Patents by Inventor Masahiko Tsuyuki
Masahiko Tsuyuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240109302Abstract: There is provided a liquid discharge apparatus including: a print head; a substrate unit; and a control circuit that controls operations of the print head and the substrate unit, in which the print head includes a first discharge section that has a first piezoelectric element that is displaced by receiving a first driving signal and discharges a liquid by displacement of the first piezoelectric element, and a first connector, the substrate unit includes a second connector that is electrically coupled to the print head by being fitted to the first connector, a first drive circuit that outputs the first driving signal, a temperature sensor that acquires environmental temperature, and a wiring substrate provided with the first drive circuit and the temperature sensor, and the control circuit controls the first drive circuit and the print head based on the environmental temperature acquired by the temperature sensor.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Publication number: 20240109301Abstract: There is provided a liquid discharge apparatus including a substrate unit, and includes a wiring substrate having a plurality of rigid members and flexible member, in which a first rigid member, and a second rigid member are positioned facing each other, a third rigid member laminated on a first surface of a third region of the flexible member is positioned such that a normal direction of a third front surface intersects a normal direction of a first front surface and a second front surface, the second connector is provided on a fourth rigid member laminated on a second surface of a third region of the flexible member, and a size of the third rigid member and a fourth rigid member is smaller than a size of the print head when a first discharge section is viewed from the first connector.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU, Kazuya IMURA
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Publication number: 20240109310Abstract: There is provided a liquid discharge apparatus, in which a substrate unit having a first connector and a piezoelectric element, a reference voltage signal output circuit, an electrolytic capacitor, and a wiring substrate having a plurality of rigid members and a flexible member, the reference voltage signal output circuit has a first front surface and is provided on a first rigid member laminated on the first surface of the first region, the electrolytic capacitor has a second front surface and is provided on a second rigid member laminated on the first surface of the second region, the second connector is provided on a third rigid member laminated on the second surface of the second region, and the first rigid member and the second rigid member are positioned such that a normal direction of the first front surface and a normal direction of the second front surface intersect each other.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Publication number: 20240109298Abstract: There is provided a liquid discharge apparatus including: a first substrate and a second substrate are positioned such that the first substrate front surface and the second substrate front surface face each other along a fourth direction intersecting both a first direction and a second direction, the first drive circuit provided on the first substrate overlaps with at least a part of the second drive circuit provided on the first substrate, and a first integrated circuit included in the first drive circuit does not overlap with a second integrated circuit included in the second drive circuit, along the second direction, and the first drive circuit overlaps with at least a part of a third drive circuit provided on the second substrate, and the first integrated circuit included in the first drive circuit does not overlap with a third integrated circuit included in the third drive circuit, along the fourth direction.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Publication number: 20240109300Abstract: There is provided a liquid discharge apparatus including: a print head including a first connector; a substrate unit including a second connector fitted to the first connector and a third connector different from the second connector; and a relay substrate including a first cable through which a first voltage signal supplied to the substrate unit propagates, a second cable through which a second voltage signal supplied to the substrate unit propagates, a fourth connector fitted to the third connector, a relay substrate front surface, and a relay substrate back surface opposite to the relay substrate front surface, in which the first cable and the second cable are electrically coupled to the relay substrate front surface, the fourth connector is provided on the relay substrate back surface, and the first voltage signal and the second voltage signal propagate to the fourth connector.Type: ApplicationFiled: September 28, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU, Kazuya IMURA
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Publication number: 20240109312Abstract: There is provided a liquid discharge apparatus including a substrate unit, in which the substrate unit includes a wiring substrate which is a rigid flexible substrate having a plurality of rigid members and flexible member, the flexible member includes a first surface, a second surface, a first region, a second region, and a third region, a first rigid member among the plurality of rigid members is laminated on the first surface of the first region such that a first front surface, the second rigid member among the plurality of rigid members is laminated on the first surface of the second region such that a second front surface, the flexible member includes a power supply voltage wiring, and the power supply voltage wiring is continuously provided over the first region, the second region, and the third region of the flexible member.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Publication number: 20240109311Abstract: There is provided a liquid discharge apparatus, in which a substrate unit includes a first drive circuit that has a first coil, a second drive circuit that has a second coil, a cooling fan that generates an air flow, a wiring substrate having a plurality of rigid members and a flexible member, and a plate-shaped opening member having a first opening and a second opening, the cooling fan generates an air flow in a space where a first front surface of a first rigid member on which the first coil is provided and a second front surface of a second rigid member on which the second coil is provided, and when viewed along a normal direction of the opening member, the first opening overlaps with at least a part of the first coil, and the second opening overlaps with at least a part of the second coil.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Publication number: 20240109314Abstract: There is provided a liquid discharge apparatus, in which a substrate unit includes a first abnormality notification section that notifies an abnormality of the substrate unit, a wiring substrate having a plurality of rigid members and a flexible member, a first heat sink, and a second heat sink, the first heat sink is laminated on the second surface of the first region and positioned close to the second rigid member, the second heat sink is laminated on the second surface of the second region and positioned close to the fourth rigid member, and the first abnormality notification section is provided on a fourth rigid member.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Publication number: 20240109313Abstract: There is provided a liquid discharge apparatus including: a substrate unit; a compressor that sends out compressed air; and a tube, in which the substrate unit includes a first drive circuit, a second drive circuit, and a wiring substrate having a plurality of rigid members and a flexible member, a first rigid member provided with a first drive circuit, having a first front surface, and laminated on the first surface of the first region, and a second rigid member provided with a second drive circuit, having a second front surface, and laminated on the first surface of the second region are positioned facing each other, and the compressor supplies the compressed air to a region where the first front surface and the second front surface face each other.Type: ApplicationFiled: September 29, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Publication number: 20240109355Abstract: There is provide a liquid discharge apparatus including: a first substrate including a first substrate front surface and a first substrate back surface opposite to the first substrate front surface; a second substrate including a second substrate front surface and a second substrate back surface opposite to the second substrate front surface; a first circuit having a first electronic component provided on the first substrate front surface; a second circuit having a second electronic component provided on the second substrate front surface; a cooling fan that generates an air flow in a gas flow path configured by the first substrate front surface and the second substrate front surface; a first heat sink attached to the first substrate; and a second heat sink attached to the second substrate.Type: ApplicationFiled: September 28, 2023Publication date: April 4, 2024Inventors: Masahiko TSUYUKI, Makoto TAKAMUKU
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Patent number: 10589526Abstract: There is provided a head unit including: a first substrate including a first surface provided with a first terminal and a second surface provided with a second terminal; a second substrate including a third surface provided with a third terminal; a first flexible wiring substrate that connects the first terminal and the third terminal to each other; a first driving module that is electrically connected to the second substrate; a third substrate including a fourth surface provided with a fourth terminal; a second flexible wiring substrate that connects the second terminal and the fourth terminal to each other; a second driving module that is electrically connected to the third substrate; and a liquid flow passage through which the liquid is supplied to the first driving module and the second driving module, in which the liquid flow passage is positioned between the second substrate and the third substrate.Type: GrantFiled: October 30, 2018Date of Patent: March 17, 2020Assignee: Seiko Epson CorporationInventors: Koji Kitazawa, Masahiko Tsuyuki
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Patent number: 10538089Abstract: There is provided a head unit including: a first substrate provided with a first terminal and a second terminal; a second substrate provided with a third terminal; a first flexible wiring substrate that connects the first terminal and the third terminal to each other; a first driving module that is electrically connected to the second substrate; a third substrate provided with a fourth terminal; a second flexible wiring substrate that connects the second terminal and the fourth terminal to each other; a second driving module that is electrically connected to the third substrate; and a liquid flow passage which is positioned between the second substrate and the third substrate, and supplies the liquid to the first driving module and the second driving module, in which the first substrate is positioned on the second substrate side in a direction intersecting with a direction in which a liquid is discharged.Type: GrantFiled: October 30, 2018Date of Patent: January 21, 2020Assignee: Seiko Epson CorporationInventors: Koji Kitazawa, Masahiko Tsuyuki
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Publication number: 20190126618Abstract: There is provided a head unit including: a first substrate including a first surface provided with a first terminal and a second surface provided with a second terminal; a second substrate including a third surface provided with a third terminal; a first flexible wiring substrate that connects the first terminal and the third terminal to each other; a first driving module that is electrically connected to the second substrate; a third substrate including a fourth surface provided with a fourth terminal; a second flexible wiring substrate that connects the second terminal and the fourth terminal to each other; a second driving module that is electrically connected to the third substrate; and a liquid flow passage through which the liquid is supplied to the first driving module and the second driving module, in which the liquid flow passage is positioned between the second substrate and the third substrate.Type: ApplicationFiled: October 30, 2018Publication date: May 2, 2019Inventors: Koji KITAZAWA, Masahiko TSUYUKI
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Publication number: 20190126619Abstract: There is provided a head unit including: a first substrate provided with a first terminal and a second terminal; a second substrate provided with a third terminal; a first flexible wiring substrate that connects the first terminal and the third terminal to each other; a first driving module that is electrically connected to the second substrate; a third substrate provided with a fourth terminal; a second flexible wiring substrate that connects the second terminal and the fourth terminal to each other; a second driving module that is electrically connected to the third substrate; and a liquid flow passage which is positioned between the second substrate and the third substrate, and supplies the liquid to the first driving module and the second driving module, in which the first substrate is positioned on the second substrate side in a direction intersecting with a direction in which a liquid is discharged.Type: ApplicationFiled: October 30, 2018Publication date: May 2, 2019Inventors: Koji KITAZAWA, Masahiko TSUYUKI
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Patent number: 9180666Abstract: An image recording device includes a head unit having a print head and a first substrate, a second substrate provided separate to the head unit, a support member that supports the head unit and the second substrate while a first positional relationship in which the head unit and the second substrate are close to each other and a second positional relationship in which the head unit and the second substrate are away from each other are changed. Moreover, in the first positional relationship, the head unit and the second substrate are connected to each other to form an electric signal supply path from the second substrate to the head unit, and, conversely, in the second positional relationship, the connection between the head unit and the second substrate is released such that the head unit is dismountable from the support member.Type: GrantFiled: March 24, 2014Date of Patent: November 10, 2015Assignee: Seiko Epson CoporationInventors: Akihisa Wanibe, Teruo Nakayama, Koji Kitazawa, Masahiko Tsuyuki
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Publication number: 20140292858Abstract: An image recording device includes a head unit having a print head and a first substrate, a second substrate provided separate to the head unit, a support member that supports the head unit and the second substrate while a first positional relationship in which the head unit and the second substrate are close to each other and a second positional relationship in which the head unit and the second substrate are away from each other are changed. Moreover, in the first positional relationship, the head unit and the second substrate are connected to each other to form an electric signal supply path from the second substrate to the head unit, and, conversely, in the second positional relationship, the connection between the head unit and the second substrate is released such that the head unit is dismountable from the support member.Type: ApplicationFiled: March 24, 2014Publication date: October 2, 2014Applicant: SEIKO EPSON CORPORATIONInventors: Akihisa WANIBE, Teruo NAKAYAMA, Koji KITAZAWA, Masahiko TSUYUKI
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Publication number: 20120268512Abstract: An image formation apparatus includes a dot formation element; a voltage signal generation circuit configured to generate a voltage signal by using an amplification circuit including a transistor, the voltage signal including a plurality of driving voltage pulses each thereof driving the dot formation element, and at least one temperature measurement voltage portion each thereof being provided between two successive ones of the driving voltage pulses; a temperature measurement control unit configured to measure a temperature of the transistor on the basis of the voltage signal; and a switch circuit configured to output the voltage signal to the dot formation element during a period when the transistor amplifies a signal corresponding to each of the driving voltage pulses, and output the voltage signal to the temperature measurement control unit during a period when the transistor amplifies a signal corresponding to each of the at least one temperature measurement voltage portion.Type: ApplicationFiled: April 23, 2012Publication date: October 25, 2012Applicant: SEIKO EPSON CORPORATIONInventor: Masahiko Tsuyuki
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Patent number: 7592684Abstract: A semiconductor device is provided in which high breakdown voltage transistors and low voltage driving transistors are formed on the same substrate. The device includes a semiconductor layer, first element isolation regions for defining a high breakdown voltage transistor forming region in the semiconductor layer, second element isolation regions including trench dielectric layers for defining a low voltage driving transistor forming region in the semiconductor layer, high breakdown voltage transistors formed in the high breakdown voltage transistor forming region, low voltage driving transistors formed in the low voltage driving transistor forming region, and offset dielectric layers for alleviating the electric field of the high breakdown voltage transistors formed in the high breakdown voltage transistor forming region, wherein upper ends of the offset dielectric layers are beak shaped.Type: GrantFiled: July 31, 2006Date of Patent: September 22, 2009Assignee: Seiko Epson CorporationInventors: Takafumi Noda, Masahiro Hayashi, Akihiko Ebina, Masahiko Tsuyuki
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Publication number: 20070045737Abstract: A semiconductor device is provided in which high breakdown voltage transistors and low voltage driving transistors are formed on the same substrate. The device includes a semiconductor layer, first element isolation regions for defining a high breakdown voltage transistor forming region in the semiconductor layer, second element isolation regions including trench dielectric layers for defining a low voltage driving transistor forming region in the semiconductor layer, high breakdown voltage transistors formed in the high breakdown voltage transistor forming region, low voltage driving transistors formed in the low voltage driving transistor forming region, and offset dielectric layers for alleviating the electric field of the high breakdown voltage transistors formed in the high breakdown voltage transistor forming region, wherein upper ends of the offset dielectric layers are beak shaped.Type: ApplicationFiled: July 31, 2006Publication date: March 1, 2007Applicant: SEIKO EPSON CORPORATIONInventors: Takafumi NODA, Masahiro HAYASHI, Akihiko EBINA, Masahiko TSUYUKI
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Patent number: 7163855Abstract: A semiconductor device manufacturing method is provided including: forming a first impurity layer that becomes first wells in a high breakdown voltage transistor forming region in a semiconductor layer; forming a second impurity layer that becomes offset regions in the high breakdown voltage transistor forming region; forming the first wells and the offset regions by diffusing impurities of the first and second impurity layers by heat treating the semiconductor layer; forming element isolation regions by a trench element isolation method in the semiconductor layer, after forming the first wells and the offset regions; forming first gate dielectric layers in the high breakdown voltage transistor forming region; forming second wells in a low voltage driving transistor forming region in the semiconductor layer; forming second gate dielectric layers in the low voltage driving transistor forming region; and forming gate electrodes in the high breakdown voltage transistor forming region and the low voltage drivingType: GrantFiled: July 29, 2004Date of Patent: January 16, 2007Assignee: Seiko Epson CorporationInventors: Takafumi Noda, Masahiro Hayashi, Akihiko Ebina, Masahiko Tsuyuki