Patents by Inventor Masaaki Togashi

Masaaki Togashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9214283
    Abstract: In a multilayer capacitor 1, burned layers 17A, 17B are formed so as to cover all of lead conductors 12A, 12B drawn from inner electrodes 6A, 6B to end faces of a multilayer body 2. This can keep a plating solution from infiltrating onto the inner electrodes 6A, 6B when forming plating layers 18A, 18B and prevent insulation failures from occurring. Since the burned layers 17A, 17B cover a part of dummy electrodes 13C, 13F, 13G, 13H, the area of the burned layers 17A, 17B can be suppressed. This can inhibit excessive stresses from occurring in the burned layers 17A, 17B and thus can prevent cracks from being generated by stresses in the burned layers 17A, 17B.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: December 15, 2015
    Assignee: TDK CORPORATION
    Inventor: Masaaki Togashi
  • Patent number: 9053864
    Abstract: In a multilayer capacitor, a first dielectric layered product including a first body principal face is formed to be thicker than a second dielectric layered product including a second body principal face in a stacking direction thereof. A first external electrode and a second external electrode extend only to the first body principal face from a first body end face and a second body end face. Alternatively, the first external electrode and the second external electrode extend at least to the first body principal face from the first body end face and the second body end face and extend also to at least one of the second body principal face, a first body lateral face, and a second body lateral face.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: June 9, 2015
    Assignee: TDK CORPORATION
    Inventor: Masaaki Togashi
  • Patent number: 9025306
    Abstract: Provided is a laminated capacitor that achieves low impedance in a wide band. The laminated capacitor 1 includes an element assembly 2, terminal electrodes 3, 4, internal electrodes 7, 8 that are connected to the terminal electrodes 3, 4, and an internal electrode 9 that is not connected to the terminal electrodes 3, 4. In the laminated capacitor 1, an interval between each of the first electrode parts 3a, 4a of the first and second terminal electrodes 3, 4 and the internal electrode 9 is smaller than an interval between the internal electrode 9 and the internal electrode 7 or the internal electrode 8 located adjacent to the internal electrode 9.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: May 5, 2015
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8994476
    Abstract: A ferrite bead inductor comprises a ferrite bead element body having magnetic layers and inner electrodes stacked therein, and first and second outer electrodes arranged on first and second side faces of the ferrite bead element body. The inner electrode extends in the direction of shorter sides which are shorter than longer sides, so as to connect with the first and second outer electrodes. The ferrite bead element body has an interstice for allowing the magnetic layers adjacent to each other in the stacking direction to join together within an inner electrode region adapted to form the inner electrode on the magnetic layer.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: March 31, 2015
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8947850
    Abstract: A multilayer capacitor that can suppress electrostrictive vibration without material constraint and with applicability to various structures, including general-purpose structures. A multilayer capacitor has: an element body formed of dielectric ceramic; and a plurality of internal electrodes disposed inside the element body such that the internal electrodes are stacked with ceramic layers sandwiched therebetween. The multilayer capacitor is provided with a capacitor area which includes the plurality of internal electrodes and a first suppression area and a second suppression area for reducing electrostriction caused by the plurality of internal electrodes so as to suppress noise. The first suppression area is adjacent to the capacitor area and the thickness of the second suppression area is determined according to the arrangement of the plurality of internal electrodes.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: February 3, 2015
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8659871
    Abstract: A multilayer capacitor is provided with improved reliability and reduced ESL. In a width direction, a second principal-surface electrode portion is greater than a first principal-surface electrode portion, and a fifth principal-surface electrode portion is greater than a fourth principal-surface electrode portion. When viewed from a lamination direction, an outer edge of the second principal-surface electrode portion at the other end side is arranged near the other end side more than outer edge of the fifth principal-surface electrode portion at one end side. First lead portions are connected to the second principal-surface electrode portion, and second lead portions are connected to the fifth principal-surface electrode portion.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: February 25, 2014
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Kazuyuki Hasebe
  • Patent number: 8659873
    Abstract: A first inner electrode is integrally provided with a first terminal connection part connected to a first terminal electrode and a first linking connection part connected to a first linking electrode. A second inner electrode is integrally provided with a second terminal connection part connected to a second terminal electrode and a second linking connection part connected to a second linking electrode. A third inner electrode is integrally provided with a third linking connection part connected to the first linking electrode. A fourth inner electrode is integrally provided with a fourth linking connection part connected to the second linking electrode. The third inner electrode is adjacent to the first and fourth inner electrodes in a laminating direction of the plurality of dielectric layers. The first and fourth inner electrodes overlap the third inner electrode as seen in the laminating direction of the plurality of dielectric layers.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: February 25, 2014
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Takashi Aoki
  • Patent number: 8659872
    Abstract: A multilayer capacitor comprises a capacitor element body, a first terminal electrode connected to a first inner electrode, a second terminal electrode connected to a second inner electrode, a third terminal electrode connected to a third inner electrode, and a fourth terminal electrode connected to a fourth inner electrode. The capacitor element body includes therewithin a first capacitor unit having first and second inner electrodes stacked adjacent to each other through a dielectric layer and a second capacitor unit having third and fourth inner electrodes stacked adjacent to each other through a dielectric layer. The first and second terminal electrodes have high resistance layers exhibiting electrical resistances higher than those of the third and fourth terminal electrodes.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: February 25, 2014
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Publication number: 20140043719
    Abstract: Provided is a laminated capacitor that achieves low impedance in a wide band. The laminated capacitor 1 includes an element assembly 2, terminal electrodes 3, 4, internal electrodes 7, 8 that are connected to the terminal electrodes 3, 4, and an internal electrode 9 that is not connected to the terminal electrodes 3, 4. In the laminated capacitor 1, an interval between each of the first electrode parts 3a, 4a of the first and second terminal electrodes 3, 4 and the internal electrode 9 is smaller than an interval between the internal electrode 9 and the internal electrode 7 or the internal electrode 8 located adjacent to the internal electrode 9.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 13, 2014
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Patent number: 8587922
    Abstract: In a feed-through capacitor, a conduction unit having a plurality of conduction inner electrodes can fully secure a tolerable level of DC. A capacitor unit is formed on the mount surface side in a capacitor body, so that high-frequency noise components can be removed by the capacitor unit before reaching the conduction unit. The distance between the grounding inner electrode located closest to the conduction unit and the conduction inner electrode in the conduction unit is greater than that between the signal inner electrode and grounding inner electrode in the capacitor unit. This enhances the impedance between the capacitor unit and the conduction unit, so as to inhibit the high-frequency noise components from flowing into the conduction unit.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: November 19, 2013
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Takashi Aoki
  • Patent number: 8526162
    Abstract: A conducting portion includes a plurality of conducting inner electrodes. Each of a pair of capacitance portions includes a plurality of signal inner electrodes while adjacently opposing each other in the laminating direction, a plurality of first grounding inner electrodes while adjacently opposing each other in the laminating direction, and a plurality of second grounding inner electrodes while adjacently opposing each other in the laminating direction. The plurality of first grounding inner electrodes are located between the conducting portion and the plurality of signal inner electrodes, while one of the first grounding inner electrodes adjacently opposes one of the first signal inner electrodes in the laminating direction. The plurality of second grounding inner electrodes are located between principal faces opposing each other in the laminating direction in the outer surface and the plurality of signal inner electrodes.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: September 3, 2013
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Takashi Aoki, Hiroshi Okuyama, Yutaro Kotani
  • Patent number: 8493710
    Abstract: A multilayer capacitor is provided with improved adhesiveness of layers of an element body and improved reliability. Outer edge of a second principal-surface electrode portion are respectively separated from an end surface and lateral surfaces, and are respectively arranged so as to surround the forefront portion of a third principal-surface electrode portion at one end side when viewed from a lamination direction. Outer edges of a fourth principal-surface electrode portion are respectively separated from an end surface and lateral surfaces, and are arranged so as to surround the forefront portion of a first principal-surface electrode portion in the width direction at the other end side when viewed from the lamination direction.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: July 23, 2013
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Kazuyuki Hasebe
  • Patent number: 8488296
    Abstract: A multilayer capacitor which can control ESR in a wide frequency band is provided. In a multilayer capacitor 1, inner electrodes 8a, 8b oppose each other as different polarities through a dielectric layer 7 in a capacitance unit 10, inner electrodes 8c to 8f oppose each other as different polarities through dielectric layers 7 in ESR control units 11A, 11B, and the inner electrodes 8a, 8b of the capacitance unit 10 connected to the outer electrodes 3, 4 and the inner electrodes 8c, 8f of the ESR control units 11A, 11B connected to the outer electrodes 3, 4 are kept from opposing each other as different polarities through the dielectric layer 7 at boundaries between the capacitance unit 10 and the ESR control units 11A, 11B.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: July 16, 2013
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8395881
    Abstract: A multilayer feedthrough capacitor has a capacitor element body of a substantially rectangular parallelepiped shape, a signal internal electrode, a ground internal electrode, first and second signal terminal electrodes, and a first ground terminal electrode. The capacitor element body includes first and second end faces opposed in a longitudinal direction thereof, and a mounting surface perpendicular to a direction in which a plurality of insulator layers are laminated. The first signal terminal electrode and the first ground terminal electrode are arranged in proximity to each other in a first region near the first end face in the mounting surface. The second signal terminal electrode is arranged in a second region near the second end face in the mounting surface. No conductor is arranged in a third region between the first region and the second region in the longitudinal direction of the capacitor element body, in the mounting surface.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: March 12, 2013
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Publication number: 20130038979
    Abstract: A multilayer capacitor that can suppress electrostrictive vibration without material constraint and with applicability to various structures, including general-purpose structures. A multilayer capacitor has: an element body formed of dielectric ceramic; and a plurality of internal electrodes disposed inside the element body such that the internal electrodes are stacked with ceramic layers sandwiched therebetween. The multilayer capacitor is provided with a capacitor area which includes the plurality of internal electrodes and a first suppression area and a second suppression area for reducing electrostriction caused by the plurality of internal electrodes so as to suppress noise. The first suppression area is adjacent to the capacitor area and the thickness of the second suppression area is determined according to the arrangement of the plurality of internal electrodes.
    Type: Application
    Filed: July 11, 2012
    Publication date: February 14, 2013
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Publication number: 20120314338
    Abstract: In a multilayer capacitor 1, burned layers 17A, 17B are formed so as to cover all of lead conductors 12A, 12B drawn from inner electrodes 6A, 6B to end faces of a multilayer body 2. This can keep a plating solution from infiltrating onto the inner electrodes 6A, 6B when forming plating layers 18A, 18B and prevent insulation failures from occurring. Since the burned layers 17A, 17B cover a part of dummy electrodes 13C, 13F, 13G, 13H, the area of the burned layers 17A, 17B can be suppressed. This can inhibit excessive stresses from occurring in the burned layers 17A, 17B and thus can prevent cracks from being generated by stresses in the burned layers 17A, 17B.
    Type: Application
    Filed: June 5, 2012
    Publication date: December 13, 2012
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Publication number: 20120313729
    Abstract: An LC composite component is provided in which a capacitor section and an inductor section are alternately stacked in layers in the layering direction; either the capacitor section or the inductor section is disposed on both a first element body principal face side and a second element body principal face side; a first coil wire path portion and a second coil wire path portion are connected to an external conductor interposed between an external conductor near a first element body end face and an external conductor near a second element body end face in a first external conductor group; and the first coil wire path portion and the second coil wire path portion form a coil which is wound in a helical fashion along the layering direction.
    Type: Application
    Filed: May 24, 2012
    Publication date: December 13, 2012
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Patent number: 8325489
    Abstract: An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component 7 is electrically connected to surface-mounted electrode parts 11A, 12A at metal terminals 26, 27 such that a first capacitor 24 having a greater capacitance and a mounting surface 4a of a multilayer substrate 4 are separated from each other. A second electronic component 8 is arranged between the first capacitor 24 and the mounting surface 4a and electrically connected to surface-mounted electrode parts 12B, 11B at second terminal electrodes 32, 33. The second electronic component 8 overlaps the first capacitor 24 when seen in the laminating direction. The first electronic component 7 is mounted to the multilayer substrate 4 such that first terminal electrodes 22, 23 oppose each other in a predetermined direction D1.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: December 4, 2012
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Kouji Yamada
  • Publication number: 20120300361
    Abstract: In a multilayer capacitor, a first dielectric layered product including a first body principal face is formed to be thicker than a second dielectric layered product including a second body principal face in a stacking direction thereof. A first external electrode and a second external electrode extend only to the first body principal face from a first body end face and a second body end face. Alternatively, the first external electrode and the second external electrode extend at least to the first body principal face from the first body end face and the second body end face and extend also to at least one of the second body principal face, a first body lateral face, and a second body lateral face.
    Type: Application
    Filed: May 21, 2012
    Publication date: November 29, 2012
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Patent number: 8315035
    Abstract: A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: November 20, 2012
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Sunao Masuda, Hiroshi Abe