Abstract: A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins.

Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.

Abstract: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50.

Abstract: A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.

Abstract: A gas storage tank for storing a gas, the tank has an opening formed on at least one of two ends; a filling unit that is housed in the tank; and a support member that is arranged between the tank and the filling unit and holds the filling unit in the tank to connect a whole gap formed between the tank and the filling unit with the opening.

Abstract: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50.

Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.

Abstract: A fuel cell system supplies hydrogen to a fuel cell from a hydrogen storage tank in which a hydrogen absorption alloy is incorporated, and uses a heat medium that has cooled the fuel cell to heat the hydrogen absorption alloy when hydrogen is released from the hydrogen absorption alloy. The hydrogen storage tank is filled with hydrogen gas at a temperature which is no lower than the highest temperature reached by the heat medium at the time of steady operation of the fuel cell, and under a pressure which is no lower than the equilibrium pressure of the hydrogen absorption alloy. Hydrogen is released from the hydrogen absorption alloy at a temperature which is lower than the temperature of the hydrogen absorption alloy when the above described filling is completed.

Abstract: A soldering container configured to be conveyed by a conveyance mechanism during soldering in a state accommodating a soldering subject. The container includes a sealable container body for accommodating the soldering subject. The container body includes at least one communication passage enabling communication between the inside and outside of the container body. The container body is configured to be connectable to an atmospheric adjustment device for adjusting an internal atmosphere of the container body through the communication passage.

Abstract: A soldering apparatus has a sealable container which accommodates a circuit board therein, weights disposed immediately upon semiconductor devices to press the semiconductor devices toward the circuit board, and high-frequency heating coils causing the weight to generate heat due to electromagnetic induction. The high-frequency heating coils are disposed away from the weights. The heat generated in each weight is applied to a plurality of joint sites of the circuit board, thereby soldering the semiconductor devices to the joint sites. As a result, efficient heating is realized while simplifying the configuration of the apparatus.

Abstract: An object-to-be-soldered (92) is accommodated in a sealable chamber (17). An internal pressure (P) of the chamber (17) is raised to a normal pressure (Po) or higher by feeding a reducing gas to the chamber (17). A soldering of a semiconductor element (12) with respect to a circuit board (11) is carried out in the pressurized state. The pressurized state indicating a set pressure (P1) (for example, 0.13 MPa) is maintained in a solder melting period (t3 to t7) until the molten solder (33) is solidified (t7) after the solder (33) starts melting (t3). Accordingly, voids are inhibited from being generated in the solder after being solidified.

Abstract: A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder.

Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on a side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5. The stress relaxation member 4 is formed of an aluminum plate 10 having a plurality of through holes 9 formed therein, and the through holes 9 serve as stress-absorbing spaces. The stress relaxation member 4 is brazed to the metal layer 7 of the insulating substrate 3 and to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

Abstract: A soldering method for soldering a semiconductor element to each of bonding portions defined at a plurality of locations on a circuit board is disclosed. The soldering method includes laying out the bonding portions in a non-linear manner in at least three locations on the circuit board, placing the semiconductor elements on the bonding portions with solder in between, placing a weight on the at least three semiconductor elements, which are laid out in a non-linear manner, so that the weight extends over the semiconductor elements, and soldering the semiconductor elements to the bonding portions by melting the solder while pressurizing the semiconductor elements with the weight. This reduces variations in thickness of the solder at the plurality of bonding portions when soldering the plurality of semiconductor elements to the circuit board.

Abstract: A soldering method for soldering an electronic component to a circuit board is disclosed. The soldering method includes placing the electronic component on the bonding portion of the circuit board with solder arranged between the electronic component and the bonding portion, placing a weight on the electronic component, and heating and melting the solder while pressing the electronic component toward the circuit board with the weight. The weight is spaced from the electronic component while the temperature of the solder is still high after the melted solder wets the bonding portion and the bonding surface of the electronic component and spreads out therebetween.

Abstract: A tank system of the invention with multiple tanks makes a joint flow of a fluid released from the multiple tanks and supplies the joint flow to a downstream device, which is located downstream of the multiple tanks. The tank system includes: primary pressure measurement modules that individually measure internal pressures of the multiple tanks as primary pressures; a secondary pressure measurement module that measures a pressure of the joint flow of the fluid as a secondary pressure; flow rate regulation modules that individually regulate release flow rates of the fluid to be released from the multiple tanks; and a pressure control module that estimates a supply flow rate to be supplied to the downstream device from the measured secondary pressure, and then sets an allocation of the supply flow rate of the fluid to be released from each of the multiple tanks corresponding to the measured primary pressure with regard to the tank.

Abstract: The technique of the invention manufactures a gas storage tank, which includes a gas absorbent/adsorbent and is capable of storing a high-pressure gas. The manufacturing process of a hydrogen storage tank first assembles a heat exchanger unit and packs the particles of hydrogen storage alloy into the heat exchanger unit. The manufacturing process then blocks hydrogen storage alloy filling holes used for packing the hydrogen storage alloy in the heat exchanger unit and attaches a detachable cover member to a hydrogen inlet. The manufacturing process subsequently locates the heat exchange unit filled with the hydrogen storage alloy in a cylindrical tank and narrows both ends of the tank to form joint openings. The manufacturing process then heat-treating the tank under water cooling and detaches the cover member. The manufacturing process attaches joint assemblies to the joint openings and forms a reinforcement layer around the outer circumference of the tank to complete the hydrogen storage tank.

Abstract: The technique of the invention manufactures a gas storage tank, which includes a gas absorbent/adsorbent and is capable of storing a high-pressure gas. The manufacturing process of a hydrogen storage tank first assembles a heat exchanger unit and packs the particles of hydrogen storage alloy into the heat exchanger unit. The manufacturing process then blocks hydrogen storage alloy filling holes used for packing the hydrogen storage alloy in the heat exchanger unit and attaches a detachable cover member to a hydrogen inlet. The manufacturing process subsequently locates the heat exchange unit filled with the hydrogen storage alloy in a cylindrical tank and narrows both ends of the tank to form joint openings. The manufacturing process then heat-treating the tank under water cooling and detaches the cover member. The manufacturing process attaches joint assemblies to the joint openings and forms a reinforcement layer around the outer circumference of the tank to complete the hydrogen storage tank.

Abstract: A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.

Abstract: A pressure tank includes a liner separated into a cap and a main body. A shell covers the outer surface of the liner. The shell is formed of a fiber reinforced plastic. A heat exchanger is arranged in the liner. A header is connected to the heat exchanger. The heat exchanger is supported on the liner by fastening the header to the cap or the main body.