Abstract: A boot for a joint, wherein an equal-diameter part and thick-walled parts are formed on the inner peripheral wall of a large diameter tube part. A first tapered part extending from the equal-diameter part is continued with a second tapered part formed at the thick-walled parts in the circumferential direction. The diameter reducing ends of the first tapered part and the second tapered part are located at the same position, and a thin-walled part engaged with an annular groove formed in the outer member of a constant-velocity joint is continued with the diameter reducing end.

Abstract: A modeling device is disclosed that easily projects characteristic information obtained from an object onto a differently-shaped object, even if the object, from which the characteristic information is obtained, has a complex shape. A modeling device in one embodiment of the present invention includes a virtually electrifying section to calculate an electric potential at a spot in a heart at the time when a predetermined voltage is applied to the heart, and a projecting section to project a fiber orientation onto a heart model created on the basis of shape information that is input to the input section. The projecting section specifies a spot to be a target of projection on the basis of the electric potential obtained by the virtually electrifying section. Use of the electric potential in specifying the spot makes it possible to easily project the fiber orientation onto any heart having complex and various shapes.

Abstract: A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound. The resin composition is used as a chemically-amplified resist for microfabrication utilizing deep UV rays.

Abstract: A chemically amplified radiation-sensitive resin composition comprising a specific copolymer and a photoacid generator, wherein the copolymer contains the following recurring unit (1) and/or the recurring unit (2), and the recurring unit (3-1), wherein R1 is a hydrogen or methyl, R2 is a C4-10 tertiary alkyl, R3 and R4 are a hydrogen, C1-12 alkyl, C6-15 aromatic, C1-12 alkoxyl, or R3 and R4 may form, in combination and together with the nitrogen atom with which the R3 and R4 groups bond, a C3-15 cyclic structure, provided that R3 and R4 are not a hydrogen atom at the same time. The composition effectively responds to various radiations, exhibits excellent resolution and pattern configuration and minimal iso-dense bias, and can form fine patterns at a high precision and in a stable manner.

Abstract: A radiation-sensitive resin composition comprising (A) a resin comprising at least two recurring units of the formulas (1)–(6) in the total amount of 5–70 mol %, but each in the amount of 1–49 mol %, the resin being insoluble or scarcely soluble in alkali, but becoming easily soluble in alkali by the action of an acid, and (B) a photoacid generator. wherein R1 is a hydrogen or methyl and R2 is a substituted or unsubstituted alkyl group having 1–4 carbon atoms. The resin composition is useful as a chemically amplified resist having high transmittance of radiation, sensitivity, resolution, dry etching resistance, and pattern profile.

Abstract: A novel polysiloxane having high transparency to radiations with a wavelength of 193 nm or less, particularly 157 nm or less, and exhibiting superior dry etching resistance and a radiation-sensitive resin composition comprising the polysiloxane exhibiting superior sensitivity, resolution, and the like are provided. The polysiloxane is a resin having the structural unit (I) and/or structural unit (II) of the following formula (1), and having an acid-dissociable group, wherein R1 represents a monovalent aromatic group substituted with a fluorine atom or a fluoroalkyl group or a monovalent aliphatic group substituted with a fluorine atom or a fluoroalkyl group and R2 represents the above a monovalent aromatic group, the above monovalent aliphatic group, a hydrogen atom, a monovalent hydrocarbon group, haloalkyl group, or amino group.

Abstract: The logic integrated circuit comprises a logic circuit having the predetermined logic functions, a read/write memory circuit, a test circuit for testing whether fail bit is included in the memory circuit or not, and a boundary latch circuit formed of a plurality of flip-flop circuits which are capable of latching signals between said logic circuit and said memory circuit and also forming a shift register. Moreover, the logic integrated circuit is further provided with a fail relief information generating circuit for storing test result to the boundary latch circuit during execution of the test with the test circuit and generating the fail relief information for relieving fail of said memory circuit based on the stored test result. The test circuit mounted on the logic integrated circuit can generate the information for relieving fail bit in parallel with the test of a built-in memory circuit and can also output the same information to external side and relieve the RAM within a chip.

Abstract: A radiation-sensitive resin composition comprising: (A) a resin comprising a hydroxyl group or carboxyl group, of which the hydrogen atom has been replaced by an acid-dissociable group possessing an alkali dissolution controlling capability, the resin increasing the solubility in an alkaline aqueous solution when the acid-dissociable group dissociates, and a photoacid generator comprising (B-1) a sulfonium salt represented by 1-(3,5-dimethyl-4-hydroxyphenyl)tetrahydrothiophenium perfluoro-n-octanesulfonate and 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate and (B-2) a sulfonium salt represented by triphenylsulfonium nonafluoro-n-butanesulfonate. The radiation-sensitive resin composition useful as a novel chemically amplified resist exhibiting excellent sensitivity and resolution to deep ultraviolet rays typified by an ArF excimer laser, superior pattern shape-forming capability, and the like.

Abstract: A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound.

Abstract: A radiation-sensitive resin composition comprising an acid-labile group-containing resin and a photoacid generator is disclosed. The resin has a structure of the formula (1), wherein R1 represents a hydrogen atom, a monovalent acid-labile group, an alkyl group having 1-6 carbon atoms which does not have an acid-labile group, or an alkylcarbonyl group having 2-7 carbon atoms which does not have an acid-labile group, X1 represents a linear or branched fluorinated alkyl group having 1-4 carbon atoms, and R2 represents a hydrogen atom, a linear or branched alkyl group having 1-10 carbon atoms, or a linear or branched fluorinated alkyl group having 1-10 carbon atoms. The resin composition exhibits high transmittance of radiation, high sensitivity, resolution, and pattern shape, and is useful as a chemically amplified resist in producing semiconductors at a high yield.

Abstract: A chemically amplified radiation-sensitive resin composition comprising a specific copolymer and a photoacid generator, wherein the copolymer contains the following recurring unit (1) and/or the recurring unit (2), and the recurring unit (3-1), wherein R1 is a hydrogen or methyl, R2 is a C4-10 tertiary alkyl, R3 and R4 are a hydrogen, C1-12 alkyl, C6-15 aromatic, C1-12 alkoxyl, or R3 and R4 may form, in combination and together with the nitrogen atom with which the R3 and R4 groups bond, a C3-15 cyclic structure, provided that R3 and R4 are not a hydrogen atom at the same time. The composition effectively responds to various radiations, exhibits excellent resolution and pattern configuration and minimal iso-dense bias, and can form fine patterns at a high precision and in a stable manner.

Abstract: A chemically amplified radiation-sensitive resin composition comprising a specific copolymer and a photoacid generator, wherein the copolymer contains the following recurring unit (1) and/or the recurring unit (2), and the recurring unit (3-1), wherein R1 is a hydrogen or methyl, R2 is a C4-10 tertiary alkyl, R3and R4 are a hydrogen, C1-12 alkyl, C6-15 aromatic, C1-12 alkoxyl, or R3 and R4 may form, in combination and together with the nitrogen atom with which the R3 and R4 groups bond, a C3-15 cyclic structure, provided that R3 and R4 are not a hydrogen atom at the same time. The composition effectively responds to various radiations, exhibits excellent resolution and pattern configuration and minimal iso-dense bias, and can form fine patterns at a high precision and in a stable manner.

Abstract: A radiation-sensitive resin composition comprising: (A) an acid-dissociable group-containing resin, insoluble or scarcely soluble in alkali but becoming soluble in alkali when the acid-dissociable group dissociates, and containing recurring units with specific structures and (B) a photoacid generator of the formula (3), wherein R5 represents a monovalent aromatic hydrocarbon group, m is 1-8, and n is 0-5. The resin composition is suitable as a chemically-amplified resist responsive to deep ultraviolet rays such as a KrF excimer laser and ArF excimer laser, exhibits high transparency, excellent resolution, dry etching resistance, and sensitivity, produces good pattern shapes, and well adheres to substrates.

Abstract: A radiation-sensitive resin composition comprising an acid-labile group-containing resin and a photoacid generator is disclosed.

Abstract: A radiation-sensitive resin composition comprising an acid-labile group-containing resin and a photoacid generator is disclosed. The resin has a structure of the formula (1), wherein R1 represents a hydrogen atom, a monovalent acid-labile group, an alkyl group having 1-6 carbon atoms which does not have an acid-labile group, or an alkylcarbonyl group having 2-7 carbon atoms which does not have an acid-labile group, X1 represents a linear or branched fluorinated alkyl group having 1-4 carbon atoms, and R2 represents a hydrogen atom, a linear or branched alkyl group having 1-10 carbon atoms, or a linear or branched fluorinated alkyl group having 1-10 carbon atoms. The resin composition exhibits high transmittance of radiation, high sensitivity, resolution, and pattern shape, and is useful as a chemically amplified resist in producing semiconductors at a high yield.

Abstract: A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound. The resin composition is used as a chemically-amplified resist for microfabrication utilizing deep UV rays.

Abstract: A novel polysiloxane having high transparency to radiations with a wavelength of 193 nm or less, particularly 157 nm or less, and exhibiting superior dry etching resistance and a radiation-sensitive resin composition comprising the polysiloxane exhibiting superior sensitivity, resolution, and the like are provided.

Abstract: Acid-catalyzed positive resist compositions which are imageable with 193 nm radiation (and possibly other radiation) and are developable to form resist structures of improved development characteristics, improved etch resistance, and reduced post-exposure bake sensitivity are enabled by the use of resist compositions containing an imaging polymer having cyclic olefin monomeric units respectively having pendant, acid-labile protecting moieties, lactone moieties and fluoroalcohol moieties. The lactone moiety is preferably a pendant lactone ester.

Abstract: Acid-catalyzed positive resist compositions which are imageable with 193 nm radiation (and possibly other radiation) and are developable to form resist structures of improved development characteristics, improved etch resistance, and reduced post-exposure bake sensitivity are enabled by the use of resist compositions containing an imaging polymer having cyclic olefin monomeric units respectively having pendant, acid-labile protecting moieties, lactone moieties and fluoroalcohol moieties. The lactone moiety is preferably a pendant lactone ester.

Abstract: A radiation-sensitive resin composition comprising (A) a resin comprising at least two recurring units of the formulas (1)-(6) in the total amount of 5-70 mol %, but each in the amount of 1-49 mol %, the resin being insoluble or scarcely soluble in alkali, but becoming easily soluble in alkali by the action of an acid, and (B) a photoacid generator.