Abstract: A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second circuit board on which a second switching element and a second diode connected in inverse parallel are mounted, a printed circuit board disposed opposite the first circuit board and the second circuit board, and a plurality of conductive posts which electrically connect the first switching element, the second switching element, the first diode, the second diode, the first circuit board, or the second circuit board and metal layers of the printed circuit board. The first switching element and the second switching element are connected in anti-series to form a bidirectional switch.

Abstract: A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second circuit board on which a second switching element and a second diode connected in inverse parallel are mounted, a printed circuit board disposed opposite the first circuit board and the second circuit board, and a plurality of conductive posts which electrically connect the first switching element, the second switching element, the first diode, the second diode, the first circuit board, or the second circuit board and metal layers of the printed circuit board. The first switching element and the second switching element are connected in anti-series to form a bidirectional switch.

Abstract: A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second circuit board on which a second switching element and a second diode connected in inverse parallel are mounted, a printed circuit board disposed opposite the first circuit board and the second circuit board, and a plurality of conductive posts which electrically connect the first switching element, the second switching element, the first diode, the second diode, the first circuit board, or the second circuit board and metal layers of the printed circuit board. The first switching element and the second switching element are connected in anti-series to form a bidirectional switch.

Abstract: A semiconductor device includes an insulating substrate having an insulating plate and a circuit plate; a semiconductor chip having a front surface provided with a gate electrode and a source electrode, and a rear surface fixed to the circuit plate; a printed circuit board facing the insulating substrate, and including a first metal layer and a second metal layer; a first conductive post having two ends electrically and mechanically connected to the gate electrode and the first metal layer; a second conductive post having two ends electrically and mechanically connected to the source electrode and the second metal layer; and a circuit impedance reducing element electrically connected between the gate electrode and the source electrode through the first conductive post and the second conductive post.

Abstract: A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members, on each of which is mounted one or a plurality of power semiconductor chips, and a printed circuit board wherein a chip rod-form conductive connection member connected to the power semiconductor chip and a pattern rod-form conductive connection member connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member. The conductive pattern member is formed of a narrow portion and a wide portion, the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member, and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board.

Abstract: A semiconductor device includes an insulating substrate having an insulating plate and a circuit plate; a semiconductor chip having a front surface provided with a gate electrode and a source electrode, and a rear surface fixed to the circuit plate; a printed circuit board facing the insulating substrate, and including a first metal layer and a second metal layer; a first conductive post having two ends electrically and mechanically connected to the gate electrode and the first metal layer; a second conductive post having two ends electrically and mechanically connected to the source electrode and the second metal layer; and a circuit impedance reducing element electrically connected between the gate electrode and the source electrode through the first conductive post and the second conductive post.

Abstract: A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.

Abstract: A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second circuit board on which a second switching element and a second diode connected in inverse parallel are mounted, a printed circuit board disposed opposite the first circuit board and the second circuit board, and a plurality of conductive posts which electrically connect the first switching element, the second switching element, the first diode, the second diode, the first circuit board, or the second circuit board and metal layers of the printed circuit board. The first switching element and the second switching element are connected in anti-series to form a bidirectional switch.

Abstract: A semiconductor device includes: semiconductor modules in which a circuit board having at least one or more semiconductor chips mounted thereon is sealed with a mold resin material and an attachment hole is formed; main terminal plates that individually connect individual connection terminals of the plurality of semiconductor modules which are arranged in parallel; and a module storage case into which the plurality of the semiconductor modules connected by the main terminal plates are inserted integrally with the main terminal plates from an opening portion and which holds the plurality of semiconductor modules such that the position of the semiconductor modules can be adjusted during attachment and includes attachment insertion holes facing the attachment holes of the semiconductor modules.

Abstract: A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.

Abstract: A semiconductor device includes: a plurality of semiconductor modules, each of which includes a semiconductor circuit having a circuit board on which at least one or more semiconductor chips are mounted; and a module storage case that accommodates the plurality of semiconductor modules which are arranged in parallel. In the module storage case, a plurality of pairs of positioning guide members, which position and guide the semiconductor modules, are formed on opposite surfaces forming a module storage region for accommodating the semiconductor modules so as to protrude inward and to face each other, so that a distance between the plurality of semiconductor modules in a longitudinal direction can be selected. A pair of fitting concave portions, which are fitted to the pair of positioning guide members, are formed at both ends of each semiconductor module in the longitudinal direction.

Abstract: A semiconductor device includes an insulating substrate having a first conductive pattern on a first insulating substrate; a first semiconductor element having one surface fixed to the first conductive pattern; a printed circuit board having a conductive layer on a second insulating substrate and a plurality of metal pins fixed to the conductive layer; and a third insulating substrate. A portion of pins constituting the metal pins is fixed to other surface of the first semiconductor element, and the printed circuit board with the metal pins is sandwiched between the insulating substrate having the first conductive pattern and the third insulating substrate.

Abstract: A semiconductor device includes an insulating substrate having a first conductive pattern on a first insulating substrate; a first semiconductor element having one surface fixed to the first conductive pattern; a printed circuit board having a conductive layer on a second insulating substrate and a plurality of metal pins fixed to the conductive layer; and a third insulating substrate. A portion of pins constituting the metal pins is fixed to other surface of the first semiconductor element, and the printed circuit board with the metal pins is sandwiched between the insulating substrate having the first conductive pattern and the third insulating substrate.

Abstract: A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members, on each of which is mounted one or a plurality of power semiconductor chips, and a printed circuit board wherein a chip rod-form conductive connection member connected to the power semiconductor chip and a pattern rod-form conductive connection member connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member. The conductive pattern member is formed of a narrow portion and a wide portion, the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member, and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board.

Abstract: Semiconductor chips are disposed on an insulating substrate with conductive patterns, and a printed circuit board with metal pins is disposed above the insulating substrate with conductive patterns, with the semiconductor chips therebetween. A plurality of external lead terminals is fixed to the insulating substrate with conductive patterns, with the plurality of external lead terminals disposed adjacent to each other in parallel. Furthermore, metal foil pieces formed on front and rear surfaces of the printed circuit board with metal pins respectively so as to face each other, are disposed above the semiconductor chips.

Abstract: A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.

Abstract: A semiconductor device includes: a plurality of semiconductor modules, each of which includes a semiconductor circuit having a circuit board on which at least one or more semiconductor chips are mounted; and a module storage case that accommodates the plurality of semiconductor modules which are arranged in parallel. In the module storage case, a plurality of pairs of positioning guide members, which position and guide the semiconductor modules, are formed on opposite surfaces forming a module storage region for accommodating the semiconductor modules so as to protrude inward and to face each other, so that a distance between the plurality of semiconductor modules in a longitudinal direction can be selected. A pair of fitting concave portions, which are fitted to the pair of positioning guide members, are formed at both ends of each semiconductor module in the longitudinal direction.

Abstract: A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.

Abstract: Semiconductor chips are disposed on an insulating substrate with conductive patterns, and a printed circuit board with metal pins is disposed above the insulating substrate with conductive patterns, with the semiconductor chips therebetween. A plurality of external lead terminals is fixed to the insulating substrate with conductive patterns, with the plurality of external lead terminals disposed adjacent to each other in parallel. Furthermore, metal foil pieces, formed on front and rear surfaces of the printed circuit board with metal pins respectively so as to face each other, are disposed above the semiconductor chips.

Abstract: A semiconductor device includes: semiconductor modules in which a circuit board having at least one or more semiconductor chips mounted thereon is sealed with a mold resin material and an attachment hole is formed; main terminal plates that individually connect individual connection terminals of the plurality of semiconductor modules which are arranged in parallel; and a module storage case into which the plurality of the semiconductor modules connected by the main terminal plates are inserted integrally with the main terminal plates from an opening portion and which holds the plurality of semiconductor modules such that the position of the semiconductor modules can be adjusted during attachment and includes attachment insertion holes facing the attachment holes of the semiconductor modules.