Patents by Inventor Masaaki Ishio
Masaaki Ishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140178755Abstract: A negative-electrode terminal for a cell in which separation between a first metal layer and a second metal layer hardly takes place is provided by suppressing excess formation of an intermetallic compound on a bond interface between the first metal layer and the second metal layer. This negative-electrode terminal for a cell includes a clad portion formed by bonding a first metal layer made of Al or an Al alloy and a second metal layer containing Ni and Cu and consisting of one or a plurality of layers to each other. The first metal layer includes a connected region connected with a cell terminal connecting plate and a stacked region adjacent to the connected region on the side of the same surface, while the second metal layer is bonded to the first metal layer in the stacked region and configured to be connectable to cell negative electrodes of cells.Type: ApplicationFiled: August 1, 2012Publication date: June 26, 2014Applicants: HITACHI METALS, LTD., NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaaki Ishio
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Publication number: 20140099543Abstract: A negative electrode terminal for a battery in which a first metal layer and a second metal layer hardly separate from each other is provided by inhibiting an intermetallic compound from being formed between the first metal layer and the second metal layer. This negative electrode terminal (8) for a battery is composed of a clad material formed by bonding a first metal layer (80), made of Al, including a first region connected with a battery terminal connecting plate and an adjacent second region on the same surface side as the first region and a second metal layer (81), made of Ni, connected with battery negative electrodes, while the second metal layer is arranged to be stacked on the first metal layer in the second region of the first metal layer.Type: ApplicationFiled: May 31, 2012Publication date: April 10, 2014Applicants: HITACHI METALS, LTD., NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaaki Ishio
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Publication number: 20140011074Abstract: The present invention relates to a lithium ion battery employed by connecting the positive electrode side to a negative electrode portion made of Cu or a Cu alloy by a bus bar made of Al or an Al alloy and provides a negative electrode terminal for a lithium ion battery capable of providing sufficient bonding strength between the negative electrode portion and the bus bar when the negative electrode portion and the bus bar are metallurgically bonded to each other by resistance welding or the like, for example. This negative electrode terminal for a lithium ion battery is made of a clad material having a first metal layer made of Al or an Al alloy and a second metal layer made of Cu or a Cu alloy bonded to each other through a reaction-suppressing layer suppressing a reaction therebetween.Type: ApplicationFiled: September 13, 2013Publication date: January 9, 2014Applicants: HITACHI METALS, LTD., NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaaki Ishio, Yasuto Nozawa
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Publication number: 20130340820Abstract: This metal substrate for a dye-sensitized solar cell includes a clad material including a nonporous first metal layer, arranged on an anode side of a dye-sensitized solar cell element, made of a metal having corrosion resistance against an electrolyte of the dye-sensitized solar cell element and a second metal layer made of a metal having lower electrical resistance than the first metal layer and bonded to a side of the first metal layer opposite to the dye-sensitized solar cell element.Type: ApplicationFiled: June 22, 2012Publication date: December 26, 2013Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Ryouji Inoue, Shinji Yamamoto, Keita Watanabe, Masaaki Ishio
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Publication number: 20130316217Abstract: A connection plate for battery terminals capable of inhibiting a base and a battery terminal connection portion from being detached from each other is provided.Type: ApplicationFiled: December 7, 2011Publication date: November 28, 2013Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaharu Yamamoto, Masaaki Ishio
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Publication number: 20130309919Abstract: A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar 2 (connection plate for battery terminals) includes a first member (3) including a first hole (30) and an embedding hole (31), made of first metal and a second member (4) having a second hole (42), including a base (40) made of second metal, embedded in the embedding hole of the first member, while an intermetallic compound layer (5) containing at least one of the first metal and the second metal is formed on an interface between the embedding hole of the first member and the second member.Type: ApplicationFiled: January 19, 2012Publication date: November 21, 2013Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaharu Yamamoto, Masaaki Ishio
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Publication number: 20130071686Abstract: An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer that are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs?0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 ?m apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 ?m to about 10 ?m.Type: ApplicationFiled: June 2, 2011Publication date: March 21, 2013Inventors: Yoshimitsu Oda, Masaaki Ishio, Akio Hashimoto, Kenji Ikeuchi
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Publication number: 20120292294Abstract: A cladding material for a lead capable of inhibiting foreign matter from remaining on a surface can be obtained. The cladding material (1) is a cladding material for a lead welded to a terminal (21, 22) of a battery (2) and comprises a first Ni layer (11) arranged on a side welded to the terminal of said battery, a second Ni layer (12) arranged on a side opposite to said welded side and an Fe layer (10) arranged to be held between said first Ni layer and said second Ni layer. The thickness of the first Ni layer is at least 2.1% and not more than 8.2% of the thickness of said cladding material consisting of the first Ni layer, the second Ni layer and the Fe layer.Type: ApplicationFiled: August 2, 2012Publication date: November 22, 2012Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaaki Ishio
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Publication number: 20120202090Abstract: An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.Type: ApplicationFiled: October 25, 2010Publication date: August 9, 2012Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Shinji Yamamoto, Masaaki Ishio
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Publication number: 20120177943Abstract: A metal substrate for a solar battery capable of inhibiting power generation efficiency of a unit solar cell from decrease due to a defect of the unit solar cell is provided. This metal substrate (1) for a solar battery includes a cladding material having a first metal layer (11) with a first surface (11a) formed with a unit solar cell (2) and a second metal layer (12) bonded to the first metal layer on a second surface (11b) opposite to the first surface, while a kurtosis (Rku) serving as an index indicating surface roughness of the first surface is not more than 7.Type: ApplicationFiled: January 12, 2011Publication date: July 12, 2012Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Shinji Yamamoto, Ryouji Inoue, Keita Watanabe, Masaaki Ishio
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Publication number: 20120077056Abstract: A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.Type: ApplicationFiled: May 21, 2010Publication date: March 29, 2012Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaaki Ishio
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Publication number: 20120058360Abstract: A clad plate includes an aluminum plate and a hard metal plate such as a copper plate, joined together at side end surfaces thereof, the clad plate being excellent in joint strength and flexural separation-resistant characteristics. A side end surface of an aluminum plate and a side end surface of a hard metal plate are jointed together via a nickel layer by pressure welding. A ridge and a groove formed in the side end surface of the aluminum plate are respectively engaged and joined, via the nickel layer, to a groove and a ridge formed in the side end surface of the hard metal plate, and an end portion of the nickel layer extends beyond the rear end portion of the side end surface of the aluminum plate and is jointed to the plate surface of the aluminum plate with the end portion exposed thereon. The average width W of the exposed portion of the nickel layer exposed on the plate surface is preferably in the range from about 0.2 mm to about 1.5 mm.Type: ApplicationFiled: January 8, 2010Publication date: March 8, 2012Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Yoshimitsu Oda, Masaaki Ishio, Toshiaki Fujita
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Publication number: 20120006884Abstract: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability.Type: ApplicationFiled: September 19, 2011Publication date: January 12, 2012Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Kazuhiro SHIOMI, Masaaki ISHIO
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Patent number: 8029918Abstract: A brazing method includes assembling a first member and a second member, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and made of a Ni—Cr alloy including more than about 15% and less than about 40% of Cr, the second member being disposed on the first member with a brazing material of a Cu—Ni alloy including more than about 10% and less than about 20% of Ni therebetween, and maintaining the temporary assembly at a temperature of more than about 1,200° C. to fuse the brazing material and diffuse Ni atoms and Cr atoms into the fused brazing material to form the braze joint, causing the resulting brazing material to have an increased melting point due to the Ni and Cr contents of the braze joint to self-solidify the braze joint, and then cooling the resulting assembly.Type: GrantFiled: July 2, 2010Date of Patent: October 4, 2011Assignee: Neomax Materials Co., Ltd.Inventors: Tsuyoshi Hasegawa, Masaaki Ishio, Shunji Kajikawa, Yoshitsugu Sakamoto, Takayuki Hayashi
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Patent number: 8029916Abstract: A brazing filler metal capable of improving both of oxidation resistance and corrosion resistance is obtained. This brazing filler metal (1, 1d, 51 and 51a) consists of at least a three-layer structure of an Ni—Cr brazing layer (2 and 2a) consisting of an Ni—Cr alloy layer, a Ti brazing layer (3, 3a, 3b, 3c and 3d) consisting of a Ti layer or a Ti alloy layer and an Ni brazing layer (4, 4a, 4b, 4c and 4d) consisting of an Ni layer or an N alloy layer arranged between the Ni—Cr brazing layer and the Ti brazing layer.Type: GrantFiled: March 24, 2006Date of Patent: October 4, 2011Assignee: Neomax Materials Co., Ltd.Inventors: Tsuyoshi Hasegawa, Masaaki Ishio, Yoshimitsu Oda
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Patent number: 7830001Abstract: A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.Type: GrantFiled: May 23, 2006Date of Patent: November 9, 2010Assignee: Neomax Materials Co., Ltd.Inventors: Masayuki Yokota, Kazuhiro Shiomi, Fumiaki Kikui, Masaaki Ishio
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Publication number: 20100273025Abstract: A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a N—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C.Type: ApplicationFiled: July 2, 2010Publication date: October 28, 2010Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Tsuyoshi Hasegawa, Masaaki Ishio, Shunji Kajikawa, Yoshitsugu Sakamoto, Takayuki Hayashi
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Patent number: 7776452Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.Type: GrantFiled: July 27, 2005Date of Patent: August 17, 2010Assignee: Neomax Materials Co. Ltd.Inventors: Kazuhiro Shiomi, Masaaki Ishio, Tsuyoshi Hasegawa
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Patent number: 7754973Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.Type: GrantFiled: May 18, 2005Date of Patent: July 13, 2010Assignee: Neomax Materials Co., Ltd.Inventors: Kazuhiro Shiomi, Masaaki Ishio, Toshiaki Fujita
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Publication number: 20090283573Abstract: An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.Type: ApplicationFiled: July 24, 2009Publication date: November 19, 2009Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Kazuhiro SHIOMI, Toshiaki FUJITA, Masaaki ISHIO