Abstract: In preferred embodiments, a compact a hybrid integrated circuit device 1 can be provided. A conductive pattern 12 is formed on the top surface of a circuit substrate 10, on the top surface of which an insulating layer 11 has been provided. Conductive pattern 12 is formed over the entirety of the top surface of the circuit substrate. Specifically, conductive pattern 12 is also formed at parts within 2 mm from the peripheral ends of circuit substrate 10. Also, a heat sink 13A or other circuit element 13 with some height can be positioned near a peripheral end part of circuit substrate 10. By arranging hybrid integrated circuit device 1, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.

Abstract: To decrease a load on a network when a large quantity of data is distributed to a plurality of points at the same time. This invention provides a packet distributing method of distributing a data packet in a network system provided with a plurality of information forwarders (1), the information forwarder (1) including a forwarding table to specify a route of the network system by using an identifier identified in an application layer, including: setting the route on the basis of a forwarding information identified in the application layer, for the information forwarder (1) on a destination from the information forwarder (1) on an upper stream; receiving the data packet; determining a destination of the data packet according to an information included in the received data packet and the forwarding table; and transmitting the received data packet, on the basis of the determined destination.

Abstract: An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

Abstract: A content relay node comprising a data processing unit for storing or transmitting a data packet on the basis of the data attribute, a storage connected to the data processing unit, transmitting units each for processing the header of a data packet in accordance with a control signal from the data processing unit and transferring the data packet to a neighboring relay node, and a routing control unit for selecting the transmitting unit or the data processing unit as a destination of a data packet on the basis of routing information including a storage address, wherein the storage unit stores a copy of a data packet at least until transfer of the data packet to the next node is completed.

Abstract: A switching node (MGS) 1 connected to a relay network 5 has a table 37 prestoring bandwidth control parameter values in correspondence with the size of data transferred via the relay network. When a request for accessing a remote storage apparatus is received, the switching node obtains the bandwidth control parameter values adapted to the transfer data size indicated by the access request are obtained from the table 37, and automatically sets a path having an optimum bandwidth on the relay network by using the parameter values. The path is automatically released when the data transfer is finished.

Abstract: In preferred embodiments, a compact a hybrid integrated circuit device 1 can be provided. A conductive pattern 12 is formed on the top surface of a circuit substrate 10, on the top surface of which an insulating layer 11 has been provided. Conductive pattern 12 is formed over the entirety of the top surface of the circuit substrate. Specifically, conductive pattern 12 is also formed at parts within 2 mm from the peripheral ends of circuit substrate 10. Also, a heat sink 13 A or other circuit element 13 with some height can be positioned near a peripheral end part of circuit substrate 10. By arranging hybrid integrated circuit device 1, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.

Abstract: A request routing system for offering high-quality, low-priced data delivery services to a large number of users is disclosed. Request router RR1 for redirecting data requests to delivery servers manages the data storage in each delivery server, the MPU load on each delivery server, the delay time involved between delivery servers and terminals, and the bandwidths of data delivery paths between delivery servers and terminals. If a bandwidth required for data delivery cannot be acquired, request router RR1 can perform a calculation to check whether an alternative path can be set between a delivery server and terminal. If the result of the calculation indicates that an alternative path can be set, request router RR1 can explicitly set such a path.

Abstract: In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A′ by dicing. In some embodiments, the method includes: preparing a metal substrate 10A′ having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10B′; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.

Abstract: A secure storage system for securely accessing a storage device on a network and improving volume management scalability, consisting of a client having a VPN capability; a storage device in an SAN; a management apparatus having a means for managing a storage capacity and a logical volume allocated to the storage device; a converter for converting a protocol used in the SAN to a protocol used in a LAN/MAN/WAN and vice versa; and a conversion apparatus having the VPN capability. A VPN is provided between the client and the conversion apparatus. The conversion apparatus is provided with a mapping between the VPN and an access range of the storage device. A VPN-ID is used for identifying the VPN. An address in the logical volume is used for the access range of the storage device.

Abstract: A sliding key slidable in an axial direction of a rotary shaft and engaging a sliding cylinder such that the sliding key follows a rotation of the sliding cylinder. The sliding key is a molded product of a metal-molded part and a resinous part. The sliding key does not malfunction or fail when it is used in an environment of a high temperature and a high load.