Patents by Inventor Masaharu Hida

Masaharu Hida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200365894
    Abstract: A positive electrode material has diffraction peaks at 2?=13.1°±0.2°, 14.0°±0.2°, and 18.4°±0.2° in X-ray diffraction (2?=5° to 90°) using synchrotron radiation having a wavelength of 1 ?, has a monoclinic crystal structure belonging to a space group P21/c, and is represented by a composition formula Li2?2xCo1+xP2O7 (?0.2?x?0.2).
    Type: Application
    Filed: August 6, 2020
    Publication date: November 19, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Tomochika KURITA, Kenji Homma, MASAHARU HIDA, jiyunichi iwata
  • Patent number: 10505185
    Abstract: A solid electrolyte including Li, Al, P, O, and N, wherein the solid electrolyte has a P2O7 structure.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: December 10, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Masaharu Hida, Satoru Watanabe, Tamotsu Yamamoto
  • Publication number: 20170324087
    Abstract: A solid electrolyte including Li, Al, P, O, and N, wherein the solid electrolyte has a P2O7 structure.
    Type: Application
    Filed: July 24, 2017
    Publication date: November 9, 2017
    Applicant: FUJITSU LIMITED
    Inventors: MASAHARU HIDA, Satoru Watanabe, Tamotsu YAMAMOTO
  • Patent number: 9543494
    Abstract: A p-type semiconductor block is made of a p-type thermoelectric conversion material, and has a pillar portion and a connection portion laterally protruding from the pillar portion. In addition, an n-type semiconductor block is made of an n-type thermoelectric conversion material, and has a pillar portion and a connection portion laterally protruding from the pillar portion. The p-type semiconductor block and the n-type semiconductor block are alternately arranged in such a way that the connection portion of the p-type semiconductor block is connected with the pillar portion of the n-type semiconductor block and the connection portion of the n-type semiconductor block is connected with the pillar portion of the p-type semiconductor block. The connection portions and tip-end portions of the pillar portions are made of a thermoelectric conversion material containing metal powder.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: January 10, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Masaharu Hida, Kazunori Yamanaka
  • Patent number: 8940571
    Abstract: P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: January 27, 2015
    Assignee: Fujitsu Limited
    Inventors: Kazuaki Kurihara, Masaharu Hida, Kazunori Yamanaka
  • Patent number: 8674588
    Abstract: An electric power generation device equipped with an apparatus which vibrates and generates heat includes a thermoelectric power generation module and a piezoelectric power generation module which are formed integrally. The thermoelectric power generation module has a first surface combining thermally and mechanically with the apparatus's outer surface and a second surface opposite to the first surface, and generates electric power from temperature differences between the first surface and the second surface caused by the apparatus's generating heat. The piezoelectric power generation module has a fixed end combining mechanically with the apparatus's outer surface and a movable end opposite to the fixed end, and generates electric power from displacement of the movable end to the fixed end caused by the apparatus's vibrating.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: March 18, 2014
    Assignee: Fujitsu Limited
    Inventors: Kazuaki Kurihara, Masaharu Hida, Kazunori Yamanaka
  • Publication number: 20130284229
    Abstract: P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.
    Type: Application
    Filed: July 2, 2013
    Publication date: October 31, 2013
    Inventors: Kazuaki Kurihara, Masaharu Hida, Kazunori Yamanaka
  • Patent number: 8501518
    Abstract: P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: August 6, 2013
    Assignee: Fujitsu Limited
    Inventors: Kazuaki Kurihara, Masaharu Hida, Kazunori Yamanaka
  • Publication number: 20120298165
    Abstract: An electric power generation device equipped with an apparatus which vibrates and generates heat includes a thermoelectric power generation module and a piezoelectric power generation module which are formed integrally. The thermoelectric power generation module has a first surface combining thermally and mechanically with the apparatus's outer surface and a second surface opposite to the first surface, and generates electric power from temperature differences between the first surface and the second surface caused by the apparatus's generating heat. The piezoelectric power generation module has a fixed end combining mechanically with the apparatus's outer surface and a movable end opposite to the fixed end, and generates electric power from displacement of the movable end to the fixed end caused by the apparatus's vibrating.
    Type: Application
    Filed: August 9, 2012
    Publication date: November 29, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Kazuaki KURIHARA, Masaharu HIDA, Kazunori YAMANAKA
  • Publication number: 20110226303
    Abstract: P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.
    Type: Application
    Filed: June 1, 2011
    Publication date: September 22, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Kazuaki Kurihara, Masaharu Hida, Kazunori Yamanaka
  • Publication number: 20110146741
    Abstract: A thermoelectric conversion module includes: p-type semiconductor blocks, each including a p-type thermoelectric conversion material, a first column portion and a first coupling portion that projects in a horizontal direction from an end of the first column portion; and n-type semiconductor blocks, each including an n-type thermoelectric conversion material, a second column portion and a second coupling portion that projects in a horizontal direction from an end of the second column portion, wherein the first coupling portions of the p-type semiconductor blocks are respectively coupled to the other ends of the second column portions of the n-type semiconductor blocks, and the second coupling portions of the n-type semiconductor blocks are respectively coupled to the other ends of the first column portions of the p-type semiconductor blocks, and the p-type semiconductor blocks and the n-type semiconductor blocks are alternately arranged and coupled to each other in series.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 23, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Masaharu Hida, Kazunori Yamanaka
  • Patent number: 7923905
    Abstract: A coating film is formed on the whole surface area of a body part. Formation of the coating film may be done by immersing the body part in a solution of parfluoropolyether. Then, the parfluoropolyether constituting the coating film is joined with the side surfaces of the body part by irradiating Xenon excimer laser in a nitrogen atmosphere onto the side faces of the body part, or to the surface exposing an electrode layer. As a result, the protective film is formed only on the side surfaces of the body part. Thus, the protective film is formed as a monomolecular film. Total body part is then cleaned by 2,3-dihydrodecafluoropentane to remove non-reacted coating film, thereby completing a multi-layer piezoelectric element.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: April 12, 2011
    Assignee: Fujitsu Limited
    Inventors: Shigeyoshi Umemiya, Masaharu Hida
  • Publication number: 20100073822
    Abstract: A magnetic head assembly includes: a slider; an actuator disposed on an end face of the slider; and a magnetic head unit connected to the actuator. The actuator has a structure in which multiple electrodes are arranged in a piezoelectric body, and is driven in d33 mode. In other words, when a predetermined voltage is applied to the actuator, a portion between the electrodes in the piezoelectric body expands or contracts with respect to a voltage application direction. When the piezoelectric body of the actuator expands or contracts, the magnetic head unit is deformed, and the deformation causes a change of the distance between a magnetic head (recording element and reproducing element) and a magnetic recording medium.
    Type: Application
    Filed: July 28, 2009
    Publication date: March 25, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Masaharu Hida, Shigeyoshi Umemiya, Kazuaki Kurihara
  • Patent number: 7635395
    Abstract: Solid material gasification method comprises a solution preparation step wherein a first solid material is dissolved in a solvent to prepare a gasification solution, a solvent removal step wherein a second solid material is separated by removing the solvent used to prepare the gasification solution from that solution, and a solid sublimation step wherein the second solid material is gasified by sublimation.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: December 22, 2009
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Hyodo, Hideki Yamawaki, Kenji Maruyama, Masaharu Hida
  • Publication number: 20090284872
    Abstract: A magnetic head support includes a slider on which a magnetic head is mounted; a suspension that supports the slider; and a pair of piezoelectric actuators that are arranged on sides of the slider other than a side on which the magnetic head is mounted so as to be opposed to each other. The piezoelectric actuators are fixed to the suspension and the slider, and cause the slider to undergo a rotational displacement.
    Type: Application
    Filed: July 29, 2009
    Publication date: November 19, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Masaharu HIDA, Shigeyoshi UMEMIYA, Masao KONDO
  • Publication number: 20090271963
    Abstract: A piezoelectric actuator comprises a body of a piezoelectric material, electrode patterns embedded in the body, and a sidewall protective film of a piezoelectric material covering at least a sidewall surface of the body, the sidewall protective film covering the electrode patterns at the sidewall surface of the body.
    Type: Application
    Filed: July 14, 2009
    Publication date: November 5, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Shigeyoshi Umemiya, Masaharu Hida, Masao Kondo
  • Publication number: 20090237841
    Abstract: A magnetic head includes a head element recording and reading data on and from a recording medium, a slider having an air bearing surface facing the recording medium, and having the head element forming surface which the head element being present on, and a piezoelectric device attached above the head element forming surface and the head element, and configured to displace a part of the head forming surface in a direction perpendicular to the air bearing surface.
    Type: Application
    Filed: March 16, 2009
    Publication date: September 24, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Kazuaki KURIHARA, Masaharu HIDA, Shigeyoshi UMEMIYA, Tsuyoshi AOKI
  • Patent number: 7501740
    Abstract: A microscale driving unit includes first and second elongated piezoelectric actuators extending in antiparallel directions. The base ends of the actuators are fixed to a support member. The tip ends of the actuators are fixed to a driven member. First and second electrically conductive members connect the base end of the first or second elongated piezoelectric actuator to the tip end of the second or first elongated piezoelectric actuator. The microscale driving unit allows utilization of a common single wiring pattern connected to both the base end of the first elongated piezoelectric actuator and the tip end of the second elongated piezoelectric actuator when a driving current is supplied to the first and second elongated piezoelectric actuators. Only a smaller area should be required to locate the wiring pattern. A sufficient planar space can be obtained on the surface of the support member.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: March 10, 2009
    Assignee: Fujitsu Limited
    Inventors: Masaharu Hida, Tsuyoshi Mita, Kazuaki Kurihara
  • Patent number: 7414353
    Abstract: A head assembly includes a suspension having a gimbal, a flexible printed wiring sheet having a plurality of conductor patterns and adhered to the suspension, first and second piezoelectric actuators mounted on the gimbal, and a head slider mounted on the first and second piezoelectric actuators. The first and second piezoelectric actuators are adhered to the gimbal at end portion adhesion portions symmetrical with respect to the center of pivotal motion thereof and are adhered to the head slider at end portion adhesion portions on the opposite side disposed symmetrically with respect to the center of pivotal motion similarly. Consequently, when a voltage is applied to the first and second piezoelectric actuators through the flexible printed wiring sheet, a couple of forces can be generated which vary the posture of the head slider only in one direction around the center of pivotal motion.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: August 19, 2008
    Assignee: Fujitsu Limited
    Inventors: Masaharu Hida, Tsuyoshi Mita, Kazuaki Kurihara
  • Publication number: 20080180849
    Abstract: According to an aspect of an embodiment, a method for manufacturing a magnetic head support having a piezoelectric device on a metal plate member comprises the steps of: providing a metal plate member; forming a piezoelectric layer of a piezoelectric material on the plate member at an elevated temperature; forming a first electrode layer of an electrical conducting material on the piezoelectric layer; and bending the metal plate member at a bending portion adjacent to the piezoelectric layer while the temperature is lowered from the elevated temperature after forming the piezoelectric layer.
    Type: Application
    Filed: January 15, 2008
    Publication date: July 31, 2008
    Applicant: Fujitsu Limited
    Inventors: Shigeyoshi Umemiya, Masaharu Hida, Masao Kondo, Tsuyoshi Aoki