Abstract: A cleaning device for a probe needle of a probe card rarely causing abrasion and deformation of the tip of a probe needle and capable of improving a probe needle life as well as a washing liquid used therefor are obtained. The tip of a probe needle of a probe card is immersed in a washing liquid for a probe needle of a probe card which includes an aqueous solution containing phosphoric acid or an aqueous solution containing chromic acid anhydride and phosphoric acid. While the tip of the probe needle is immersed in the washing liquid, the washing liquid is vibrated by a vibration generating member.

Abstract: The surface of a contact pin to contact a lead is shaped into a curved surface. After the surface of a contact pin base member made of beryllium copper or the like is plated with gold, the gold surface is coated first with a nickel or titanium thin film and then with a tungsten, chromium, or titanium thin film by sputtering. Alternatively, a contact pin base member made of beryllium copper that is not plated with gold is coated first with a nickel or titanium thin film and then with a tungsten, chromium, or titanium thin film by sputtering.

Abstract: A probe needle for a vertical needle type probe card is obtained that allows testing of electrical characteristics to be carried at high accuracy and that has high durability to reduce exchange work and cost. The configuration of a probe needle is formed to have a first bending portion bent towards a first lateral direction and a second bending portion bent towards a second lateral direction opposite to the first lateral direction at substantially 180° thereto. The stress exerted on the probe needle can be absorbed by the two bending portions at the left and right side. The deviation in the axis direction of the leading end of the probe needle can be reduced. Also, folding and bending of the probe needle can be prevented.

Abstract: An abrasive member and a cleaning device for a probe needle of a probe card are obtained which are capable of simplifying an operation of cleaning a probe needle of a probe card and also eliminating the step of employing an organic solvent or the like in the probe needle cleaning operation to improve the operating environment. In the cleaning device for a probe needle of a probe card, an abrasive member for a probe needle includes first and second fiber materials formed of at least one selected from the group consisting of a metal fiber, a carbon fiber and a ceramic fiber. The first and second fiber materials extend in different directions and are fixed to each other at a region thereof. A surface of abrasive member is provided with a space having approximately the same width as the width of the tip of a probe needle.

Abstract: An IC substrate provided with a plurality of solder bumps is prepared. Flux is applied to solder bumps. Solder bumps are heated for melting. Solder bumps are pressed against a heating portion having a flat surface. Solder bumps are cooled. An improved method of correcting solder bumps, which permits good soldering is provided.

Abstract: A main object of the present invention is to provide a vertical needle type probe card which is improved so that necessary needle pressure is obtained even if variation of the probe needles in the height direction is larger to some extent. The upper portion of a probe needle is supported by an upper guide plate. The lower portion of probe needle is supported by a lower guide plate. Upper portion of probe needle is bent into an L shape. A conductive rubber sheet and a printed wiring board are provided on upper guide plate.

Abstract: A probe needle has one end and the other end. Probe needle has its one end fixed to the bottom surface of a substrate, and extending at a prescribed angle to substrate. A portion of probe needle positioned between the one end and the other end is pressed by a rod attacked between a pair of pillow toward substrate. Thus, an improved probe card which permits appropriate pressure needle to be provided even if the variation in the height of probe needles is large.

Abstract: An improved probe card with a vertical needle is provided which ensures required needle pressure even when there is a significant variation of probe needles in a height direction. Upper and lower portions of probe needle are respectively supported by upper and lower guide plates. Upper portion of probe needle is bent in an L shape. A printed substrate is provided on upper guide plate.

Abstract: A socket for a semiconductor device usable with semiconductor devices having different sizes, the same number and positions of external leads, and leads suitable for transmission of high-speed signals. A semiconductor device is positioned by placing a movable contact of the socket in contact with the outer end surface of a corresponding external lead of the semiconductor device and urging each movable contact inwardly from an outer position. Simultaneously, an electrical connection between the external lead and the movable contact is made by a contact, under pressure, and located between the upper surfaces of the external lead and corresponding movable contacts.

Abstract: A probe cleaning tool including an abrading member for scraping foreign material adhering to an end portion of a probe, made of a mixture of an elastic base material and abrasive particles, and a dust removing film attached to a surface of the abrading member. The dust removing film removes foreign material adhering to the end portion of the probe when the end portion is stuck into and extracted from the probe cleaning tool. The foreign material scraped off the end portion of the probe are confined in the probe cleaning tool and the end portion of the probe can be completely cleaned.

Abstract: A modem apparatus includes a modem circuit operatively connected to a control unit and a communication line. The modem circuit modulates a carrier signal so as to generate a modulated signal according to signal data inputted from the control unit, and transmits the modulated signal through the communication line. In addition, the modem circuit demodulates a modulated signal received through the communication line so as to generate signal data, and outputs the signal data to the control unit. A first memory stores a communication program to be executed by the control unit, and a second memory stores telephone number list data including a plurality of telephone numbers of further parties which are used when the communication program is executed. Further, an interface circuit connects the first memory, the second memory and the modem circuit to the control unit, and executes an interfacing process between the control unit and each of the first memory, the second memory and the modem circuit.

Abstract: A semiconductor inspection device and a method of controlling the same are obtained which are capable of preventing any positional displacement of a probe needle of the semiconductor inspection device relative to an electrode of a semiconductor device to be inspected and thus ensuring that the semiconductor device is inspected. The semiconductor inspection device provided with a probe needle for a probe card and a guide plate for positioning the probe needle employs a temperature sensor provided on the probe needle positioning guide plate, a heater for heating the positioning guide plate and a cooling fan for cooling the positioning guide plate and refers to the temperature of the positioning guide plate measured by the temperature sensor to provide ON/OFF control of the heater and the cooling fan by means of a control device.

Abstract: A probe needle for a probe card, and a method of fabrication and control thereof that prevents degradation in the reliability of a semiconductor device originating from an inspection process are provided. In a cantilever type probe needle for a probe card, a leading end of the probe needle is formed to include a first convex portion and a second convex portion separated from the first convex portion with a groove therebetween.

Abstract: A semiconductor device is provided to ensure electrical connection with a probe needle and also provide ready maintenance of the probe needle. The semiconductor device includes a silicon substrate, a bonding pad electrode layer formed on the silicon substrate, and a rhenium layer formed on the bonding pad electrode layer.

Abstract: A multiple function PC card that is an input/output card providing two or more functions not used simultaneously including a PC connector for connecting the multiple function PC card to a computer, a device connector for connecting external devices accessing the functions of the card, an execution device for executing the functions, and a discriminator for identifying which functions correspond to the connected devices, wherein the discriminator outputs the function identification results, and the execution device operates and executes the corresponding function exclusively of other execution devices.

Abstract: ISDN-interface PC Card comprises a device connector for connecting a data processing device, a line connector for connecting a digital service unit (DSU), a controller for switching data sending and data receiving with the ISDN connected to the line connector and controlling the data communication conditions based on commands from the data processing device input through the device connector, a voice communication device connector for connecting a voice communication device, a connection detector for detecting connection of a voice communication device, and a data converter for coding and decoding the data input and output between the voice communication device and controller. When the connection detector detects that a voice communication device has been connected, the controller switches the ISDN line so that one ISDN B channel is used for data communication with the data processing device and the other B channel is used for voice communication.

Abstract: A car navigation system equipped with an interface for a detachable memory card that stores travel tracks and the like of cars and the like, comprises a data collector that collects, once at every given time interval or at every given distance interval, the travel date, starting position, destination, passing position, starting time, passing time, arrival time, travel distance and the like, a data recorder that stores the travel data collected by the data collector in the memory card, and a data printing processor that reads out data specified by the user from the travel records stored in the memory card to output the travel data to a printer.

Abstract: A memory card including a DRAM integrated circuit that operates at 3.3 V is designed to be used with an information processing device that provides the memory card with a power supply voltage of 3.3 V or 5 V. The memory card includes a power supply voltage control circuit for producing a voltage of 3.3 V from the power supply voltage provided by the information processing device and an input/output buffer disposed between the information processing device and the DRAM integrated circuit which receives the voltage of 3.3 V from the power supply voltage control circuit and converts the voltages of the signals from either device so that they can properly receive and process the signals therebetween.

Abstract: The memory card with an ECC circuit for adding ECC.sub.S to main data to be stored comprises a memory consisting of SRAM, a detection circuit for detecting the frequency of data access operation to the memory and a power supply voltage converter for lowering the power supply voltage provided from an external information processor when the frequency of data access is less than the predetermined threshold.

Abstract: A memory card including an integrated memory circuit and internal power supply wherein a power supply voltage to the memory circuit is supplied from the internal power supply when the memory card is not mounted in a data processing device and from the data processing device when the memory card is mounted therein and further includes an operating signal detection circuit for determining whether the memory card is active or inactive in a mounted state and a power supply control circuit for dropping the power supply voltage applied to the memory circuit by a predetermined amount when the memory card is inactive.