Patents by Inventor Masaaki Katsumata

Masaaki Katsumata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11398592
    Abstract: A method for manufacturing a light emitting module includes: providing light emitting devices each including a light emitting element having an upper surface, a lateral surface, and an electrode positioned on the upper surface, a first light reflective member arranged on the lateral surface of the light emitting element, and a metal film formed on upper surfaces of the electrode and the first light reflective member; placing the light emitting devices on a light guide plate with gaps between the light emitting devices, with the metal films of the light emitting devices facing upward; forming masks respectively covering the metal films; forming a second light reflective member in the gaps between the light emitting devices on the light guide plate; removing the masks; and forming, on the light emitting devices and on the second light reflective member, wiring segments that connect to the metal films.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: July 26, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Koji Taguchi, Masaaki Katsumata
  • Publication number: 20220232700
    Abstract: A lighting device includes a light emitting element having element electrodes; a light guide member to receive incoming light from the light emitting element and to emit light spreading along a plane; and a substrate including a base substitute. Conductors are formed on a first surface of the base substrate. An adhesive member is formed on a second surface of the base substrate, and through-holes penetrating the substrate in a thickness direction of the substrate. The substrate is provided on the light emitting element via the adhesive member of the substrate such that a surface of the light emitting element is exposed through each of the through-holes to define a bottomed hole. Each of the element electrodes is connected to each of the conductors via a filler filling the bottomed hole. The filler has a lower surface than a surface carrying the conductors of the substrate in a cross-sectional view.
    Type: Application
    Filed: April 7, 2022
    Publication date: July 21, 2022
    Applicant: NICHIA CORPORATION
    Inventors: Eiko MINATO, Yumiko KAMESHIMA, Koji TAGUCHI, Masaaki KATSUMATA
  • Patent number: 11380817
    Abstract: A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: July 5, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Yoshiki Sato, Masaaki Katsumata, Shinichi Daikoku, Yoshikazu Matsuda, Ryuma Marume, Eiko Minato
  • Patent number: 11363715
    Abstract: A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: June 14, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Eiko Minato, Yumiko Kameshima, Koji Taguchi, Masaaki Katsumata
  • Publication number: 20220158063
    Abstract: A light-emitting device including a light-emitting module, a first wiring and a second wiring. The light-emitting module includes one or more light-emitting elements and a package covering the one or more light-emitting elements. Each of the one or more light-emitting elements has a first electrode and a second electrode. The light-emitting module has a groove structure on a lower surface side. The first wiring and the second wiring are partially or entirely present in the groove structure. At least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure. The first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode.
    Type: Application
    Filed: February 1, 2022
    Publication date: May 19, 2022
    Applicant: NICHIA CORPORATION
    Inventors: Rie MAEDA, Masaaki KATSUMATA
  • Publication number: 20220149233
    Abstract: A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.
    Type: Application
    Filed: January 20, 2022
    Publication date: May 12, 2022
    Applicant: NICHIA CORPORATION
    Inventors: Eiko MINATO, Koji TAGUCHI, Yumiko KAMESHIMA, Masaaki KATSUMATA
  • Patent number: 11324117
    Abstract: A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: May 3, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Eiko Minato, Yumiko Kameshima, Koji Taguchi, Masaaki Katsumata
  • Publication number: 20220099883
    Abstract: A surface-emitting light source includes: a wiring substrate including a wiring layer on a base member; a light-guiding plate having a first primary surface and a second primary surface facing the wiring substrate; a light-reflective resin portion having an opening and being disposed between the light-guiding plate and the wiring substrate; and a light source portion including an element electrode on a first surface thereof and a light-extracting surface on a second surface thereof that faces the light-guiding place. The element electrode is electrically connected to the wiring layer via the opening, which is equal to or smaller than an area in which a side surface of the light source portion contacts the resin portion. The resin portion and the light-guiding plate face each other and are bonded to each other, and the resin portion and the wiring substrate face each other and are bonded to each other.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Applicant: NICHIA CORPORATION
    Inventors: Koji TAGUCHI, Masaaki KATSUMATA
  • Patent number: 11276807
    Abstract: A light-emitting device manufacturing method including providing a light-emitting structure including one or more light-emitting elements and a covering member covering the light-emitting elements. Each of the light-emitting elements have first and second electrodes. The light-emitting structure has a first surface and a second surface opposite to the first surface, and lower surfaces of the first and second electrodes of each light-emitting element are closer to the first surface than the second surface. The method further includes forming a groove structure on the first surface side by irradiation with laser light such that at least part of the first and second electrodes are exposed to an inside of the groove structure, and forming a plurality of wirings inside of the groove structure.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: March 15, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Rie Maeda, Masaaki Katsumata
  • Patent number: 11264533
    Abstract: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: March 1, 2022
    Assignee: Nichia Corporation
    Inventors: Eiko Minato, Koji Taguchi, Yumiko Kameshima, Masaaki Katsumata
  • Publication number: 20220037567
    Abstract: A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.
    Type: Application
    Filed: September 27, 2019
    Publication date: February 3, 2022
    Applicant: NICHIA CORPORATION
    Inventors: Yumiko KAMESHIMA, Eiko MINATO, Koji TAGUCHI, Masaaki KATSUMATA
  • Patent number: 11229123
    Abstract: A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: January 18, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Masaaki Katsumata, Masakazu Sakamoto
  • Patent number: 11112094
    Abstract: A method of manufacturing a light-emitting device includes: providing a second base with a plurality of light-emitting elements, the second base having an upper surface on which a pattern of second metal films is formed, the plurality of light-emitting elements being provided on the pattern of second metal films; cutting the second base to singulate the second base into a plurality of connection boards on each of which respective one of the plurality of light-emitting elements is mounted; providing a support board including a first base, the first base being flexible, the first base including a pattern of first metal films; placing the plurality of connection boards on the support board; and forming, for each of the plurality of connection boards, a conductive member so as to be in contact with the pattern of second metal films on the connection board and with the pattern of first metal films.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: September 7, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Yohei Inayoshi, Masaaki Katsumata, Tomohiro Ikeda
  • Publication number: 20210272942
    Abstract: A surface-emitting light source includes a plurality of light-emitting modules each including an array of a plurality of light sources and a wiring board disposed on an array of the plurality of light-emitting modules with an adhesive interposed therebetween. The plurality of light-emitting modules to be disposed on the wiring board are arranged such that a space is left between adjacent ones of the light-emitting modules. The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 2, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Koji TAGUCHI, Yumiko KAMESHIMA, Masaaki KATSUMATA
  • Publication number: 20210167046
    Abstract: A surface-emitting light source includes: light-emitting modules; a wiring substrate including a base member having a surface at a light-emitting modules side and a rear surface opposite to that, a wiring layer on the rear surface of the base member and including wiring pads being portions of the wiring layer, electrically-conductive members each supplied across corresponding two or more of a plurality of vias in each of the wiring pads, and a covering layer covering the wiring layer and defining openings in each of which a portion of a corresponding one of the wiring pads is exposed; and an adhesive layer between the light-emitting modules and the wiring substrate. Each light-emitting module has an array of light emitting devices. The covering layer defines the openings at locations corresponding to the wiring pads with an area dimension smaller than respective area dimensions of the wiring pads.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 3, 2021
    Inventors: Eiko MINATO, Masaaki KATSUMATA
  • Patent number: 11026335
    Abstract: A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: June 1, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Rie Maeda, Masaaki Katsumata
  • Patent number: 11018288
    Abstract: A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: May 25, 2021
    Assignee: NICHSA CORPORATION
    Inventors: Tomohiro Ikeda, Masaaki Katsumata, Yohei Inayoshi, Yosuke Nakayama, Yumiko Kameshima
  • Patent number: 10964865
    Abstract: A method for manufacturing a printed board includes steps of; providing a starting board comprising a base member having a plate-like shape, having an upper surface and a lower surface opposite the upper surface, and having an insulation property, a first metal layer disposed on the upper surface, and a second metal layer disposed on the lower surface; and laser machining a through-hole penetrating the starting board in a thickness direction of the starting board by irradiating a laser beam irradiation area of the starting board with a laser beam from a side of the starting board on which side the first metal layer is disposed. The method further includes a step of etching the second metal layer so as to remove a portion of the second metal layer located in the laser beam irradiation area, prior to the step of laser machining.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: March 30, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Masaaki Katsumata, Masakazu Sakamoto
  • Publication number: 20210091285
    Abstract: A method for manufacturing a light emitting module includes: providing light emitting devices each including a light emitting element having an upper surface, a lateral surface, and an electrode positioned on the upper surface, a first light reflective member arranged on the lateral surface of the light emitting element, and a metal film formed on upper surfaces of the electrode and the first light reflective member; placing the light emitting devices on a light guide plate with gaps between the light emitting devices, with the metal films of the light emitting devices facing upward; forming masks respectively covering the metal films; forming a second light reflective member in the gaps between the light emitting devices on the light guide plate; removing the masks; and forming, on the light emitting devices and on the second light reflective member, wiring segments that connect to the metal films.
    Type: Application
    Filed: September 24, 2020
    Publication date: March 25, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Koji TAGUCHI, Masaaki KATSUMATA
  • Patent number: 10957836
    Abstract: A printed board includes: a plate-shaped base member having an upper surface and a lower surface opposite the upper surface and having an insulation property; a first metal layer disposed on the upper surface; and a second metal layer disposed on the lower surface. The base member has a through-hole penetrating the base member in a thickness direction thereof. The second metal layer is spaced apart from the through-hole by a predetermined distance in a bottom view. The printed board may further include a third metal layer that continuously covers the first metal layer, the second metal layer, and an inner surface of the through-hole. A light emitting device includes the printed board and a light emitting element mounted on the printed board such as to be electrically connected with a wiring pattern composed of the first metal layer, the second metal layer, and the third metal layer.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: March 23, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Masaaki Katsumata, Masakazu Sakamoto