Abstract: A curable organopolysiloxane composition, comprising (A) an organopolysiloxane containing an average of at least 2 alkenyl groups and at least 2 silicon-bonded hydrogen atoms per molecule; (B) a compound containing alkenyl and hydroxyphenyl groups in each molecule, and (C) a hydrosilylation catalyst. A product formed by curing the organopolysiloxane composition and a unified article comprising a substrate and a product formed by curing the organopolysiloxane, wherein the substrate is unified into a single integral body with the cured product.

Abstract: A thermally conductive silicone rubber composition comprising (A) a curable organopolysiloxane, (B) a curing agent, and (C) a thermally conductive filler surface treated with (D) a silalkylene oligosiloxane described by formula 1

Abstract: A curable organosiloxane composition comprising: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) a compound having an alkenyl group and a phenol residue of the formula: 1

Abstract: This invention relates to a hydroxyphenyl group-containing organosilicon compound of the formula: where X is an alkenyl group; Z is a phenylene group or a carbonyloxy group expressed by —C(O)O-1, Y is a substituted or unsubstituted hydroxyphenyl group, R1 is a hydrocarbon group with two or more carbon atoms, with the various groups being the same or different, R is a monovalent hydrocarbon group containing no aliphatic unsaturated bonds, A is a divalent hydrocarbon group with one or more carbon atoms or a group expressed by the formula —R2—O—R2— where R2 is a divalent hydrocarbon group, m and p are 0 or 1, n is a number from 0 to 2, and q is an integer from 0 to 7. These compounds are useful in curable organosiloxane compositions.

Abstract: wherein A is hydrogen or a residue afforded by the removal of n hydroxyl groups from an m-valent alcohol, each R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, each R1 is independently a divalent hydrocarbon group containing at least 2 carbon atoms, m and n are natural numbers wherein m≧n, p is 0 or 1, and Y is a phenol group having the formula: wherein R3 is alkyl and q is from 0 to 4. Also, a method of preparing a phenol-functional organosilicon compound.

Abstract: The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.