Abstract: In order to obtain an evenly flocked and an evenly coated surface of a strip-like elongated workpiece, any slack of the strip-like elongated workpiece is removed not to affect the workpiece when the workpiece travels through an electrostatic flocking and an electrostatic coating chamber at high speed. A slack of the workpiece occurs due to its own weight under the influence of gravity when the workpiece travels through the electrostatic flocking and the electrostatic coating chamber at high speed. A V-shaped oblique surface portion of the workpiece is forcibly defined by a pressure roller in a position corresponding to that of the slack of the strip-like elongated workpiece. An electrode is disposed in parallel to the workpiece's V-shaped oblique surface portion defined by the pressure roller.

Abstract: A laser scanning apparatus scanning a bundle of light rays emitted from a light source of a monolithic multi-beam semiconductor laser in a main scanning direction by being reflected by a polygon mirror includes a first lens to focus the bundle of light rays emitted from the light source and a second lens guiding the bundle of light rays transmitted by the first lens toward a deflection surface of the polygon mirror. In the laser scanning apparatus, the multi-beam semiconductor laser is installed with an imaginary line drawn through light emitting points of the laser inclined with respect to the main scanning direction, the first lens is a convex lens having an anamorphic surface shape on at least one surface focusing the bundle of light rays in front of a slit only in the main scanning direction, and the second lens is a cylindrical lens making the bundle of light rays a bundle of parallel light rays or a bundle of concentrated light rays in the main scanning direction.

Abstract: The invention provides an antenna device 1 that is small in its size but wide in its bandwidth. The recess 2a is formed in the dielectric substrate 2. The shorting electrode 5 is formed on the front surface 2d of the substrate 2 for connecting radiation electrode 3 to each of grounding electrodes 6, 7.

Abstract: A mail server with a forwarding function provided for a company mail server or an ISP mail server with which a user belonging to the company is contracted has at least a user table storing user passwords and the like; an address table storing forwarding addresses for each user; regulating tables for regulating the forwarding time periods of each day and the number of characters in a forwarded e-mail for each forwarding address; and a rejection table for preventing some e-mail from being forwarded based on the contents of the e-mail header or the text. Provided a user is authenticated by a password, the user can assign daily forwarding time periods stored in the table for each of a plurality of terminals, such as a home computer, cellular telephone, or other portable terminal. The user can also input weekly conditions for canceling such forwarding. When the mail server receives e-mail, the server references the rejection table to determine whether the incoming e-mail falls within the forwarding conditions.

Abstract: A semiconductor device for supplying a signal to an electro-optical device which displays a two-dimensional image, includes first terminals which are formed along a first side of the semiconductor device in a longitudinal direction and have a length L1 in a direction intersecting the longitudinal direction at right angles; and second terminals which are formed along a second side intersecting the first side at right angles and have a length L2 which is greater than the length L1 in the longitudinal direction.

Abstract: A workpiece is passed at high speed through an electrostatic flocking chamber provided with an inlet opening and an outlet opening, a distance between which openings is increased to realize optimum flocking conditions for the workpiece being electrostatically flocked. In order to conduct an electrostatic flocking operation of the workpiece by having the workpiece traveled at high speed between the inlet opening and the outlet opening, a pair of electrodes are disposed parallel to a passage of the electrostatic flocking chamber, which passage is increased in length to permit the workpiece to pass through the passage at high speed. A high voltage is applied to a first one of the electrodes, while a low voltage lower than the high voltage is applied to a second one of the electrodes, wherein the first and the second electrode are disposed in the inlet opening's side and the outlet opening's side, respectively.

Abstract: The invention provides an antenna device 1 that is small in its size but wide in its bandwidth. The recess 2a is formed in the dielectric substrate 2. The shorting electrode 5 is formed on the front surface 2d of the substrate 2 for connecting radiation electrode 3 to each of grounding electrodes 6, 7.

Abstract: There is provided a ball-grid-array semiconductor device. The semiconductor device has a semiconductor element sealed with a resin material. In addition, a lead frame is connected to the semiconductor element in the resin material. The lead frame is provided with terminal portions that protrude through the surface of the resin material.

Abstract: There is provided a ball-grid-array semiconductor device. The semiconductor device has a semiconductor element sealed with a resin material. In addition, a lead frame is connected to the semiconductor element in the resin material. The lead frame is provided with terminal portions that protrude through the surface of the resin material.

Abstract: An object recognizing device for recognizing an object by transmitting laser light from a laser light source and receiving reflected light from the object by a light sensor, wherein the laser light source and the light sensor are disposed at a relative vertical distance of not less than 20 cm therebetween with a divergence angle .theta..sub.1 of the laser radiation emitted from the laser light source being set at a value of not more than 5 mrad and being smaller than an angle .alpha. formed between an optical axis of the laser light and an optical axis of the reflected light entering into the light sensor, and which is, therefore, capable of effectively recognizing any object even in an atmosphere containing aerosol, e.g., fog or haze.

Abstract: A semiconductor apparatus that can limit the shifting of a semiconductor device when it is sealed with a sealing resin and can prevent bonding wires from being exposed at the surface of the sealing resin, and that can provide improved resistance to moisture and prevent deterioration of performance and reliability, potting resin structures are affixed to bonding wire mounting faces of a plurality of inner leads before they are sealed by a sealing resin, so that the tops of the potting resin structures are higher than the positions at which the bonding wires are mounted. With this arrangement, the shifting of the semiconductor device is halted by the potting resin structures, the bonding wires are not exposed at the surface of the sealing resin, and the potting resin structures and the sealing resin are closely attached, so that resistance to moisture is improved.

Abstract: The present invention provides a land comprising a recess formed in a packaging portion for receiving a solder ball. The land has a main part having a size which is slightly larger than a size of the solder ball for receiving the solder ball, wherein the land further has at least a flux-escape part extending outwardly from the main part so as to form a sufficient space for allowing any excess amount of a flux to escape into the flux-escape region.

Abstract: In a semiconductor device of a lead-on-chip structure, each of inner leads has a lower surface in direct contact with a principal surface of a semiconductor chip in a wiring bonding region, and the lower surface of each inner lead has a recess formed at a place different from the wiring bonding region. An adhesive double coated tape is accommodated in the recess of each inner lead for sticking the inner leads to the principal surface of the semiconductor chip. Each of bonding wires has one end connected to a corresponding electrode pad on the principal surface of the semiconductor chip and the other end connected to an upper surface of a corresponding inner lead within the wire bonding area.

Abstract: A semiconductor chip package is produced using a lead frame which has an island where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively. After an insulating film is formed on the island, the semiconductor chip is fixed to one side of the island through an adhesive layer while aligning the electrodes of the semiconductor chip with the through holes of the island portion, respectively. After sealing the semiconductor chip with sealing resin, solder balls are formed on the other side of the island portion, the solder balls are connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.

Abstract: A semiconductor device is provided with a surface-inactivated semiconductor layer provided on the surface of a compound semiconductor on which surface a semiconductor layer forming the depletion layer is provided, the semiconductor layer forming the depletion layer being of a conduction type opposite that of the compound semiconductor, and having a carrier density and thickness being capable of forming a depletion layer on the compound semiconductor. When a depletion layer is formed on the surface of the compound semiconductor by the semiconductor layer forming the depletion layer, the depletion layer has no charge so that the concentration of electrical fields is relaxed, the surface of the semiconductor is stabilized, and excellent dielectric breakdown performance is obtained.

Abstract: A culture system comprising at least first and second culture medium tanks including a gas phase, a culture medium phase, at least one gas phase port, and at least one culture medium port. At least one culture vessel. First switching-over members have a plurality of culture medium flow passages connected between the tanks and the culture vessels. The culture medium phase of the first tank flows through the passages to the culture medium phase of the second tank via the culture vessel. Switching-over of the culture medium flow passages causes the culture medium phase of the second tank to flow through the passages to the culture medium phase of the first tank via the culture vessel. Gas supply section comprises at least two pressure chambers and at least two gas ports connected to the pressure chambers. Second switching-over members have formed therein a plurality of gas flow passages allowing a gas to flow from the gas control section to the gas phase in the first and second tanks.

Abstract: A physical quantity detecting apparatus for detecting a physical quantity of an object of measurement. The position of movement of an object of measurement is divided into a given number of segments in advance. The output of a physical quantity sensor for detecting a physical quantity of the object of measurement is calculated on the basis of a correction operation expression which has an independent coefficient group for each segment so as to correct the offset component and the sensitivity. Thus, a physical quantity such as a transmitted torque is detected with high accuracy at real time without being influenced by the fluctuations of the offset output and the sensitivity depending on the position of rotation. The correction operation may also be performed using the temperature dependence function of the offset signal and the temperature dependence function of the sensitivity, thereby enabling the accurate measurement of the physical quantity without the influence of the temperature change.

Abstract: An electrostatic flocking apparatus has a flocking chamber, an air flow producing device for supplying and discharging air into and out of the flocking chamber, a filter for allowing the air out of the flocking chamber, but preventing the fibers from being discharged out of the chamber, an air box at the bottom of the flocking chamber and having a perforated board or wire mesh, electrodes, power sources electrically connected to the electrodes, a support for supporting the workpiece and a conveyor for conveying the work into and out of the flocking chamber.

Abstract: A substance for reversibly sorbing and desorbing hydrogen is disclosed. The substance comprises a complex dispersing 0.8-20% by weight of one or more than two oxides selected from La, Ce, Nd, Pr, Sm and Eu into ZrV.sub.x (0.01.ltoreq.x.ltoreq.0.7).