Patents by Inventor Masafumi Asano

Masafumi Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240010409
    Abstract: A lid material for PTP contains a polyethylene-based resin having a weight-average molecular weight of 3.5×104 to 5.2×104 and has an enthalpy of crystal fusion of 130 J/g or more as measured by a differential scanning calorimeter (DSC).
    Type: Application
    Filed: October 18, 2021
    Publication date: January 11, 2024
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventor: Masafumi ASANO
  • Publication number: 20240002123
    Abstract: A lid material for PTP contains a polypropylene-based resin having a weight-average molecular weight of 2.0×105 to 3.5×105 and has an enthalpy of crystal fusion of 70 J/g or more as measured by a differential scanning calorimeter (DSC).
    Type: Application
    Filed: October 18, 2021
    Publication date: January 4, 2024
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Masafumi ASANO, Motoki KONDO
  • Publication number: 20230036035
    Abstract: An information processing apparatus comprises a first heat generation circuit, a second heat generation circuit, a blocking assembly, and a processor. The blocking assembly performs a first operation of blocking air flowing from the first heat generation circuit toward the second heat generation circuit or a second operation of passing the air, and the processor is configure to instruct the blocking assembly to perform the first operation in a case where a temperature of the air is higher than a predetermined value, and instruct the blocking assembly to perform the second operation in a case where the temperature of the air is lower than the predetermined value.
    Type: Application
    Filed: April 27, 2022
    Publication date: February 2, 2023
    Applicant: FUJITSU LIMITED
    Inventors: Kiichi KOYAMA, Tatsuya SUDO, Kazuo TANAKA, Hirotaka SHIKADA, Hiroshi NAGAOKA, Hirofumi KONNO, Takatoshi KATOU, Nobuyoshi AIDA, Masafumi ASANO, Kazuo KUBO
  • Patent number: 11106128
    Abstract: According to an embodiment, a method for designing a mask set is provided. In the method for designing the mask set, an imprint-alignment mark is arranged in a region other than a chip region in an imprint shot formed in a template. The imprint-alignment mark is used for alignment during an imprint. Subsequently, the shape of the imprint shot is set based on an arrangement position of the imprint-alignment mark. Subsequently, another pattern is arranged in a region where the region is other than the chip region in the imprint shot and the imprint-alignment mark is not arranged. The other pattern is used in a process other than the imprint.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: August 31, 2021
    Assignee: Kioxia Corporation
    Inventors: Shinichiro Nakagawa, Masafumi Asano
  • Publication number: 20210114284
    Abstract: According to an embodiment, an imprint method includes applying a resist above a substrate, and bringing a template having a concave-convex pattern into contact with the resist. Then, the imprint method includes positioning the template and the substrate with respect to each other, while monitoring an alignment mark provided on the template and an alignment mark provided on the substrate, by using an optical monitor under a state where the template is set in contact with the resist. Further, the imprint method includes monitoring a filling state of the resist into a recessed pattern provided on the template, by using the optical monitor under a state where the template is set in contact with the resist.
    Type: Application
    Filed: December 29, 2020
    Publication date: April 22, 2021
    Applicant: Toshiba Memory Corporation
    Inventor: Masafumi ASANO
  • Publication number: 20190033712
    Abstract: According to an embodiment, a method for designing a mask set is provided. In the method for designing the mask set, an imprint-alignment mark is arranged in a region other than a chip region in an imprint shot formed in a template. The imprint-alignment mark is used for alignment during an imprint. Subsequently, the shape of the imprint shot is set based on an arrangement position of the imprint-alignment mark. Subsequently, another pattern is arranged in a region where the region is other than the chip region in the imprint shot and the imprint-alignment mark is not arranged. The other pattern is used in a process other than the imprint.
    Type: Application
    Filed: October 1, 2018
    Publication date: January 31, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Shinichiro NAKAGAWA, Masafumi Asano
  • Patent number: 10114284
    Abstract: According to an embodiment, a method for designing a mask set is provided. In the method for designing the mask set, an imprint-alignment mark is arranged in a region other than a chip region in an imprint shot formed in a template. The imprint-alignment mark is used for alignment during an imprint. Subsequently, the shape of the imprint shot is set based on an arrangement position of the imprint-alignment mark. Subsequently, another pattern is arranged in a region where the region is other than the chip region in the imprint shot and the imprint-alignment mark is not arranged. The other pattern is used in a process other than the imprint.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: October 30, 2018
    Assignee: Toshiba Memory Corporation
    Inventors: Shinichiro Nakagawa, Masafumi Asano
  • Publication number: 20180264712
    Abstract: According to an embodiment, an imprint method includes applying a resist above a substrate, and bringing a template having a concave-convex pattern into contact with the resist. Then, the imprint method includes positioning the template and the substrate with respect to each other, while monitoring an alignment mark provided on the template and an alignment mark provided on the substrate, by using an optical monitor under a state where the template is set in contact with the resist. Further, the imprint method includes monitoring a filling state of the resist into a recessed pattern provided on the template, by using the optical monitor under a state where the template is set in contact with the resist.
    Type: Application
    Filed: September 5, 2017
    Publication date: September 20, 2018
    Applicant: Toshiba Memory Corporation
    Inventor: Masafumi ASANO
  • Patent number: 10040219
    Abstract: According to one embodiment, a mold includes a base, a first concave pattern, a second concave pattern, and a third concave pattern. The base includes a first surface and a pedestal projecting from the first surface. The pedestal includes a first region and a second region disposed outside the first region. The first concave pattern is formed in the first region. The second concave pattern is formed in the second region. The third concave pattern extends from the first region to the second region.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: August 7, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Yoko Takekawa, Ryouichi Inanami, Masafumi Asano, Kazuhiro Takahata, Sachiko Kobayashi, Shigeki Nojima, Yohko Furutono, Masato Suzuki, Kenji Konomi
  • Patent number: 9433967
    Abstract: According to one embodiment, in a pattern inspection method, a guide pattern is formed on a substrate. A block copolymer is applied on the guide pattern. Thereafter, the substrate is heated according to a predetermined heating condition to promote directed self assembly corresponding to a shape of the guide pattern with respect to the block copolymer. Further, the substrate is observed by a fluorescence microscope during heating or after heating the substrate.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: September 6, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Masafumi Asano
  • Publication number: 20150261904
    Abstract: According to one embodiment, a pattern data generation method includes: decomposing data of a pattern to be formed into first guide pattern data and first DSA pattern data; generating a plurality of combinations of second guide pattern data and second DSA pattern data based on combinations of the first guide pattern data and the first DSA pattern data; carrying out simulation for each of the plurality of combinations of the second guide pattern data and the second DSA pattern data, and evaluating the simulation results using a predetermined evaluation function; and extracting one set or a plurality of sets of combinations that are suitable for forming the pattern to be formed, from among the plurality of combinations of the second guide pattern data and the second DSA pattern data, based on the evaluation results.
    Type: Application
    Filed: August 21, 2014
    Publication date: September 17, 2015
    Inventors: Sachiko KOBAYASHI, Yoshihiro Naka, Masafumi Asano, Shoji Mimotogi, Katsuyoshi Kodera
  • Publication number: 20150235911
    Abstract: According to one embodiment, in a pattern inspection method, a guide pattern is formed on a substrate. A block copolymer is applied on the guide pattern. Thereafter, the substrate is heated according to a predetermined heating condition to promote directed self assembly corresponding to a shape of the guide pattern with respect to the block copolymer. Further, the substrate is observed by a fluorescence microscope during heating or after heating the substrate.
    Type: Application
    Filed: May 21, 2014
    Publication date: August 20, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Masafumi ASANO
  • Publication number: 20150224702
    Abstract: According to one embodiment, a pattern inspection member is a pattern inspection member to which a pattern provided in an inspection object is transferred. The pattern inspection member includes a component pertaining to photosensitivity or thermosensitivity, a component pertaining to stretching and a component pertaining to feature retention of the pattern. The component pertaining to photosensitivity or thermosensitivity includes a photosensitive resin or a thermosensitive resin. The component pertaining to stretching includes a thermoplastic resin including no cyclic structure. The component pertaining to feature retention of the pattern includes a thermoplastic resin including a cyclic structure.
    Type: Application
    Filed: June 3, 2014
    Publication date: August 13, 2015
    Inventors: MASAFUMI ASANO, Seiji MORITA
  • Publication number: 20150217504
    Abstract: According to one embodiment, an imprint template used for imprint includes a pattern region, a peripheral region, a region, and a first transmittance control part. The pattern region is provided with a first protrusion. The peripheral region surrounds the pattern region. The region is provided in the peripheral region and provided with a second protrusion. The first transmittance control part is provided in the peripheral region and configured to control intensity of light transmitted through the template in thickness direction. The template has a planar shape axisymmetric with respect to a line passing through center of the template. The region provided with the second protrusion and the first transmittance control part are provided at positions axisymmetric to each other with respect to the line passing through the center of the template.
    Type: Application
    Filed: June 3, 2014
    Publication date: August 6, 2015
    Inventors: Shinichiro Nakagawa, Masafumi Asano, Satoshi Tanaka
  • Publication number: 20150037713
    Abstract: According to an embodiment, a method for designing a mask set is provided. In the method for designing the mask set, an imprint-alignment mark is arranged in a region other than a chip region in an imprint shot formed in a template. The imprint-alignment mark is used for alignment during an imprint. Subsequently, the shape of the imprint shot is set based on an arrangement position of the imprint-alignment mark. Subsequently, another pattern is arranged in a region where the region is other than the chip region in the imprint shot and the imprint-alignment mark is not arranged. The other pattern is used in a process other than the imprint.
    Type: Application
    Filed: December 24, 2013
    Publication date: February 5, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shinichiro NAKAGAWA, Masafumi ASANO
  • Publication number: 20140354799
    Abstract: According to one embodiment, a pattern inspection method includes acquiring a first image using a first condition by irradiating an electron beam onto a pattern to be inspected, acquiring a second image using a second condition by irradiating the electron beam onto the pattern, the second condition being different from the first condition, and judging the existence/absence of defects of the pattern by comparing the first image and the second image. A pattern inspection apparatus includes an electron source, a converging part, a stage, an image acquisition part, a controller and a judgment part. The controller is configured to perform a control to acquire a first image using a first condition and acquire a second image using a second condition different from the first condition. The judgment part is configured to judge the existence/absence of defects of the pattern by comparing the first and the second image.
    Type: Application
    Filed: August 15, 2013
    Publication date: December 4, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tomoko OJIMA, Masafumi ASANO
  • Publication number: 20140346701
    Abstract: According to one embodiment, a pattern formation device that presses a template that includes a concave and convex part onto a transferring object and that forms a pattern in which a shape of the concave and convex part is transferred is provided. The device includes: a calculation part; an adjustment part; and a transfer. The calculation part calculates, using design information of the pattern, the distribution of force applied to the pattern at a time of releasing the template pressed onto the transferring object from the transferring object. The adjustment part adjusts forming conditions of the pattern in order to uniformly approach the distribution of force calculated by the calculation part. The transfer part transfers the shape of the concave and convex part to the transferring object according to the forming conditions adjusted by the adjustment part.
    Type: Application
    Filed: August 8, 2014
    Publication date: November 27, 2014
    Inventors: Sachiko KOBAYASHI, Kazuhiro TAKAHATA, Yingkang ZHANG, Masafumi ASANO, Shigeki NOJIMA
  • Patent number: 8871408
    Abstract: According to one embodiment, a mask pattern creation method includes extracting an area, in which a DSA material is directed self-assembled to form a DSA pattern, from a design pattern area based on a design pattern and information on the DSA material. The method also includes creating a guide pattern that causes the DSA pattern to be formed in the area based on the design pattern, the information on the DSA material, the area, and a design constraint when forming the guide pattern. The method further includes creating a mask pattern of the guide pattern using the guide pattern.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: October 28, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoko Takekawa, Masafumi Asano, Yingkang Zhang, Kazuhiro Takahata, Tomoko Ojima
  • Publication number: 20140284846
    Abstract: According to one embodiment, a mold includes a base, a first concave pattern, a second concave pattern, and a third concave pattern. The base includes a first surface and a pedestal projecting from the first surface. The pedestal includes a first region and a second region disposed outside the first region. The first concave pattern is formed in the first region. The second concave pattern is formed in the second region. The third concave pattern extends from the first region to the second region.
    Type: Application
    Filed: August 30, 2013
    Publication date: September 25, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoko TAKEKAWA, Ryouichi INANAMI, Masafumi ASANO, Kazuhiro TAKAHATA, Sachiko KOBAYASHI, Shigeki NOJIMA, Yohko FURUTONO, Masato SUZUKI, Kenji KONOMI
  • Patent number: RE46390
    Abstract: According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: May 2, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masafumi Asano, Ryoichi Inanami, Masayuki Hatano