Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.

Abstract: A surface mount electronic component includes a set of a first lead terminal 2a and a second lead terminal 3b, a semiconductor element 6a die-bonded to an island portion 4a integrally formed at an end of the first lead terminal, a metal wire 7a electrically connecting the semiconductor element and a bonding portion 5b integrally formed at an end of the second lead terminal to each other, and a package 8 made of synthetic resin and hermetically sealing the island portion and the bonding portion. The island portion and the bonding portion are formed by plastic deformation of a portion of each of the lead terminals to be positioned within the package from a lower surface side to reduce the thickness and increase the width.

Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.

Abstract: A method for cutting a lead terminal of a packaged electronic component including a resin package (5), an element (2) covered by the package (5), and a lead terminal (3) connected to the element (2) and including a protruding portion extending out of the package (5). The method includes the steps of forming a narrow bridge portion (23) at the lead terminal (3) by removing a part of the protruding portion, providing a metal plate to the protruding portion of the lead terminal (3), and cutting the lead terminal (3) at the narrow bridge portion (23).

Abstract: A surface mount electronic component includes a set of a first lead terminal 2a and a second lead terminal 3b, a semiconductor element 6a die-bonded to an island portion 4a integrally formed at an end of the first lead terminal, a metal wire 7a electrically connecting the semiconductor element and a bonding portion 5b integrally formed at an end of the second lead terminal to each other, and a package 8 made of synthetic resin and hermetically sealing the island portion and the bonding portion. The island portion and the bonding portion are formed by plastic deformation of a portion of each of the lead terminals to be positioned within the package from a lower surface side to reduce the thickness and increase the width.

Abstract: In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while leaving unnotched portions adjoining both ends of the main notch. Then, each lead terminal is cut at the main notch after molding the molded part, thereby making fewer and smaller cutting burrs occurring at the cut faces.

Abstract: The electric component includes at least a set of electrode terminals 2, 3, a semiconductor element 4 electrically connected with the set of electrode terminals, and a package 6 made of synthetic resin and sealing the electrode terminals and the semiconductor element with part of a lower surface of each of the electrode terminals exposed at a lower surface of the package. A cover layer 11 made of synthetic resin is formed to cover a cut surface of a tip of a connector lead remainder extending integrally outward from the each of the electrode terminals. Thus, disadvantages resulting from exposure of the cut surface of the tip of the connector lead remainder are eliminated.

Abstract: A semiconductor device X1 comprises: a first conductor 110 including a first terminal surface 113a; a second conductor 120 placed by the first conductor 110 and including a second terminal surface 123a facing a same direction as does the first terminal surface 113a; a third conductor 130 connected with the first conductor 110; a semiconductor chip 140 including a first surface 141 and a second surface 142 away from the first surface, and bonded to the first conductor 110 and to the second conductor 120 via the second surface 142; and a resin package 150. The first surface 141 of the semiconductor chip 140 is provided with a first electrode electrically connected with the first conductor 110 via the third conductor 130. The second surface 142 is provided with a second electrode electrically connected directly with the second conductor 120.

Abstract: In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while leaving unnotched portions adjoining both ends of the main notch. Then, each lead terminal is cut at the main notch after molding the molded part, thereby making fewer and smaller cutting burrs occurring at the cut faces.

Abstract: A semiconductor device X1 comprises: a first conductor 110 including a first terminal surface113a; a second conductor 120 placed by the first conductor 110 and including a second terminal surface 123a facing a same direction as does the first terminal surface 113a; a third conductor 130 connected with the first conductor 110; a semiconductor chip 140 including a first surface 141 and a second surface 142 away from the first surface, and bonded to the first conductor 110 and to the second conductor 120 via the second surface 142; and a resin package 150. The first surface 141 of the semiconductor chip 140 is provided with a first electrode electrically connected with the first conductor 110 via the third conductor 130. The second surface 142 is provided with a second electrode electrically connected directly with the second conductor 120.

Abstract: A semiconductor device X1 comprises: a first conductor 110 including a first terminal surface 113a; a second conductor 120 placed by the first conductor 110 and including a second terminal surface 123a facing a same direction as does the first terminal surface 113a; a third conductor 130 connected with the first conductor 110; a semiconductor chip 140 including a first surface 141 and a second surface 142 away from the first surface, and bonded to the first conductor 110 and to the second conductor 120 via the second surface 142; and a resin package 150. The first surface 141 of the semiconductor chip 140 is provided with a first electrode electrically connected with the first conductor 110 via the third conductor 130. The second surface 142 is provided with a second electrode electrically connected directly with the second conductor 120.

Abstract: A semiconductor device includes an insulating substrate, a cutout formed in side surfaces of the substrate, a conductive pad formed on the obverse surface of the substrate, an electrode formed on the reverse surface of the substrate, a semiconductor chip mounted on the substrate, and a connector which connects the pad to the electrode. The connector is arranged in the cutout.

Abstract: A semiconductor device includes a semiconductor chip, a plurality of conductors electrically connected to the semiconductor chip, and a resin package for sealing the semiconductor chip and the conductors. Each of the conductors has a thicker portion and a thinner portion. The thicker portion includes a lower surface exposed at a bottom surface of the resin package as a terminal for surface-mounting. The thicker portion of at least one of the conductors is non-rectangular with partially or entirely uneven width.