Abstract: A mirror device includes a mirror including a main body portion having a reflection surface that reflects display light, and a rotating shaft protruding from a first side wall of the main body portion, and a driving member that includes a motor including an output shaft arranged parallel to the rotating shaft, and neighboring the rotating shaft in a direction orthogonal to a rotation axis line of the rotating shaft, a first gear portion coupled to the output shaft, and a second gear portion engaged with the first gear portion, and coupled to the rotating shaft, and rotates the mirror by transmitting rotation of the output shaft of the motor to the rotating shaft via the first gear portion and the second gear portion.

Abstract: A method for manufacturing a ceramic sintered body substrate includes of disposing a first metal paste on a surface of a ceramic substrate, and of firing the ceramic substrate on which the first metal paste is disposed. In the disposing the first metal paste, the first metal paste contains a plurality of first metal powders, a plurality of active metal powders, and a plurality of inorganic fillers excluding metals, and in the firing the ceramic substrate, a firing temperature is equal to or higher than a melting point of the first metal powders.

Abstract: A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.

Abstract: A light emitting device including a first light emitting element that includes a first electrode having a first polarity and a second electrode having a second polarity that is different from the first polarity. The device has a circuit element that includes a main body, and first and second terminals electrically connected with one another via the main body. The device includes a first wiring having the first polarity connecting the first electrode of the first light emitting element and the first terminal, and a second wiring having the second polarity located in a layer common with a layer of the first wiring and including a portion elongated between the first terminal and the second terminal in a bottom view. An upper surface of the main body is positioned at a distance below an interface between a lower surface of the first wiring and the first electrode.

Abstract: A wiring substrate includes: a base body having an insulating property and including a first surface and a second surface on a side opposite the first surface; a resist portion covering at least part of the first surface and at least a part of the second surface of the base body and including a hole portion having a predetermined pattern; and a wiring line disposed in the hole portion of the resist portion so as to be in contact with the base body. In a cross-sectional view in a thickness direction of the base body, a length of an exposed surface of the wiring line exposed from the resist portion is less than a length of a contact surface of the wiring line in contact with the base body.

Abstract: A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively.

Abstract: A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

Abstract: A method of manufacturing a wiring substrate includes providing a conductive paste including metal nanoparticles, metal particles, and a resin, disposing the conductive paste on at least a first surface of an insulating base body, and forming a wiring layer by heating and pressurizing the conductive paste by using a roll press or a hard SUS plate. In the providing the conductive paste, the ratio of a mass of the metal nanoparticles to the total mass of the metal nanoparticles and the metal particles is in a range of 5 mass % to 95 mass %, and the conductive paste is heated and pressurized such that part of the wiring layer in a thickness direction is embedded in at least the first surface of the insulating base body.

Abstract: A surface-emitting light source includes: a wiring substrate including a wiring layer on a base member; a light-guiding plate having a first primary surface and a second primary surface facing the wiring substrate; a light-reflective resin portion having an opening and being disposed between the light-guiding plate and the wiring substrate; and a light source portion including an element electrode on a first surface thereof and a light-extracting surface on a second surface thereof that faces the light-guiding place. The element electrode is electrically connected to the wiring layer via the opening, which is equal to or smaller than an area in which a side surface of the light source portion contacts the resin portion. The resin portion and the light-guiding plate face each other and are bonded to each other, and the resin portion and the wiring substrate face each other and are bonded to each other.

Abstract: A surface-emitting light source includes: light-emitting modules; a wiring substrate including a base member having a surface at a light-emitting modules side and a rear surface opposite to that, a wiring layer on the rear surface of the base member and including wiring pads being portions of the wiring layer, electrically-conductive members each supplied across corresponding two or more of a plurality of vias in each of the wiring pads, and a covering layer covering the wiring layer and defining openings in each of which a portion of a corresponding one of the wiring pads is exposed; and an adhesive layer between the light-emitting modules and the wiring substrate. Each light-emitting module has an array of light emitting devices. The covering layer defines the openings at locations corresponding to the wiring pads with an area dimension smaller than respective area dimensions of the wiring pads.

Abstract: A method for manufacturing a circuit board includes: providing a first board including a post portion, and a second board defining an opening portion extending through a base material, the base material including a circuit pattern disposed on a first surface and an adhesive member disposed on a side of a second surface; and bonding the first board and the second board using the adhesive member by pressurizing and heating the first board and the second board in a state of the post portion being inserted in the opening portion and a top surface of the post portion being exposed from the second board. In a plan view, the second board includes a base material exposed portion. In the bonding, the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board.

Abstract: A light-emitting device including a light-emitting module, a first wiring and a second wiring. The light-emitting module includes one or more light-emitting elements and a package covering the one or more light-emitting elements. Each of the one or more light-emitting elements has a first electrode and a second electrode. The light-emitting module has a groove structure on a lower surface side. The first wiring and the second wiring are partially or entirely present in the groove structure. At least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure. The first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode.

Abstract: A method for manufacturing a wiring board that includes preparing a substrate including an insulating resin and a metal member having an anti-rust layer formed on a surface thereof that is arranged so as to face a second surface of the insulating resin. The method includes forming a bottomed hole by irradiating a first laser beam from a first surface side of the insulating resin. The bottomed hole penetrates the insulating resin and has an inner bottom surface that is the surface of the metal member. The method also includes removing the anti-rust layer formed on the surface of the metal member in the inner bottom surface of the bottomed hole, injecting a conductive paste into the bottomed hole and applying the conductive paste to the first surface of the insulating resin so as to have a wiring continuous with the injected conductive paste, and curing the conductive paste.

Abstract: A light emitting device includes a base, a first external terminal, a second external terminal, a plurality of wirings respectively electrically connecting the first external terminal and the second external terminal, and a plurality of light emitting elements each electrically connected to a corresponding one of the wirings. The wirings include a first wiring connecting the first external terminal and the second external terminal at a smallest distance, a second wiring longer than the first wiring, and a third wiring longer than the second wiring. The first, second, and third wirings have a substantially equal electric resistance. At least two of the first, second and third wirings are each provided with at least two of the light emitting elements with an average width in an intermediate region between adjacent ones of the light emitting elements being smaller than an average width in a region other than the intermediate region.

Abstract: A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

Abstract: A surface-emitting light source includes a plurality of light-emitting modules each including an array of a plurality of light sources and a wiring board disposed on an array of the plurality of light-emitting modules with an adhesive interposed therebetween. The plurality of light-emitting modules to be disposed on the wiring board are arranged such that a space is left between adjacent ones of the light-emitting modules. The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules.

Abstract: A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.

Abstract: A printed circuit board includes a printed wiring board including an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. A semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. Conductive members filled in the through-holes connect the element terminals and the wiring. The insulative substrate has elasticity in which an elongation percentage of the insulative substrate is 20% or more. The wiring is formed from a conductive polymer or an elastic conductive paste in which conductive particles are mixed into a resin material.

Abstract: A light emitting device including a first light emitting element that includes a first electrode having a first polarity and a second electrode having a second polarity that is different from the first polarity. The device has a circuit element that includes a main body, and first and second terminals electrically connected with one another via the main body. The device includes a first wiring having the first polarity connecting the first electrode of the first light emitting element and the first terminal, and a second wiring having the second polarity located in a layer common with a layer of the first wiring and including a portion elongated between the first terminal and the second terminal in a bottom view. An upper surface of the main body is positioned at a distance below an interface between a lower surface of the first wiring and the first electrode.

Abstract: A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively.