Patents by Inventor Masahiko Wada

Masahiko Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122565
    Abstract: A user is presented with determination information obtained by determining a condition of a target site and feature information indicating a feature related to a condition of a body of a subject, which are generated from the same image representing the target site of the subject. A determination system includes an acquirer that acquires a target image representing a target site of a body of a subject, a first generator that generates first determination information indicating a condition of the target site from the target image used to generate the first determination information, a second generator that generates feature information indicating a feature related to a condition of the body of the subject from the target image, and a display controller that causes a display apparatus to display the first determination information and the feature information.
    Type: Application
    Filed: January 25, 2022
    Publication date: April 18, 2024
    Inventors: Kenichi WATANABE, Masayuki KYOMOTO, Masahiko HASHIDA, Shintaro HONDA, Naoya WADA
  • Publication number: 20240119587
    Abstract: A prediction image is generated and output that represents a condition of a target region of a subject. A prediction system includes a prediction information acquirer that acquires (a) a subject image representing a target region of a subject at a first time, and (b) first prediction information regarding the target region at a second time when a predetermined period has elapsed from the first time; and a prediction image generation unit that generates a prediction image indicating a condition of the target region at the second time from the subject image based on the first prediction information and output the prediction image.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 11, 2024
    Inventors: Kenichi WATANABE, Masayuki KYOMOTO, Masahiko HASHIDA, Shintaro HONDA, Naoya WADA
  • Patent number: 11932841
    Abstract: The present invention provides a cell cultivation module comprising a polymer porous film and a casing that has two or more culture medium inflow/outflow ports and accommodates the polymer porous film, wherein the polymer porous film is a polymer porous film with a three-layer structure, having a surface layer A and a surface layer B that have a plurality of holes, and a macrovoid layer that is sandwiched between the surface layer A and the surface layer B, the average hole diameter of the holes present in the surface layer A is smaller than the average hole diameter of the holes present in the surface layer B, the macrovoid layer has dividing walls that are connected to the surface layers A and B, and a plurality of macrovoids that are surrounded by the dividing walls and the surface layers A and B, the holes in the surface layers A and B are in communication with the macrovoids, and the polymer porous film is accommodated within the casing.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: March 19, 2024
    Assignee: UBE CORPORATION
    Inventors: Masahiko Hagihara, Shinsaku Fuse, Motohisa Shimizu, Yukinori Wada
  • Patent number: 9028658
    Abstract: A Mn-containing copper alloy sputtering target is provided. The target generates a small number of particles and is used to form diffusion inhibiting films and seed films of interconnects of semiconductor devices simultaneously. The target is a Mn-containing copper alloy sputtering target that generates few particles, comprising a copper alloy containing 0.6 to 30 mass % of Mn with the balance consisting of copper and impurities, wherein the impurities are controlled to include a total of 40 ppm or less of metallic impurities, 10 ppm or less of oxygen, 5 ppm or less of nitrogen, 5 ppm or less of hydrogen, and 10 ppm or less of carbon.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: May 12, 2015
    Assignee: Mitsubishi Materials Corporation
    Inventors: Shoji Aoki, Masahiko Wada, Masato Koide
  • Patent number: 7524356
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: April 28, 2009
    Assignee: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Publication number: 20090101495
    Abstract: A Mn-containing copper alloy sputtering target is provided. The target generates a small number of particles and is used to form diffusion inhibiting films and seed films of interconnects of semiconductor devices simultaneously. The target is a Mn-containing copper alloy sputtering target that generates few particles, comprising a copper alloy containing 0.6 to 30 mass % of Mn with the balance consisting of copper and impurities, wherein the impurities are controlled to include a total of 40 ppm or less of metallic impurities, 10 ppm or less of oxygen, 5 ppm or less of nitrogen, 5 ppm or less of hydrogen, and 10 ppm or less of carbon.
    Type: Application
    Filed: August 17, 2006
    Publication date: April 23, 2009
    Applicant: Mitsubishi Materials Corporation
    Inventors: Shoji Aoki, Masahiko Wada, Masato Koide
  • Publication number: 20050262968
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Application
    Filed: August 2, 2005
    Publication date: December 1, 2005
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Patent number: 6944930
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: September 20, 2005
    Assignee: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Patent number: 6613450
    Abstract: There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: September 2, 2003
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Nobuyoshi Tsukaguchi, Jyunji Nakamura, Masahiko Wada, Makoto Namioka, Masami Kimura
  • Patent number: 6589473
    Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a holding furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the holding furnace in a non-oxidizing atmosphere and for transferring the molten copper to a tundish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the tundish, and a cutter for cutting the cast copper into a predetermined length. The apparatus permits a dehydrogenating treatment to be performed without requiring a long moving distance of molten copper, and in which the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire having superior surface quality can be obtained.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: July 8, 2003
    Assignee: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Publication number: 20030068532
    Abstract: There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.
    Type: Application
    Filed: March 27, 2002
    Publication date: April 10, 2003
    Inventors: Nobuyoshi Tsukaguchi, Jyunji Nakamura, Masahiko Wada, Makoto Namioka, Masami Kimura
  • Patent number: 6523742
    Abstract: A cash processing system is capable of reducing manual operation in placing and collecting from a cashing handling apparatus, such as ATM's, cash dispensing machines and so forth and thus can eliminate the occurrence of error or theft. The cash processing system includes a detachable cash safe, a cash processing apparatus that detachably receives the cash safe for automatically setting a commanded amount of cash therein, and a cash handling apparatus that detachably receives the cash safe, in which the commanded amount of cash is set, for performing services including a cash dispensing service.
    Type: Grant
    Filed: December 27, 1991
    Date of Patent: February 25, 2003
    Assignee: Fujitsu Limited
    Inventors: Kiyotaka Awatsu, Masahiko Wada, Akemi Oda, Yasuko Shibata
  • Publication number: 20010029659
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Application
    Filed: February 26, 2001
    Publication date: October 18, 2001
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Publication number: 20010028135
    Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a soaking furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the soaking furnace in a non-oxidizing atmosphere and for transferring the molten copper to a turn-dish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the turn-dish, and a cutter for cuffing the cast copper into a predetermined length.
    Type: Application
    Filed: February 22, 2001
    Publication date: October 11, 2001
    Applicant: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Patent number: 5900607
    Abstract: A cash processing system is capable of reducing manual operation in placing and collecting from a cashing handling apparatus, such as ATM's, cash dispensing machines and so forth and thus can eliminate the occurrence of error or theft. The cash processing system includes a detachable cash safe, a cash processing apparatus that detachably receives the cash safe for automatically setting a commanded amount of cash therein, and a cash handling apparatus that detachably receives the cash safe, in which the commanded amount of cash is set, for performing services including a cash dispensing service.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: May 4, 1999
    Assignee: Fujitsu Limited
    Inventors: Kiyotaka Awatsu, Masahiko Wada, Akemi Oda, Yasuko Shibata
  • Patent number: 5864826
    Abstract: A cash processing system includes a detachable cash safe, a cash processing apparatus that detachably receives the cash safe for automatically setting a commanded amount of cash therein, and a cash handling apparatus that detachably receives the cash safe, in which the commanded amount of cash is set, for performing services including a cash dispensing service. The detachable cash safe has a cash left containing unit for containing left cash and a cash handling unit for performing a dispensing operation. Left cash information associated with the left cash is stored in a left cash storage file in a memory when cash is left in the cash handling apparatus. The left cash information is displayed upon returning the left cash, and a search of the left cash storage file in the memory is performed for part of the left cash information entered through an input section for accessing corresponding left cash information.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: January 26, 1999
    Assignee: Fujitsu Limited
    Inventors: Kiyotaka Awatsu, Masahiko Wada, Akemi Oda, Yasuko Shibata
  • Patent number: 5777304
    Abstract: A cash processing system is capable of reducing manual operation in placing and collecting from a cashing handling apparatus, such as ATM's, cash dispensing machines and so forth and thus can eliminate the occurrence of error or theft. The cash processing system includes a detachable cash safe, a cash processing apparatus that detachably receives the cash safe for automatically setting a commanded amount of cash therein, and a cash handling apparatus that detachably receives the cash safe, in which the commanded amount of cash is set, for performing services including a cash dispensing service.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: July 7, 1998
    Assignee: Fujitsu Limited
    Inventors: Kiyotaka Awatsu, Masahiko Wada, Akemi Oda, Yasuko Shibata
  • Patent number: 5606157
    Abstract: A cash processing system is capable of reducing manual operation in placing and collecting from a cashing handling apparatus, such as ATM's, cash dispensing machines and so forth and thus can eliminate the occurrence of error or theft. The cash processing system includes a detachable cash safe, a cash processing apparatus that detachably receives the cash safe for automatically setting a commanded amount of cash therein, and a cash handling apparatus that detachably receives the cash safe, in which the commanded amount of cash is set, for performing services including a cash dispensing service.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: February 25, 1997
    Assignee: Fujitsu Limited
    Inventors: Kiyotaka Awatsu, Masahiko Wada, Akemi Oda, Yasuko Shibata
  • Patent number: 5416919
    Abstract: A semiconductor integrated circuit which includes a central processing unit, one or more peripheral circuits, one or more external terminals for transferring signals to or from the integrated circuit, and circuits for selecting the central processing unit or one of the peripheral circuits and solely operating the selected one in a test mode. The circuit for selecting includes a test mode control circuit and a signal control circuit. The test mode control circuit generates and supplies control signals in response to test operating signals having particular timings different from those of an actual operating signal inputted through the external terminal in a normal mode. The signal control circuit serves to separate the selected one from the others in a manner to allow the separated one to solely operate in the test mode.
    Type: Grant
    Filed: December 21, 1992
    Date of Patent: May 16, 1995
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Eiji Ogino, Shigeki Imai, Takeshi Yoshii, Masahiko Wada
  • Patent number: 5394538
    Abstract: A memory selection circuit of a computer provided with a central processing unit and a plurality of memory areas of an equal capacity, including the first circuit for storing data corresponding to the capacity of the plurality of memory areas outputted from the central processing unit, the second circuit for storing an address outputted from the central processing unit, the third circuit for generating a signal that indicates a difference between the address stored in the second circuit and a predetermined address assigned to a beginning of the plurality of memory areas; and the fourth circuit for generating a selection signal for selecting one of the plurality of memory areas on the basis of the data stored in the first circuit and the signal generated by the third circuit.
    Type: Grant
    Filed: March 23, 1994
    Date of Patent: February 28, 1995
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masahiko Wada, Shigeki Imai