Patents by Inventor Masahiko Kobayakawa

Masahiko Kobayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    Publication number: 20150091040
    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
    Type: Application
    Filed: December 18, 2014
    Publication date: April 2, 2015
    Inventor: Masahiko KOBAYAKAWA
  • LED module
    Patent number: 8994062
    Abstract: A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: March 31, 2015
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • LED MODULE
    Publication number: 20150048412
    Abstract: A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1. An LED unit 3 includes an LED chip 30 with a electrode terminal 31 connected to the lead 1 and another electrode terminal 32 connected to the lead 2. The LED unit 3, mounted on a surface of the die-bonding portion 11 on a first side in z direction, overlaps the opening 11a. A wire 52 connects the lead 2 and the electrode terminal 32. A support member 4 supporting the leads 1-2 is held in contact with another surface of the die-bonding portion 11 on a second side in z direction. These arrangements ensure efficient heat dissipation from the LED chip 30 and efficient use of light emitted from the LED chip 3.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventor: Masahiko KOBAYAKAWA
  • Semiconductor light-emitting device
    Patent number: 8946763
    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: February 3, 2015
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 8921874
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: December 30, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • LED module having LED chips as light source
    Patent number: 8901578
    Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: December 2, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
  • LED MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140340887
    Abstract: A compact LED module and a method of manufacturing such an LED module are provided. The LED module includes a first-pole first lead, a first-pole second lead, a first-pole third lead, a second-pole first lead, a second-pole second lead, a second-pole third lead, a first LED chip, a second LED chip, a third LED chip, and a housing. A distal end of the first-pole first lead is offset toward a second-pole side in a first direction with respect to both a distal end of the second-pole second lead and a distal end of the second-pole third lead.
    Type: Application
    Filed: May 12, 2014
    Publication date: November 20, 2014
    Applicant: ROHM CO., LTD.
    Inventor: Masahiko KOBAYAKAWA
  • LED MODULE
    Publication number: 20140339595
    Abstract: An LED module is provided with a lead, an LED chip mounted on the obverse surface of the lead, and a case covering at least a part of the lead. The case has a side wall surrounding the LED chip. The lead includes a thin extension whose bottom surface is spaced apart upward from the reverse surface of the lead in the thickness direction of the lead.
    Type: Application
    Filed: May 12, 2014
    Publication date: November 20, 2014
    Applicant: ROHM CO., LTD.
    Inventor: Masahiko KOBAYAKAWA
  • LED module
    Patent number: 8890203
    Abstract: A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1. An LED unit 3 includes an LED chip 30 with a electrode terminal 31 connected to the lead 1 and another electrode terminal 32 connected to the lead 2. The LED unit 3, mounted on a surface of the die-bonding portion 11 on a first side in z direction, overlaps the opening 11a. A wire 52 connects the lead 2 and the electrode terminal 32. A support member 4 supporting the leads 1-2 is held in contact with another surface of the die-bonding portion 11 on a second side in z direction. These arrangements ensure efficient heat dissipation from the LED chip 30 and efficient use of light emitted from the LED chip 3.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: November 18, 2014
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • LED MODULE
    Publication number: 20140209964
    Abstract: A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.
    Type: Application
    Filed: March 31, 2014
    Publication date: July 31, 2014
    Applicant: ROHM CO., LTD.
    Inventor: Masahiko KOBAYAKAWA
  • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    Publication number: 20140167233
    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. (FIG.
    Type: Application
    Filed: February 19, 2014
    Publication date: June 19, 2014
    Applicant: ROHM CO., LTD.
    Inventor: Masahiko KOBAYAKAWA
  • LED module
    Patent number: 8723215
    Abstract: A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: May 13, 2014
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140103375
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: December 17, 2013
    Publication date: April 17, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light-emitting device
    Patent number: 8680568
    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: March 25, 2014
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 8633506
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: January 21, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    Publication number: 20140008695
    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
    Type: Application
    Filed: September 9, 2013
    Publication date: January 9, 2014
    Applicant: ROHM CO., LTD.
    Inventor: Masahiko KOBAYAKAWA
  • Semiconductor light emitting device
    Patent number: 8552442
    Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the front of the semiconductor light emitting element. The lead includes an elongated mounting portion projecting from the resin package. The mounting portion includes a pair of first projections spaced from each other in the longitudinal direction and a second projection positioned between the first projections. The first projections and the second projection project in opposite directions from each other in the width direction of the mounting portion.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: October 8, 2013
    Assignee: Rohm Co., Ltd.
    Inventors: Yasunori Hata, Masahiko Kobayakawa
  • Semiconductor light-emitting device
    Patent number: 8541808
    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: September 24, 2013
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • LED MODULE
    Publication number: 20130175559
    Abstract: An LED module 101 is provided with an LED chip 200 that includes a sub-mount substrate 210 made of Si and a semiconductor layer 220 laminated on the sub-mount substrate 210. The module also includes white resin 280 that does not transmit light from the semiconductor layer 220 and that covers at least part of a side of the sub-mount substrate 210, where the side is connected to the surface on which the semiconductor layer 220 is laminated. These arrangements enhance the brightness of the LED module 101.
    Type: Application
    Filed: October 12, 2011
    Publication date: July 11, 2013
    Applicant: ROHM CO., LTD.
    Inventor: Masahiko Kobayakawa
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 8431949
    Abstract: A light emitting device includes a semiconductor light emitting element, a first lead including an element mount portion on which the semiconductor light emitting element is mounted, and a second lead electrically connected to the semiconductor light emitting element. The light emitting device further includes a resin package covering the semiconductor light emitting element and part of each of the first and the second leads. The resin package includes a lens portion facing the semiconductor light emitting element. The first lead includes a pair of standing portions spaced from each other with the element mount portion intervening between them and a pair of terminal portions extending from the standing portions in mutually opposite directions. Each of the standing portions projects from the resin package in a direction away from the lens portion.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: April 30, 2013
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Tomokazu Okazaki