

Abstract: A pressure actuated optical relay containing a transparent mirror housing, located at the intersection of two optical paths. A solid slug is moved within a channel passing through the transparent mirror housing by the action of pressure exerted by an actuation fluid. The solid slug is moved in or out of the transparent mirror housing to select between the optical paths and is wetted by a liquid metal. When the solid slug is within the optical path, an incoming optical signal is reflected from a wetted surface of the slug. The liquid metal forms a surface tension bond between the slug and wettable metal surfaces within the channel to provide a latching mechanism.

Abstract: Fluid-based switches are disclosed. In one embodiment, the switch comprises first and second mated substrates defining therebetween at least portions of a number of cavities, the first substrate defining a plurality of indentations defined within a first one of the cavities, a plurality of electrical contacts, each electrical contact deposited within one of the indentations, a switching fluid, held within the first cavity, that serves to open and close at least a pair of the plurality of electrical contacts in response to forces that are applied to the switching fluid, and an actuating fluid, held within one or more of the cavities, that applies the forces to the switching fluid.

Abstract: A switch and method for producing the same. In one embodiment, the switch is produced by depositing a liquid switching element on a substrate, the volume of the liquid switching element being more than needed to fulfill a switching function. A channel plate is moved toward the substrate, the channel plate having a main channel with at least one reservoir fluidically connected thereto, an excess portion of the liquid switching element flowing into the least one reservoir. The channel plate is closed against the substrate.

Abstract: Fluid-based switch and methods for reducing oxides and corrosion products within the switch are disclosed. In one method, oxides are reduced by depositing a gettering agent within the cavity, depositing a switching fluid on a first substrate, and mating the first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.

Abstract: Fluid-based switch and methods for reducing oxides and corrosion products on switching fluid are disclosed. In one method, oxides are reduced by depositing a switching fluid on a first substrate, coating the switching fluid with a corrosion inhibitor, and mating the first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.

Abstract: Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.

Abstract: An efficient way to fabricate the channels and cavities in a LIMMS device is to form them as matching upper and lower portions each created as a patterned layer of thick film dielectric material deposited on a respective upper or lower substrate. The two portions are adhered together by a patterned layer of adhesive, and hermetically sealed around an outer perimeter. The heater resistors are mounted atop the lower layer, thus suspending them away from that substrate and exposing more of their surface area. Vias can be used to route the conductors for the heaters and the switched signal contacts through the lower substrate to cooperate with surface mount techniques using solder balls on an array of contact pads. These vias can be made hermetic by their placement within the patterned layers of dielectric material and by covering their exposed ends with pads of hermetic metal.

Abstract: A switch and production thereof. The switch may be produced by (1) depositing a liquid switching element on a substrate, (2) positioning a channel plate adjacent the substrate, (3) moving the channel plate toward the substrate, the liquid switching element wetting to the channel plate, and a portion of the liquid switching element isolated into at least one waste chamber in the channel plate; and (4) closing the channel plate against the substrate.

Abstract: A fluid-based switch and method for producing the same are disclosed. In one embodiment, the switch is produced by depositing switching fluid on a first substrate; depositing a reducing material so that the reducing material contacts at least a portion of the switching fluid, the reducing material to react with oxides on the switching fluid, and mating a first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.

Abstract: In a method of producing a plurality of hermetically sealed electronic components, first and second substrates are wafer bonded to enclose a plurality of electronic components therebetween. The first substrate is then cut to expose first seals on the first substrate and second seals on the second substrate. The first and second seals define perimeters around the plurality of electronic components. Solder is dispensed into the cuts in the first substrate, and the solder is then reflowed to join corresponding pairs of first and second seals.

Abstract: A channel plate is mated to a substrate to define at least a portion of a number of cavities. The channel plate is provided with a switching fluid channel, and a pair of ground channels adjacent the switching fluid channel. A switching fluid is held within a cavity defined by the switching fluid channel, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid. In one embodiment, the ground channels are replaced with ground traces. The ground traces may be formed on or in the substrate or channel plate. Switching circuits incorporating one or more these switches are also disclosed.

Abstract: Disclosed herein is a switch having a photoimaged channel plate and a switching fluid. The photoimaged channel plate defines at least a portion of a number of cavities, a first cavity of which is defined by a first channel formed in the photoimaged channel plate. The switching fluid is held within one or more of the cavities, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid.

Abstract: A method and structure for an electrical switch. According to the structure of the present invention, a liquid-filled chamber is housed within a solid material. A plurality of switch contacts within the liquid-filled chamber are coupled to the solid material, while a plurality of piezoelectric elements are coupled to a plurality of membranes. The plurality of membranes are coupled to the liquid-filled chamber. The plurality of switch contacts are coupled to a plurality of liquid metal globules, and a slug is coupled to two of the plurality of switch contacts and further coupled to the plurality of liquid metal globules. According to the method, a piezoelectric element is actuated, causing a membrane element to be deflected.

Abstract: According to the present invention, an assembly and method is provided for preventing beams or switch contacts from overheating due to high power environments. A MEMS switch is packaged so that the beam and switch is surrounded by an inert, low viscosity, dielectric fluid. Utilizing such a construction conductively and convectively dissipates heat generated by resistive heating of the MEMS beam.

Abstract: A method for depositing material on a channel plate such that the material is registered to one or more channels formed in the channel plate includes filling at least one of the channels with a resist that is not wetted by the material; depositing the material on at least a region of the channel plate that includes at least part of the resist; and then removing the resist. The method may be used, in one embodiment, to apply an adhesive or gasket material that is used in assembling a switch.

Abstract: A method and structure for a reflective optical switch. According to the structure, a chamber is housed within a solid material. A plurality of piezoelectric elements within the chamber are coupled to the solid material. A slug within the chamber is operable to be coupled to one or more of the plurality of piezoelectric elements. A liquid metal within the chamber is coupled to the slug. One or more signals of a first one or more optical waveguides coupled to the chamber are operable to be coupled to a second one or more optical waveguides coupled to the chamber. According to the method, one or more of the plurality of piezoelectric elements are actuated, with the actuation of the one or more piezoelectric elements causing the slug coupled to the one or more piezoelectric elements to move from a first number of wetting pads to a second number of wetting pads wherein the first number of wetting pads and the second number of wetting pads are wetted by the liquid metal.

Abstract: Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) depositing a photoimagable dielectric layer onto a substrate, 2) photoimaging at least one channel plate feature on the dielectric layer, and 3) developing the dielectric layer to form the at least one channel plate feature in the dielectric layer, thereby forming the channel plate. Switches using photoimaged channel plates, and a method for making a switch with a photoimaged channel plate, are also disclosed.

Abstract: An electrical relay using conducting liquid in the switching mechanism. Two electrical contacts are held a small distance apart. The facing surfaces of the contacts each support a droplet of a conducting liquid, such as a liquid metal. A piezoelectric actuator is energized to reduce the gap between the electrical contacts, causing the two liquid metal droplets to coalesce and form an electrical circuit. The piezoelectric actuator is then de-energized and the electrical contacts return to their starting positions. The liquid metal droplets remain coalesced because of surface tension. The electrical circuit is broken by energizing a piezoelectric actuator to increase the gap between the electrical contacts and break the surface tension bond between the liquid metal droplets. The droplets remain separated when the piezoelectric actuator is de-energized because there is insufficient liquid metal to bridge the gap between the contacts. The relay is amenable to manufacture by micro-machining techniques.

Abstract: Fluid-based switches and methods for producing the same are disclosed. In one embodiment, a method for producing a switch comprises depositing a first alignment pad on a first substrate, depositing a second alignment pad on a second substrate, depositing solder on at least one of the alignment pads, depositing a switching fluid on the first substrate, and mating the first substrate to the second substrate by aligning the alignment pads and heating the solder, the substrates defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.