Abstract: A capacitor body of a multilayer feedthrough capacitor is arranged with grounding inner electrodes and signal inner electrodes. The grounding inner electrodes include first and second grounding main electrode portions, grounding connection electrode portions having no areas opposing the signal inner electrodes, and first and second grounding lead electrode portions. The signal inner electrodes include first and second signal main electrode portions, signal connection electrode portions having no areas opposing the grounding inner electrodes, and first and second signal lead electrode portions.

Abstract: A multilayer capacitor comprises a multilayer body in which dielectric layers and first and second inner electrodes are alternately laminated, and first and second terminal conductors and first and second outer connecting conductors. At least one each of first and second terminal conductors and the first outer connecting conductor are formed on a first side face of the multilayer body. At least one each of the first and second terminal conductors and the second outer connecting conductor are formed on a second side face of the multilayer body opposing the first side face. Each inner electrode is electrically connected to the corresponding outer connecting conductors. First and second inner connecting conductors electrically connected to the corresponding terminal and outer connecting conductors are laminated in the multilayer body. An equivalent series resistance is set to a desirable value by adjusting the number or positions of the inner connecting conductors.

Abstract: It is an object to provide a flexible substrate according to which noise due to layered components can be reduced effectively without depending on changing layered components and the mounting positions thereof. To attain this object, a flexible substrate, which is a flexible substrate for mounting a capacitor, has flexibility, and has thereon a mounting region for mounting the capacitor, and a vibration transmission suppressing region in which holes are formed so as to surround the mounting region.

Abstract: A multilayer capacitor comprises a capacitor body, a first connecting conductor arranged on a first side face of the capacitor body, first and second terminal electrodes, and a first insulator arranged between the first connecting conductor and first terminal electrode. The capacitor body has a plurality of laminated insulator layers and a plurality of first and second inner electrodes. The second terminal electrode is connected to the second inner electrode. Each of the first inner electrodes has a first lead portion exposing an end to the first side face. At least one of the first inner electrodes also has a second lead portion whose end is exposed to the first side face. The first connecting conductor continuously covers all the ends of the first lead portions of the first inner electrodes and mechanically connects with the ends of the first lead portions.

Abstract: A feedthrough multilayer capacitor array has a multilayer body in which a plurality of first and second electrode layers are alternately laminated with a dielectric layer in between; first, third, fifth, and seventh terminal electrodes formed on a first side face of the multilayer body; and second, fourth, sixth, and eighth terminal electrodes formed on a second side face of the multilayer body facing the first side face. Each first electrode layer includes first and second internal electrodes which are electrically connected through lead conductors respectively to the first and second terminal electrodes, and the third and fourth terminal electrodes. Each second electrode layer includes third and fourth internal electrodes which are electrically connected through lead conductors respectively to the fifth and sixth terminal electrodes, and the seventh and eighth terminal electrodes.

Abstract: A multilayer capacitor has a capacitor element, inner electrodes arranged within the capacitor element, and first to fourth terminal electrodes. Electrode parts of the first to fourth terminal electrodes cover ridges formed between first and third side faces, first and fourth side faces, second and third side faces, and second and fourth side faces. The capacitor element has an element part. The element part is formed such as to overlap the electrode parts when seen in a second and a third directions and keep away from respective areas about the electrode parts when seen in a first direction.

Abstract: A multilayer capacitor has a capacitor element, inner electrodes arranged within the capacitor element, and first terminal electrodes and second terminal electrodes arranged on the capacitor element. The capacitor element has an element part held between the inner electrodes. The first terminal electrodes and second terminal electrodes have electrode parts. When seen in a second direction, the electrode parts are arranged on first and second side faces in any of a plurality of areas holding the element part therebetween in a third direction and not overlapping the element part.

Abstract: A multilayer capacitor has a laminate body in which a first internal electrode and a second internal electrode are alternately laminated with a dielectric layer in between, a first terminal electrode provided on one end side of the laminate body, and a second terminal electrode provided on the other end side of the laminate body. The first internal electrode has a first lead portion connected to the first terminal electrode. The second internal electrode has a second lead portion connected to the second terminal electrode. The first internal electrode consists of plural types of first internal electrodes and the plural types of first internal electrodes have their respective first lead portions at different positions. Distances between the first lead portions of the respective types of the first internal electrodes and the second lead portion are different from each other.

Abstract: A multilayer capacitor 10 of the present invention including: a dielectric body 12 formed by stacking a plurality of dielectric layers 12a; an internal layer portion 17 in which a first and second internal conductor layers 21 and 22 are stacked alternately in the dielectric body 12 via the dielectric layer 12a; external layer portions 19a and 19b in which a first and second external conductor layers 23 and 25 are stacked via the dielectric layer 12a; a first terminal electrode 31 connected with the first internal conductor layer 21 and the first external conductor layer 23, formed at least on a first side face 12A of the dielectric body 12; and a second terminal electrode 32 connected with the second internal conductor layer 22 and the second external conductor layer 25, formed at least on a second side face 12 B opposed to the first side face 12A.

Abstract: A chip type electronic component for test is provided with an element body, and four or more terminal electrodes placed on the exterior of the element body. The element body has a plurality of laminated insulator layers, and a plurality of internal electrodes arranged to be opposed to each other with the insulator layer in between. Each of the internal electrodes is connected to at least one same terminal electrode out of the four or more terminal electrodes and connected to any one terminal electrode except for the at least one same terminal electrode.

Abstract: A multilayer capacitor 10 comprising a dielectric body 12 having an approximately rectangular parallelepiped shape formed by alternately stacking a plurality of dielectric layer 12a, a first conductor layer 21, a second conductor layer 22, a first terminal electrode 31 and a second terminal electrode 32 formed on a first side face 12A of side faces 12 of the dielectric body in parallel to a stacking direction Z. The first conductor layer 21 comprises a first lead portion 21L connected to the first terminal electrode 31, the second conductor layer 22 comprises a second lead portion 22L connected to the second terminal electrode 32. Between a length “a” of the first lead portion 21L and the second lead portion 22L in vertical direction to the stacking direction Z, a length “b” of conductor layers positioned at both ends of the dielectric body 12 in the stacking direction, a space length “c” of the first side face 12A and the first conductor layer 21, a total number of the conductor layers 22, 22, (a+c)/(b×n)?0.

Abstract: A feedthrough capacitor array has first and second terminal electrodes, first and second ground terminal electrodes, first and second signal internal electrodes, and first and second ground internal electrodes. The first signal internal electrode and the first ground internal electrode are arranged so as to be opposed to each other through a part of a dielectric element body. The second signal internal electrode and the second ground internal electrode are arranged to be opposed to each other through a part of the dielectric element body, in an opposed direction of the first signal internal electrode and the first ground internal electrode. The first signal internal electrode and the second ground internal electrode are arranged so as not to overlap each other in the opposed direction of the first signal internal electrode and the first ground internal electrode.

Abstract: A multilayer capacitor comprises a capacitor body; first and second inner electrodes alternately arranged in the capacitor body; and a first outer connecting conductor and first and second terminal electrodes arranged on an outer surface of the capacitor body. Each first inner electrode has a first main electrode portion and a first lead electrode portion for connecting the first main electrode portion to the first outer connecting conductor. Each second inner electrode has a second main electrode portion and a second lead electrode portion for connecting the second main electrode portion to at least one second terminal electrode. The capacitor body includes a first inner connecting conductor arranged outside of at least one set of first and second inner electrodes in the opposing direction of the first and second inner electrodes and connected to at least one first terminal electrode and the first outer connecting conductor.

Abstract: A multilayer capacitor has a multilayer body in which multiple dielectric layers and multiple inner electrodes are alternately laminated, and multiple terminal electrodes formed on the multilayer body. The multiple inner electrodes include multiple first inner electrodes and multiple second inner electrodes alternately arranged. The multiple terminal electrodes include first and second terminal electrodes electrically insulated from each other. The multiple first inner electrodes are electrically connected to each other by way of a through-hole conductor. The multiple second inner electrodes are electrically connected to each other by way of a through-hole conductor.

Abstract: The multilayer body 1 is constructed by alternately laminating a plurality of dielectric layers 11 to 22 and a plurality of first and second inner electrodes 31 to 34, 31 to 34. The first inner electrodes 31 to 34 are electrically connected to each other through the first connecting conductor 7. The first inner electrode 31 is electrically connected to the first terminal electrode 3 through the lead conductor 37. The second inner electrodes 41 to 44 are electrically connected to each other through the second connecting conductor 9. The second inner electrode 44 is electrically connected to the second terminal electrode 5 through the lead conductor 47. The first inner electrode 31 and the second inner electrode 44 are arranged at respective positions symmetrical to each other about the center position M in the laminating direction of the multilayer body 1.

Abstract: A multilayer capacitor has a capacitor element body of a nearly rectangular parallelepiped shape in which a signal electrode layer and a GND electrode layer are laminated with a dielectric layer in between, and signal terminal electrodes and GND terminal electrodes each set of which is provided on either of two side faces along the longitudinal direction of the capacitor element body. A signal electrode is led to each of the two side faces along the longitudinal direction of the capacitor element body and connected to the signal terminal electrodes. First GND electrode and second GND electrode are arranged alongside as spaced in a direction perpendicular to the longitudinal direction of the capacitor element body. The first GND electrode is led to one side along the longitudinal direction of the capacitor element body and connected to the GND terminal electrode.

Abstract: A multilayer capacitor 10 comprising a dielectric body 12 formed by stacking a plurality of dielectric layers 12a and 12b having an approximately rectangular parallelepiped shape; an internal layer portion 17 in which pluralities of first internal conductor layers 21 and second internal conductor layers 22 to be set at different electric potentials each other are stacked alternately in said dielectric body 12 via said dielectric layer 12a as mutually overlapping in stacking direction Z to form an internal electrode circuit of a capacitor; an external layer portion 19a and 19b in which pluralities of first external conductor layers 23 and second external conductor layers 25 to be set at different electric potentials which are not overlapping in stacking direction Z, are stacked in said dielectric body 12 via said dielectric layer 12b, the external layer portions being adjacent to at least any of both end faces of said internal layer portion 17 in stacking direction Z; and a first terminal electrode 31 and a se

Abstract: A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal terminal. The first metal terminal has a first capacitor connecting portion mechanically connected to the first terminal electrode, a first terminal portion mechanically connected to the land, and a first intermediate portion electrically connecting the first capacitor connecting portion and the first terminal portion to each other. The first capacitor connecting portion of the first metal terminal is parallel to the substrate.

Abstract: A multilayer capacitor comprises a capacitor body, a first connecting conductor arranged on a first side face of the capacitor body, first and second terminal electrodes, and a first insulator arranged between the first connecting conductor and first terminal electrode. The capacitor body has a plurality of laminated insulator layers and a plurality of first and second inner electrodes. The second terminal electrode is connected to the second inner electrode. Each of the first inner electrodes has a first lead portion exposing an end to the first side face. At least one of the first inner electrodes also has a second lead portion whose end is exposed to the first side face. The first connecting conductor continuously covers all the ends of the first lead portions of the first inner electrodes and mechanically connects with the ends of the first lead portions.

Abstract: A multilayer capacitor 10 according to the present invention comprising: a dielectric body 12 formed by stacking a plurality of dielectric layers 12a having an approximately rectangular parallelepiped shape; an internal layer portion 17 wherein a first internal conductor layer 21 and a second internal conductor layer 22 are stacked alternately in said dielectric body 12 via said dielectric layer 12a as mutually overlapping in stacking direction Z to form an internal electrode circuit of a capacitor; an external layer portions 19a and 19b, adjacent to at least any of both end faces of said internal layer portion 17 in stacking direction Z, wherein a first external conductor layer 23 and a second external conductor layer 25 are stacked in said dielectric body 12 via said dielectric layer 12a so as not to overlap in stacking direction Z, the external layer portions 19a, 19b; a first terminal electrode 31 connected with said first internal conductor layer 21 and said first external conductor layer 23, formed at l