Abstract: A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.

Abstract: A method of manufacturing a printed board includes perforating a metal foil with a laser beam or punching to provide a through-hole extending in a thickness direction along a thickness of the printed board. An insulating layer is provided. The metal foil having the through-hole is provided on the insulating layer in the thickness direction. An adhesive is provided between the insulating layer and the metal foil having the through-hole. The metal foil is pressed toward the insulating layer to bond the metal foil to the insulating layer via the adhesive. A mask is provided on the metal foil in the thickness direction to cover at least a part of the through-hole without covering an exposed part of the metal foil. The exposed part of the metal foil is etched to provide a wiring pattern on the insulating layer.

Abstract: A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.

Abstract: A light-emitting device includes a support board including a first base with flexibility and having a region where a first metal film is formed, a connection board disposed on an upper surface of the support board and including a second base on which a second metal film is formed, a light-emitting element mounted on the connection board, and a conductive member in contact with the first metal film and with the second metal film.

Abstract: A method of manufacturing a printed board includes perforating a metal foil with a laser beam or punching to provide a through-hole extending in a thickness direction along a thickness of the printed board. An insulating layer is provided. The metal foil having the through-hole is provided on the insulating layer in the thickness direction. An adhesive is provided between the insulating layer and the metal foil having the through-hole. The metal foil is pressed toward the insulating layer to bond the metal foil to the insulating layer via the adhesive. A mask is provided on the metal foil in the thickness direction to cover at least a part of the through-hole without covering an exposed part of the metal foil. The exposed part of the metal foil is etched to provide a wiring pattern on the insulating layer.

Abstract: A substrate for a light emitting element including a resin substrate exhibiting flexibility and a metal wiring portion being formed on at least one surface side of the resin substrate via an adhesive layer, in which a reflective layer composed of a thermosetting resin is disposed between the resin substrate and the adhesive layer, in which the reflective layer contains a light reflective filler at 10% by mass or more and 85% by mass or less and has a reflectance to light at a wavelength of 450 nm of 80% or more.

Abstract: A method for manufacturing a printed board includes steps of; providing a starting board comprising a base member having a plate-like shape, having an upper surface and a lower surface opposite the upper surface, and having an insulation property, a first metal layer disposed on the upper surface, and a second metal layer disposed on the lower surface; and laser machining a through-hole penetrating the starting board in a thickness direction of the starting board by irradiating a laser beam irradiation area of the starting board with a laser beam from a side of the starting board on which side the first metal layer is disposed. The method further includes a step of etching the second metal layer so as to remove a portion of the second metal layer located in the laser beam irradiation area, prior to the step of laser machining.

Abstract: A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.

Abstract: A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.

Abstract: A light emitting device is provided that can restrain deterioration of a mount substrate made of resin, the light emitting device including: a support member that is made of resin; a pair of wirings that are arranged on the support member; a light emitting element that is arranged to cross the pair of wirings and that has a pair of electrodes on one side running in parallel to the pair of wirings so as to be electrically connected; and a vaporproof member in a film shape that seamlessly covers an upper face of the support member, at least, in a region where the light emitting element is arranged between the pair of wirings in a plan view, wherein the vaporproof member has a higher vaporproof property than that of the support member.

Abstract: A substrate for a light emitting element including a resin substrate exhibiting flexibility and a metal wiring portion being formed on at least one surface side of the resin substrate via an adhesive layer, in which a reflective layer composed of a thermosetting resin is disposed between the resin substrate and the adhesive layer, in which the reflective layer contains a light reflective filler at 10% by mass or more and 85% by mass or less and has a reflectance to light at a wavelength of 450 nm of 80% or more.

Abstract: A light emitting device is provided that can restrain deterioration of a mount substrate made of resin, the light emitting device including: a support member that is made of resin; a pair of wirings that are arranged on the support member; a light emitting element that is arranged to cross the pair of wirings and that has a pair of electrodes on one side running in parallel to the pair of wirings so as to be electrically connected; and a vaporproof member in a film shape that seamlessly covers an upper face of the support member, at least, in a region where the light emitting element is arranged between the pair of wirings in a plan view, wherein the vaporproof member has a higher vaporproof property than that of the support member.

Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.

Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.

Abstract: A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.

Abstract: A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.

Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.

Abstract: A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.

Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.

Abstract: A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.