Patents by Inventor Masahiko Kitamura

Masahiko Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040092108
    Abstract: A method of processing a semiconductor wafer having a large number of rectangular areas sectioned by streets arranged in a lattice form on the front surface, circuits being formed in the respective areas. This method comprises the step of mounting a semiconductor wafer on a protective substrate in such a manner that the front surface of the semiconductor wafer is opposed to one side of the protective substrate having a large number of pores in at least its central area prior to the grinding of the back surface of the semiconductor wafer.
    Type: Application
    Filed: October 28, 2003
    Publication date: May 13, 2004
    Inventors: Kouichi Yajima, Masahiko Kitamura, Shinichi Namioka, Masatoshi Nanjo
  • Publication number: 20040072520
    Abstract: A magnetic tape or magnetized tape is affixed to one side of a sheet-like workpiece, for example, the front surface of a semiconductor wafer. A substrate has a support area, which is at least partially formed of a porous material and is at least partially magnetized or magnetic.
    Type: Application
    Filed: August 13, 2003
    Publication date: April 15, 2004
    Inventor: Masahiko Kitamura
  • Publication number: 20040048419
    Abstract: A semiconductor wafer is applied to a support disk via an intervening adhesive layer 10 with the front side of the semiconductor wafer facing the adhesive layer, which is sensitive to a certain exterior factor for reducing its adhesive force; the semiconductor wafer is ground on the rear side; the wafer-and-support combination is applied to a dicing adhesive tape with the so ground rear side facing the dicing adhesive tape, which is surrounded and supported by the circumference by a dicing frame; the certain exterior factor is effected on the intervening adhesive layer to reduce its adhesive force; and the intervening adhesive layer and support disk are removed from the semiconductor wafer or chips without the possibility of damaging the same.
    Type: Application
    Filed: July 8, 2003
    Publication date: March 11, 2004
    Inventors: Masahiko Kitamura, Koichi Yajima, Yusuke Kimura, Tomotaka Tabuchi
  • Patent number: 5572292
    Abstract: The present invention provides a cartridge life detecting system which detects and manages the life of a cartridge by mounting a memory on a print cartridge comprising at least an image formation member removably mounted on a main body of an image formation apparatus, carrying out operation to obtain information about the life of the cartridge based on contents read from the memory and criterial information of the life of the cartridge, and writing information about the life in the memory, comprises the steps of setting a value corresponding to the life of the cartridge by selecting one among combination of the number of printed sheets and the number of rotations of the image formation member, combination of the number of printed sheets and the number of pixels of image information, and combination of the number of printed sheets, the number of rotations of the image formation member and the number of pixels of image information, storing the value in the memory in advance, and making determination as to the l
    Type: Grant
    Filed: April 11, 1995
    Date of Patent: November 5, 1996
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Kiyoshi Chatani, Masahiko Kitamura, Kazuhiro Yoshihara
  • Patent number: 5508879
    Abstract: A charge removal brush with a number of long conductive filamentous elements for removing charges from an object when the charge removal brush comes in contact with the object, is disclosed. The charge removal brush includes a metal shaft rotatable about the axis thereof, a strip-like woven cloth including a base cloth and long conductive filamentous elements uniformly planted in the substantially entire surface of the base cloth, the strip-like woven cloth being spirally wound on the metal shaft with no gap, and a conductive fiber is woven into the base cloth in a state that the conductive fiber runs along the center line of the base cloth, which is extended in the lengthwise direction of the base cloth.
    Type: Grant
    Filed: August 30, 1994
    Date of Patent: April 16, 1996
    Assignees: Fuji Xerox Co., Ltd., Tsuchiya Co., Ltd.
    Inventors: Masahiko Kitamura, Kiyoshi Chatani, Kazuhiro Yoshihara, Ikuro Sugiyama, Toyohiro Kanzaki
  • Patent number: 4567556
    Abstract: A sequence control apparatus includes a control unit and a memory unit detachably mounted to the control unit. The memory unit includes a memory device connected to an input circuit and an output circuit of the control unit via a pin connector. The memory device itself conducts logical operations in response to the input signals applied to the input circuit of the control unit.
    Type: Grant
    Filed: March 3, 1982
    Date of Patent: January 28, 1986
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Toshiro Onogi, Kenichi Yoda, Masahiko Kitamura