Patents by Inventor Masafumi Horio

Masafumi Horio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 8026566
    Abstract: A semiconductor device includes a first metal foil, an insulating sheet mounted on an upper surface of the first metal foil main, at least one second metal foil mounted on the insulating sheet, at least one solder layer mounted on the at least one second metal foil, and at least one semiconductor element mounted on the at least one second metal foil through the at least one solder layer. The at least one semiconductor has a thickness of 50 ?m or greater and less than 100 ?m.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: September 27, 2011
    Assignee: Fuji Electric Systems Co., Ltd.
    Inventors: Masafumi Horio, Yoshinari Ikeda, Eiji Mochizuki
  • Method for manufacturing semiconductor module
    Patent number: 7985630
    Abstract: A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, and the semiconductor device; pouring a resin in a paste form into the case to fill a space relative to the first metal foil, insulating sheet, the second metal foil and the semiconductor device; and heat-curing the resin. A bottom end of a peripheral wall of the case is located above a bottom surface of the first metal. The bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: July 26, 2011
    Assignee: Fuji Electric Device Technology Co., Ltd.
    Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
  • Method for manufacturing semiconductor module
    Publication number: 20110059581
    Abstract: A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, and the semiconductor device; pouring a resin in a paste form into the case to fill a space relative to the first metal foil, insulating sheet, the second metal foil and the semiconductor device; and heat-curing the resin. A bottom end of a peripheral wall of the case is located above a bottom surface of the first metal. The bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.
    Type: Application
    Filed: November 9, 2010
    Publication date: March 10, 2011
    Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
  • Semiconductor module
    Patent number: 7902653
    Abstract: A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: March 8, 2011
    Assignee: Fuji Electric Systems Co., Ltd.
    Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
  • Semiconductor module and method for manufacturing semiconductor module
    Publication number: 20080284007
    Abstract: A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.
    Type: Application
    Filed: April 28, 2008
    Publication date: November 20, 2008
    Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
    Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
  • Semiconductor device and method for manufacturing semiconductor device
    Publication number: 20080284033
    Abstract: A semiconductor device includes a first metal foil, an insulating sheet mounted on an upper surface of the first metal foil main, at least one second metal foil mounted on the insulating sheet, at least one solder layer mounted on the at least one second metal foil, and at least one semiconductor element mounted on the at least one second metal foil through the at least one solder layer. The at least one semiconductor has a thickness of 50 ?m or greater and less than 100 ?m.
    Type: Application
    Filed: April 28, 2008
    Publication date: November 20, 2008
    Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
    Inventors: Masafumi Horio, Yoshinari Ikeda, Eiji Mochizuki