Patents by Inventor Masaaki Togashi

Masaaki Togashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8089284
    Abstract: An impedance measuring method uses an impedance measuring device for measuring an impedance of a measured electronic component, a coaxial connector electrically connected to the impedance measuring device, and a measurement substrate which can be housed in the coaxial connector. The coaxial connector has a center conductor and an outer conductor located outside the center conductor. The measurement substrate has an insulating substrate and first and second conductors each formed on a first principal surface of the insulating substrate. The measurement substrate with the measured electronic component being mounted on the first and second conductors is housed in the coaxial connector connected to the impedance measuring device, so as to electrically connect the first conductor to the center conductor and electrically connect the second conductor to the outer conductor. Then the impedance of the measured electronic component is measured by the impedance measuring device.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: January 3, 2012
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8068330
    Abstract: A multilayer capacitor comprises a capacitor element body; a first signal terminal electrode, a second signal terminal electrode, and a ground terminal electrode which are arranged on an outer surface of the capacitor element body; and a ground internal electrode and first to third signal internal electrodes which are arranged within the capacitor element body. The ground internal electrode is connected to the ground terminal electrode. The first signal internal electrode is connected to the first signal terminal electrode and opposes the ground internal electrode so as to construct a first capacitor. The second signal internal electrode is connected to the first signal terminal electrode and opposes the ground internal electrode so as to construct a second capacitor. The third signal internal electrode is connected to the second signal terminal electrode and opposes the ground internal electrode so as to construct a third capacitor.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: November 29, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8056199
    Abstract: A method of producing a multilayer capacitor has steps of preparing a plurality of first and second ceramic green sheets, a step of laminating the plurality of first and second ceramic green sheets, and a step of cutting a ceramic green sheet laminate body along predetermined intended cutting lines to obtain laminate chips of individual multilayer capacitor units. When preparing the first ceramic green sheets, first and second internal electrode patterns are formed so that the first and second internal electrode patterns are alternately arranged in a perpendicular configuration, with the first and second internal electrode patterns being continuous across intended cutting lines.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: November 15, 2011
    Assignee: TDK Corporation
    Inventors: Takashi Aoki, Masaaki Togashi
  • Patent number: 8031480
    Abstract: In a structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate, the first and second feedthrough capacitors are disposed so as to be substantially parallel and to face each other in their partial regions, and a current in the partial region of the first feedthrough capacitor flows in a direction opposite to that in the partial region of the second feedthrough capacitor.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: October 4, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8031460
    Abstract: A first internal conductor has a first portion. A second internal conductor has a lead portion and a main electrode portion. The second internal conductor is arranged in the same layer as the first internal conductor. A third internal conductor has a lead portion and a main electrode portion. The third internal conductor is arranged so as to be adjacent to the second internal conductor in a laminate direction. A fourth internal conductor has a lead portion and a main electrode portion. The fourth internal conductor is arranged so as to be adjacent to the third internal conductor in the laminate direction. When the laminate body is viewed from the laminate direction, the main electrode portion of the third internal conductor overlaps with the main electrode portions of the second and fourth internal conductors.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: October 4, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 8018711
    Abstract: A feedthrough capacitor has: a capacitor element body of a substantially rectangular parallelepiped shape in which a plurality of insulator layers are laminated together; a signal internal electrode arranged in the capacitor element body; a ground internal electrode arranged in the capacitor element body and opposed to the signal internal electrode; signal terminal electrodes connected to the signal internal electrode; and a ground terminal electrode connected to the ground internal electrode. The signal terminal electrodes are provided on first and second end faces, respectively, in a longitudinal direction of the capacitor element body. The ground terminal electrode is provided on at least one side face out of first to fourth side faces extending along the longitudinal direction of the capacitor element body. Furthermore, the ground terminal electrode is located nearer at least one end face out of the first end face and the second end face.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: September 13, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7995325
    Abstract: A multilayer capacitor includes a capacitor body having rectangular first and second main faces opposing each other, first and second end faces extending in a shorter side direction of the first and second main faces so as to connect the first and second main faces to each other, and first and second side faces extending in a longer side direction of the first and second main faces so as to connect the first and second main faces to each other. First and second terminal electrodes are arranged on the first and second side faces of the capacitor body, respectively. A first inner electrode connected to the first terminal electrode, a second inner electrode connected to the second terminal electrode, and first and second intermediate electrodes connected to none of the first and second terminal electrodes are arranged within the capacitor body.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: August 9, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7974070
    Abstract: An NTC capacitor comprises a capacitor body having a plurality of insulator layers laminated therein, first to third inner electrodes arranged within the capacitor body, and first to third terminal electrodes arranged on outer surfaces of the capacitor body. The first inner electrode is connected to only the first terminal electrode. The second inner electrode is connected to only the second terminal electrode. The third inner electrode is connected to only the third terminal electrode. The third inner electrode opposes none of the first and second inner electrodes in the laminating direction of the insulator layers.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: July 5, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7974071
    Abstract: A multilayer capacitor includes a dielectric body 12 formed by stacking a plurality of dielectric layers 12a; a first internal conductor layer 21 led out straddling three side faces 12A, 12C and 12D of said dielectric body 12; a second internal conductor layer 22, stacked in the dielectric body 12 via dielectric layers 12a to the first internal conductor layer 21, led out straddling three side faces 12B, 12C and 12D; a first and a second terminal electrodes 31 and 32 formed on an outer face of said dielectric body 12, straddling the three side faces 12A, 12C and 12D, and 12B, and 12C and 12D, respectively. A first space pattern 41 is formed on the first lead portion at a position along with the first side face 12A, not connected with the first terminal electrode 31.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: July 5, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7952852
    Abstract: A multilayer capacitor array includes a capacitor body, two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, one first outer connecting conductor, and one second outer connecting conductor, where the capacitor body includes first and second signal inner electrodes, and first to third grounding inner electrodes. The first signal inner electrode is arranged to oppose the first or third grounding inner electrode with at least one insulator layer therebetween, while the second signal inner electrode is arranged to oppose the second or third grounding inner electrode with at least one insulator layer therebetween. The third grounding inner electrode is directly connected to the grounding terminal electrodes, while the first and second grounding inner electrodes are not directly connected to the grounding terminal electrodes, but are connected to the third grounding inner electrode through respective outer connecting conductors.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: May 31, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7948737
    Abstract: At least one of a plurality of first internal electrodes and a second internal electrode are arranged as opposed with at least one of the dielectric layers in between. Third and fourth internal electrodes are arranged as opposed with at least one of the dielectric layers in between. The first internal electrodes are electrically connected to a first external connecting conductor through lead conductors. The second, third, and fourth internal electrodes are electrically connected to second, third, and fourth terminal conductors, respectively, through lead conductors. At last one but not all of the first internal electrodes are electrically connected to the first terminal conductor through a lead conductor.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: May 24, 2011
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Takashi Aoki
  • Publication number: 20110110060
    Abstract: An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component 7 is electrically connected to surface-mounted electrode parts 11A, 12A at metal terminals 26, 27 such that a first capacitor 24 having a greater capacitance and a mounting surface 4a of a multilayer substrate 4 are separated from each other. A second electronic component 8 is arranged between the first capacitor 24 and the mounting surface 4a and electrically connected to surface-mounted electrode parts 12B, 11B at second terminal electrodes 32, 33. The second electronic component 8 overlaps the first capacitor 24 when seen in the laminating direction. The first electronic component 7 is mounted to the multilayer substrate 4 such that first terminal electrodes 22, 23 oppose each other in a predetermined direction D1.
    Type: Application
    Filed: November 8, 2010
    Publication date: May 12, 2011
    Applicant: TDK CORPORATION
    Inventors: Masaaki TOGASHI, Kouji YAMADA
  • Publication number: 20110102969
    Abstract: A multilayer capacitor 1 comprises a capacitor element body 2 constituted by a plurality of dielectric layers 10; inner electrodes 3, 4, disposed within the capacitor element body 2, having main electrode parts 31, 41 separated by a distance Wg from third and fourth side faces 2c, 2d; and terminal electrodes 5, 6 disposed on respective end faces 2e, 2f and a part of first to fourth side faces 2a to 2d. The inner electrodes 3, 4 are alternately laminated with the dielectric layer 10. The distance Cv between the inner electrode 3, 4 at the outermost layer on each of the first and second side face 2a, 2b sides and the first or second side face 2a, 2b adjacent to the inner electrode 3, 4 is shorter than the distance Wg between the main electrode part 31, 41 and the third or fourth side face 2c, 2d.
    Type: Application
    Filed: October 7, 2010
    Publication date: May 5, 2011
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Publication number: 20110096464
    Abstract: Disclosed is a multilayer capacitor capable of improving adhesiveness of layers of an element body and improving reliability. Outer edge 12a, 12c, and 12d of a second principal-surface electrode portion 12 are respectively separated from an end surface 1a and lateral surfaces 1e and 1f, and are respectively arranged so as to surround the forefront portion of a third principal-surface electrode portion 21 at one end 1A side when viewed from a lamination direction. Outer edges 22a, 22c, and 22d of a fourth principal-surface electrode portion 22 are respectively separated from an end surface 1b and lateral surfaces 1e and 1f, and are arranged so as to surround the forefront portion of a first principal-surface electrode portion 11 in the width direction at the other end 1B side when viewed from the lamination direction.
    Type: Application
    Filed: October 14, 2010
    Publication date: April 28, 2011
    Applicant: TDK CORPORATION
    Inventors: Masaaki TOGASHI, Kazuyuki HASEBE
  • Publication number: 20110096463
    Abstract: Disclosed is a multilayer capacitor capable of improving reliability and further reducing ESL. In a width direction, a second principal-surface electrode portion is greater than a first principal-surface electrode portion, and a fifth principal-surface electrode portion is greater than a fourth principal-surface electrode portion. When viewed from a lamination direction, an outer edge of the second principal-surface electrode portion at the other end side is arranged near the other end side more than outer edge of the fifth principal-surface electrode portion at one end side. First lead portions are connected to the second principal-surface electrode portion, and second lead portions are connected to the fifth principal-surface electrode portion.
    Type: Application
    Filed: October 14, 2010
    Publication date: April 28, 2011
    Applicant: TDK CORPORATION
    Inventors: Masaaki TOGASHI, Kazuyuki HASEBE
  • Publication number: 20110047794
    Abstract: A capacitor array 1 is mounted onto a circuit board formed with first leads 42, 43 for connecting power lines 40, 41 to each other and a second lead 44 for grounding by using one of a first connection method of connecting such that first and second capacitor sections are parallel to each other, third and fourth capacitor sections are parallel to each other, and the third and fourth capacitor sections are in series with the parallel first and second capacitor sections; a second connection method of connecting such that the first to fourth capacitor sections are in series in sequence; and a third connection method of connecting such that the first and second capacitor sections are in series with each other without using the third and fourth capacitor sections.
    Type: Application
    Filed: June 29, 2010
    Publication date: March 3, 2011
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Publication number: 20110032655
    Abstract: A multilayer capacitor array 1 comprises a capacitor element body 2 having first, second, third, and fourth inner electrodes 13 to 16, and first to fourth terminal electrodes 3 to 6 disposed on the outer surface of the capacitor element body 2 and respectively connected to the inner electrodes 13 to 16. The first and second inner electrodes 13, 14 form a first capacitor section C1, while the third and fourth inner electrodes 15, 16 form a second capacitor section C2. The multilayer capacitor array 1 is mounted to a circuit board such that the first and third terminal electrodes 3, 5 are connected to first leads 22, 23, while the second and fourth terminal electrodes 4, 6 are connected to a second lead 24.
    Type: Application
    Filed: June 28, 2010
    Publication date: February 10, 2011
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Patent number: 7881040
    Abstract: A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a plurality of second via holes, a plurality of first land electrodes, and a second land electrode. The first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction. The feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: February 1, 2011
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7859820
    Abstract: A multilayer capacitor has a capacitor element body, first and second terminal electrodes, and a connection conductor. The capacitor element body has a plurality of insulator layers laminated, and a plurality of first and second internal electrodes arranged with at least one of the insulator layers in between. The first and second terminal electrodes are disposed on one external surface extending parallel to a laminating direction of the insulator layers. The connection conductor is disposed on an exterior surface extending parallel to the laminating direction of the insulator layers. The first internal electrodes include two types of internal electrodes, a type of internal electrode connected to the first terminal electrode and the connection conductor and a type of internal electrode connected to the connection conductor only. The second internal electrodes are connected to the second terminal electrode.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: December 28, 2010
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Patent number: 7843679
    Abstract: A multilayer capacitor has a capacitor element body in which a plurality of insulator layers are laminated, first and second terminal electrodes, a first internal electrode group, and a second internal electrode group. The first and second terminal electrodes are disposed on an external surface extending in a direction parallel to a laminating direction of the insulator layers, among external surfaces of the capacitor element body. The first internal electrode group has a first internal electrode connected to the first terminal electrode, and a second internal electrode connected to the second terminal electrode. The second internal electrode group has a third internal electrode connected to the first terminal electrode, a fourth internal electrode connected to the second terminal electrode, and at least one intermediate internal electrode not connected to the first and second terminal electrodes.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: November 30, 2010
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi