Patents by Inventor Masaaki Ishio

Masaaki Ishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080169020
    Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
    Type: Application
    Filed: May 18, 2005
    Publication date: July 17, 2008
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Toshiaki Fujita
  • Publication number: 20080020225
    Abstract: A discharge electrode material is provided, which enable to form a discharge electrode having a service life and discharge characteristics equivalent to those of a discharge electrode mainly composed of Nb and having excellent weldability to a support conductor, and enables to reduce material costs. The discharge electrode clad material according to the present invention includes a base layer composed of pure Ni, a Ni-based alloy mainly comprising Ni or a stainless steel, and a surface layer bonded to the base layer and composed of pure Nb or a Nb-based alloy mainly comprising Nb. The clad material preferably further includes an intermediate layer provided between the base layer and the surface layer and composed of a stainless steel. The base layer may have a strip-like shape, and the surface layer may be disposed only on a middle portion of the base layer.
    Type: Application
    Filed: November 8, 2004
    Publication date: January 24, 2008
    Inventors: Tomohiro Saito, Hiroshi Miura, Masaaki Ishio, Tsuyoshi Hasegawa
  • Publication number: 20070224445
    Abstract: A brazing filler metal capable of improving both of oxidation resistance and corrosion resistance is obtained. This brazing filler metal (1, 1d, 51 and 51a) consists of at least a three-layer structure of an Ni—Cr brazing layer (2 and 2a) consisting of an Ni—Cr alloy layer, a Ti brazing layer (3, 3a, 3b, 3c and 3d) consisting of a Ti layer or a Ti alloy layer and an Ni brazing layer (4, 4a, 4b, 4c and 4d) consisting of an Ni layer or an N alloy layer arranged between the Ni—Cr brazing layer and the Ti brazing layer.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 27, 2007
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Tsuyoshi Hasegawa, Masaaki Ishio, Yoshimitsu Oda
  • Publication number: 20070148490
    Abstract: A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a Ni—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 28, 2007
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Tsuyoshi Hasegawa, Masaaki Ishio, Shunji Kajikawa, Yoshitsugu Sakamoto, Takayuki Hayashi
  • Publication number: 20070062574
    Abstract: An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.
    Type: Application
    Filed: May 19, 2004
    Publication date: March 22, 2007
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro Shiomi, Toshiaki Fujita, Masaaki Ishio
  • Patent number: 7166497
    Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: January 23, 2007
    Assignees: Neomax Materials Co., Ltd., Daishinku Corporation
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Minoru Iizuka, Yoshikiyo Ogasawara
  • Publication number: 20060244125
    Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
    Type: Application
    Filed: July 27, 2005
    Publication date: November 2, 2006
    Applicant: NEOMAX MATERIALS CO., LTD
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Tsuyoshi Hasegawa
  • Patent number: 6974635
    Abstract: A lid material is provided which comprises: a core layer composed of an Fe—Ni alloy or an Fe—Ni—Co alloy; a nickel-based (Ni-based) metal layer press- and diffusion-bonded onto the core layer and composed of a Ni-based metal, such as pure Ni, mainly comprising Ni; and a brazing material layer press-bonded onto the Ni-based metal layer. The Ni-based metal layer has a maximum-to-minimum thickness ratio T1/T2 of 1.4 to 15. The lid material is produced by press-bonding a Ni-based metal foil onto a core sheet for formation of the Ni-based metal layer on the core layer, then diffusion-annealing the Ni-based metal layer and the core layer, and press-bonding a brazing material foil onto the Ni-based metal layer with a reduction ratio of 30 to 65%.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: December 13, 2005
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Kenichi Funamoto, Hidetoshi Noda, Masaaki Ishio
  • Patent number: 6921970
    Abstract: A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm2; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: July 26, 2005
    Assignees: Neomax Materials Co., Ltd., Daishinku Corporation
    Inventors: Kazuhiro Shiomi, Masaaki Ishio
  • Publication number: 20050087862
    Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.
    Type: Application
    Filed: November 16, 2004
    Publication date: April 28, 2005
    Applicants: Neomax Co., Ltd., DAISHINKU CORPORATION
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Minoru Ilzuka, Yoshikiyo Ogasawara
  • Patent number: 6849939
    Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: February 1, 2005
    Assignees: Neomax Co., Ltd., Daishinku Corporation
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Minoru Iizuka, Yoshikiyo Ogasawara
  • Publication number: 20040207071
    Abstract: A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm2; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package.
    Type: Application
    Filed: March 23, 2004
    Publication date: October 21, 2004
    Inventors: Kazuhiro Shiomi, Masaaki Ishio
  • Patent number: 6761306
    Abstract: A phosphorus-copper brazing material formed of a phosphorus-copper brazing alloy which can easily be cold-worked into a thin sheet, a brazing sheet having a brazing layer of the phosphorus-copper brazing alloy, and a flow path structure for heat exchangers constructed by brazing with the alloy, are such that the phosphorus-copper brazing material includes a phosphorus-copper brazing alloy containing Cu as a major component and phosphorus of not less than about 2.0 mass % to not more than about 3.2 mass %. The brazing sheet includes a metal sheet, and a brazing material layer that is integral with the metal sheet on at least one side of the metal sheet, the brazing material layer being formed of the phosphorus-copper brazing alloy. The metal sheet may be formed of copper or a copper alloy containing Cu as a major component.
    Type: Grant
    Filed: November 5, 2002
    Date of Patent: July 13, 2004
    Assignee: Sumitomo Special Metals Co, Ltd.
    Inventors: Masaaki Ishio, Tsuyoshi Hasegawa, Ken Yamamoto, Norihide Kawachi, Kenichiro Kamon
  • Publication number: 20040023487
    Abstract: An electronic component package according to the present invention includes a case (1) having a cavity portion containing an electronic component therein, and a lid member (8) fusion-welded to the case (1) via a fusion-welding layer (20) to close the cavity portion hermetically. The case (1) has a first metal layer (5) laminated on the case (1) in a manner to be exposed on the cavity open side. The lid member (8) has a core portion (9), and a second metal layer (10) laminated on a side of the core portion (9) facing the case (1). The fusion-welding layer (20) has a soldering material layer (12A) formed of a soldering material, and first and second intermetallic compound layers (5A) and (10A), respectively, formed on opposite sides of the soldering material layer (12A) as a result of diffusion of a major component of the soldering material into the first metal layer (5) and the second metal layer (10).
    Type: Application
    Filed: March 3, 2003
    Publication date: February 5, 2004
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Minoru Iizuka, Yoshikiyo Ogasawara
  • Patent number: 6605371
    Abstract: A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in terms of weight percentage which, when plotted on a diagram as shown in FIG. 1, falls within a range defined by: the point A (37% Mn, 63% Ni, 0% Cu), the point B (18% Mn, 27% Ni, 55% Cu); the point C (42% Mn, 3% Ni, 55% Cu); the point D (50% Mn, 3% Ni, 47% Cu); and the point E (50% Mn, 50% Ni, 0% Cu), wherein Mn=50% is exclusive.
    Type: Grant
    Filed: May 22, 2000
    Date of Patent: August 12, 2003
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Masami Ueda, Masaaki Ishio, Hidetoshi Noda, Tsuyoshi Hasegawa
  • Publication number: 20030085258
    Abstract: A phosphorus-copper brazing material formed of a phosphorus-copper brazing alloy which can easily be cold-worked into a thin sheet, a brazing sheet having a brazing layer of the phosphorus-copper brazing alloy, and a flow path structure for heat exchangers constructed by brazing with the alloy, are such that the phosphorus-copper brazing material includes a phosphorus-copper brazing alloy containing Cu as a major component and phosphorus of not less than about 2.0 mass % to not more than about 3.2 mass %. The brazing sheet includes a metal sheet, and a brazing material layer that is integral with the metal sheet on at least one side of the metal sheet, the brazing material layer being formed of the phosphorus-copper brazing alloy. The metal sheet may be formed of copper or a copper alloy containing Cu as a major component.
    Type: Application
    Filed: November 5, 2002
    Publication date: May 8, 2003
    Applicant: Sumitomo Special Metals Company, Ltd.
    Inventors: Masaaki Ishio, Tsuyoshi Hasegawa, Ken Yamamoto, Norihide Kawachi, Kenichiro Kamon
  • Publication number: 20020187391
    Abstract: An anode can for an electrochemical cell is disclosed. The anode can is no more than 0.0050 inch thick, and the can includes a copper layer and a stainless steel layer. The ratio of the copper layer thickness to the stainless steel layer thickness is at least 0.10:1.
    Type: Application
    Filed: June 11, 2001
    Publication date: December 12, 2002
    Inventors: Keith E. Buckle, Masaaki Ishio
  • Publication number: 20010051283
    Abstract: An object of the present invention is to provide a three-layer clad material in which stainless steel is used as the substrate, Ni or an Ni alloy is monolithically pressure-welded to either principal plane of the substrate, and Cu is monolithically pressure-welded to the other principal plane, or a two- or three-layer clad material in which Ni or an Ni alloy is monolithically pressure-welded to at least one principal plane of the substrate, wherein this high-strength, high-drawability clad material allows the thickness ratio of the stainless steel to be further increased, mechanical strength (tensile strength) to be raised above that of a conventional two- or three-layer clad material, and the thickness of the entire clad material to be reduced.
    Type: Application
    Filed: June 29, 2001
    Publication date: December 13, 2001
    Inventor: Masaaki Ishio
  • Patent number: 6329080
    Abstract: An object of the present invention is to provide a three-layer clad material in which stainless steel is used as the substrate, Ni or an Ni alloy is monolithically pressure-welded to either principal plane of the substrate, and Cu is monolithically pressure-welded to the other principal plane, or a two- or three-layer clad material in which Ni or an Ni alloy is monolithically pressure-welded to at least one principal plane of the substrate, wherein this high-strength, high-drawability clad material allows the thickness ratio of the stainless steel to be further increased, mechanical strength (tensile strength) to be raised above that of a conventional two- or three-layer clad material, and the thickness of the entire clad material to be reduced.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: December 11, 2001
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventor: Masaaki Ishio
  • Patent number: 6316128
    Abstract: A three-layer clad material in which stainless steel is used as the substrate, Ni or an Ni alloy is monolithically pressure-welded to either principal plane of the substrate, and Cu is monolithically pressure-welded to the other principal plane, wherein this high-strength, high-drawability clad material allows the thickness ratio of the stainless steel to be further increased, mechanical strength (tensile strength) to be raised above that of a conventional two- or three-layer clad material, and the thickness of the entire clad material to be reduced. Uniform tension can be created across the entire thin sheet, folding or creasing can be prevented from occurring during pressure welding, the thickness of the thin Ni and Cu sheets prior to pressure welding can be reduced to about 5 &mgr;m, and the thickness ratio of each of the thin sheets in the three-layer clad material for cell cases can be reduced to about 0.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: November 13, 2001
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventor: Masaaki Ishio