Abstract: Provided is a curable silicone composition with hot-melt properties, cured product thereof, and use thereof where organic solvent is essentially not used, in which curing using a relatively small amount of condensation reaction catalyst is feasible, side reactions before and after the curing reaction are suppressed, curing at high speed is feasible by providing favorable melt curability, and where the cured product thereof includes practically sufficient adhesive properties and mechanical characteristics. Providing a condensation reactive organopolysiloxane resin with hot-melt properties and a condensation reaction catalyst containing mixture including a condensation reaction catalyst that is liquid at 25° C. (suitably a volatile superbasic substance such as DBU) and liquid organopolysiloxane at a specific ratio, a curable silicone composition with hot-melt properties, and use of the cured product thereof.

Abstract: Disclosed is a method of making an optoelectronic device that incorporates a crosslinked resin-linear polyorganosiloxane.

Abstract: Provided herein is a light diffusing material having excellent light transmittance, light diffusivity, and mechanical properties. The light diffusing material comprises a curable organopolysiloxane composition, comprising: A) an organopolysiloxane having reactive groups; B) one or more inorganic fillers; and C) an organosilicon compound that differs from component A), and comprising component(s) C1) and/or C2). Component C1) is an organosilicon compound having a reactive functional group that can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and two or more silicon atoms, in the molecule. Component C2) is an organosilicon compound having a reactive functional group with three or more carbon atoms, which can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and one or more silicon atoms, in the molecule. The mass of component B) is 30 to 95% relative to the mass of the overall composition.

Abstract: Provided herein is a light diffusing material having excellent light transmittance, light diffusion properties, and mechanical properties. The light diffusing material comprises a curable organopolysiloxane composition, comprising: A) an organopolysiloxane having reactive groups; B) one or more inorganic fillers; and C) an organosilicon compound different from component A), and comprising component(s) C1) and/or C2). Component C1) is an organosilicon compound having a reactive functional group that can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and two or more silicon atoms, in the molecule. Component C2) is an organosilicon compound having a reactive functional group with three or more carbon atoms, which can bond with component A), a hydrolyzable silyl group and/or a silicon atom-bonded hydroxyl group, and one or more silicon atoms, in the molecule. The mass of component B) is 30 to 95% relative to the mass of the overall composition.

Abstract: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan ?) of 1.6 or more at the temperature T2.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

Abstract: An optical member resin sheet has excellent characteristics as an optical member and exhibits excellent performance even if used for a light-emitting device or the like. The optical member resin sheet is characterized in that the difference between the thickness of an end of the sheet and the thickness of the center of the sheet in the width direction of the sheet is within 5.0% of the total film thickness of the sheet; in that the thickness of the center of the sheet is in the range of 10-1000 ?m; in that the sheet area is 225 mm2 or more; and by containing at least one fluorescent substance or reflective material.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

Abstract: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan ?) of 1.6 or more at the temperature T2.

Abstract: A curable silicone composition is disclosed. The composition comprises: (A) a hydrosilylation-reactive resin-linear block copolymer type organopolysiloxane; (B) an organopolysiloxane resin containing a curing-reactive group having a carbon-carbon double bond in the molecule; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. An absolute value (?RI) of a difference between refractive indices of component (A) and component (B) measured at room temperature is less than 0.05. The curable silicone composition generally has excellent handleability, moldability, and mechanical strength (hardness, in particular) and flexibility of a cured product while achieving high transparency. Also disclosed is a resin sheet for an optical member including the composition or cured product thereof, and a light-emitting device or the like including the composition or cured product thereof.

Abstract: Disclosed is a method of making an optoelectronic device that incorporates a crosslinked resin-linear polyorganosiloxane.

Abstract: The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.

Abstract: Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an —Si—O—Si— backbone. The organosiloxane block copolymer comprises at least two blocks that are phase-separated. The organosiloxane block copolymer has at least a first glass transition temperature (Tg1) and a second glass transition temperature (Tg2), the second glass transition temperature being at 25° C. or higher. A 1 mm thick cast film of the adhesive composition has, in some embodiments, a light transmittance of at least 95%. The adhesive composition of the various embodiments of the present invention can be B-staged at about Tg2 or at about 100° C. below Tg2.

Abstract: An optical article includes a silicone-containing composition. The silicone composition includes a first region having a first refractive index and a second region having a second refractive index. The first refractive index is different than the second refractive index.

Abstract: A method of forming an optical article includes the step of applying a silicone composition to a surface, wherein the silicone composition is a solid and has a glass transition temperature greater than room temperature. The silicone composition is heated to a temperature at or above the glass transition temperature such that the silicone composition flows. The silicone composition forms a light transmitting sheet upon cooling following the heating.

Abstract: The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.

Abstract: The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.

Abstract: The present invention relates to a film-like thermosetting silicone sealing material for sealing a semiconductor element by means of compression molding, the sealing material having an initial torque value of less than 15 dN·m as measured by an MDR (Moving Die Rheometer) at a molding temperature of from room temperature to 200° C., to a method for producing an LED by means of compression molding using the same, and to an LED produced by this method. The sealing material has excellent moldability, causes no problems such as overflow from a die, and has no defects such as voids.

Abstract: Methods of making optical assemblies and electronic devices comprising, depositing a solid silicone-containing hot melt composition in powder form onto an optical surface of an optical device; and forming, from the silicone-containing hot melt composition, an encapsulant that substantially covers the optical surface of the optical device. In some embodiments, the silicone containing hot melt composition is a reactive or unreactive silicone-containing hot melt. In some embodiments, the composition is a resin-linear silicone-containing hot melt composition and the composition comprises a phase separated resin-rich phase and a phase separated linear-rich phase.