Patents by Inventor Masahiro Hamada
Masahiro Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240312712Abstract: An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.Type: ApplicationFiled: May 28, 2024Publication date: September 19, 2024Inventors: Daiki FUKUNAGA, Hideaki TANAKA, Masahiro WAKASHIMA, Daisuke HAMADA, Hironori TSUTSUMI, Satoshi MAENO, Ryota ASO, Koji MORIYAMA, Akihiro TSURU
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Patent number: 12036714Abstract: A molding material including a melt-fabricable fluororesin and having a metal content of 100 ng/1 g or less as measured by an ashing method. Also disclosed is a tube made of the molding material.Type: GrantFiled: February 22, 2019Date of Patent: July 16, 2024Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Hitoshi Imamura, Hiroyuki Hamada, Eri Mukai, Masahiro Kondo
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Publication number: 20230382082Abstract: Provided is a multilayer foam sheet excellent in flexibility and mechanical strength in the shear direction. A multilayer foam sheet of the present invention is a multilayer foam sheet including: a base layer including a foam layer, and a surface layer including a foam layer or a resin film and laminated on at least one side of the base layer directly or with another layer interposed therebetween, a low-speed shear modulus being 50 MPa or more, and a 25% compressive strength being 125 kPa or less.Type: ApplicationFiled: October 6, 2021Publication date: November 30, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Kento SATO, Hiroki MATSUKAWA, Masahiro HAMADA
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Publication number: 20230374240Abstract: A foam sheet having at least one glass transition temperature (Tg) of 0 to 40° C., a peak value of the loss tangent (tan?) in the glass transition temperature (Tg) of 0.30 or more, and a 25% compressive strength of 1000 kPa or less, and further having a glass transition temperature (Tg) of ?40° C. or less. A foam sheet having cushioning properties and vibration resistance in which no cracking occurs even when used in cold areas can be provided.Type: ApplicationFiled: September 29, 2021Publication date: November 23, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventor: Masahiro HAMADA
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Publication number: 20230321959Abstract: A multilayer foam sheet having a resin layer and a foam layer on each of both sides of the resin layer, wherein the thickness of the resin layer is 10 µm or more, and the 25% compressive strength is 1000 kPa or less. A foam sheet having high impact resistance and flexibility can be provided.Type: ApplicationFiled: August 10, 2021Publication date: October 12, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Masahiro HAMADA, Masaya ISHIDA, Hiroki MATSUKAWA
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Patent number: 11456229Abstract: A thermally conductive sheet according to the present invention is a thermally conductive sheet comprising a thermally conductive filler, the thermally conductive sheet having a thermal conductivity of 7 W/m·K or more, a 30% compression strength of 1500 kPa or less, and a tensile strength of 0.08 MPa or more. According to the present invention, a thermally conductive sheet having excellent thermally conductive properties, flexibility, and handling properties can be provided.Type: GrantFiled: July 24, 2018Date of Patent: September 27, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventor: Masahiro Hamada
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Patent number: 11136484Abstract: A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.Type: GrantFiled: November 30, 2017Date of Patent: October 5, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Masahiro Hamada, Daisuke Mukohata, Koji Shimonishi, Yuuki Hoshiyama
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Patent number: 10825995Abstract: The present invention provides a material for photoelectric conversion elements for use in imaging elements which comprises a compound represented by the following formula (1). The material for photoelectric conversion elements for use in imaging elements, which comprises a compound represented by the following formula (1), is used to produce a photoelectric conversion element which is excellent in terms of hole- or electron-leakage prevention, thermal resistance to processing temperatures, transparency to visible light, etc. In formula (1), R1 and R2 each independently represent a substituted or unsubstituted aromatic group.Type: GrantFiled: August 1, 2018Date of Patent: November 3, 2020Assignee: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Hidenori Yakushiji, Kazuki Niimi, Ryoutarou Morita, Tatsuya Yamamoto, Toshifumi Inouchi, Masahiro Hamada
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Publication number: 20200227337Abstract: A thermally conductive sheet according to the present invention is a thermally conductive sheet comprising a thermally conductive filler, the thermally conductive sheet having a thermal conductivity of 7 W/m·K or more, a 30% compression strength of 1500 kPa or less, and a tensile strength of 0.08 MPa or more. According to the present invention, a thermally conductive sheet having excellent thermally conductive properties, flexibility, and handling properties can be provided.Type: ApplicationFiled: July 24, 2018Publication date: July 16, 2020Applicant: SEKISUI CHEMICAL CO., LTD.Inventor: Masahiro HAMADA
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Publication number: 20190241786Abstract: A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.Type: ApplicationFiled: November 30, 2017Publication date: August 8, 2019Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Masahiro HAMADA, Daisuke MUKOHATA, Koji SHIMONISHI, Yuuki HOSHIYAMA
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Publication number: 20190176448Abstract: The heat conductive sheet of the present invention has a laminated structure of resin layers including a heat-conductive resin layer comprising a platy heat-conductive filler, a sheet major surface being a plane perpendicular to laminated faces of the resin layers, and the major axis of the platy heat-conductive filler being oriented at an angle of 60° or more with respect to the sheet major surface. According to the present invention, a heat conductive sheet that achieves improvement of the heat conductivity thereof can be provided while the amount of the platy heat-conductive filler used is reduced, and the method for producing the same can also be provided.Type: ApplicationFiled: August 8, 2017Publication date: June 13, 2019Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Daisuke MUKOHATA, Koji SHIMONISHI, Masahiro HAMADA, Keisuke FUKANO
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Patent number: 10232864Abstract: There is provided a three-axle truck for a railcar having three wheelsets in a truck frame of the one truck, in which in each of the wheelsets, axle boxes are supported by the truck frame through axle springs, the truck frame has a structure for supporting a carbody whose weight is variable, and making variations in axle loads on the respective wheelsets be maintained at a preset value or less in spite of change of the carbody weight, and in this structure, spring constants of the both-end axle springs in the respective wheelsets located at both ends of three axles are set to be larger than a spring constant of the middle axle spring of the wheelset located in the middle.Type: GrantFiled: October 25, 2013Date of Patent: March 19, 2019Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Yoshi Sato, Masahiro Hamada, Junichi Sakamoto, Koichi Murata
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Publication number: 20180375033Abstract: The present invention provides a material for photoelectric conversion elements for use in imaging elements which comprises a compound represented by the following formula (1). The material for photoelectric conversion elements for use in imaging elements, which comprises a compound represented by the following formula (1), is used to produce a photoelectric conversion element which is excellent in terms of hole- or electron-leakage prevention, thermal resistance to processing temperatures, transparency to visible light, etc. In formula (1), R1 and R2 each independently represent a substituted or unsubstituted aromatic group.Type: ApplicationFiled: August 1, 2018Publication date: December 27, 2018Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Hidenori YAKUSHIJI, Kazuki NIIMI, Ryoutarou MORITA, Tatsuya YAMAMOTO, Toshifumi INOUCHI, Masahiro HAMADA
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Publication number: 20180112115Abstract: An acrylic resin heat-dissipating foam sheet according to the present invention is a sheet-shaped foam sheet containing an acrylic resin (A), and thermally conductive particles (B) and cells dispersed in the acrylic resin (A), wherein a content of the thermally conductive particles (B) is 100 to 400 parts by mass based on 100 parts by mass of the acrylic resin (A), and the foam sheet further has a 25% compressive strength of 200 kPa or less and a thickness of 0.8 mm or less. The foam sheet of the present invention has the thinness and flexibility sufficient to be suitably used inside electronic equipment and also has excellent thermal conductivity and further excellent insulating properties.Type: ApplicationFiled: March 15, 2016Publication date: April 26, 2018Applicant: SEKISUI CHEMICAL CO., LTD.Inventor: Masahiro HAMADA
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Publication number: 20180062087Abstract: An object is to provide: an organic compound which has excellent solubility in an organic solvent at room temperature, excellent storage stability in a solution state, and excellent heat resistance; an organic semiconductor material containing the organic compound; an organic thin film obtained by a printing process at room temperature using the organic semiconductor material; and an organic semiconductor device containing the organic thin film and having high mobility and high heat resistance. The organic compound is represented by Formula (A) below, and the organic semiconductor material contains this organic compound, wherein one of R1 and R2 represents an alkyl group, an aromatic hydrocarbon group having an alkyl group, or a heterocyclic group having an alkyl group, and another of R1 and R2 represents an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a heterocyclic group, with a proviso that R1 and R2 are not alkyl groups simultaneously.Type: ApplicationFiled: March 23, 2016Publication date: March 1, 2018Inventors: Masahiro Hamada, Shoji Shinamura, Yuichi Sadamitsu
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Patent number: 9859508Abstract: [Problem] To provide: a novel compound which has high mobility and on/off ratio and is useful for organic electronic devices; and a method for producing the compound. [Solution] A condensed polycyclic aromatic compound which is represented by general formula (1). (In the formula, A represents a 1,5-dihydronaphthalene ring or a 2,6-dihydronaphthalene ring; each of R1, R2, R3 and R4 independently represents a hydrogen atom, a halogen atom, a substituted or unsubstituted aliphatic hydrocarbon group, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, a substituted or unsubstituted hydrocarbon oxy group, a substituted or unsubstituted ester group, a substituted or unsubstituted acyl group, or a substituted or unsubstituted cyano group; and each of X1 and X2 independently represents an oxygen atom, a sulfur atom or a selenium atom.Type: GrantFiled: February 27, 2014Date of Patent: January 2, 2018Assignee: Nippon Kayaku Kabushiki KaishaInventors: Kazuo Takimiya, Shoji Shinamura, Masahiro Hamada, Yuichi Sadamitsu
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Patent number: 9583925Abstract: A gasket for an electrical junction box of a railcar is fitted in a groove portion formed on a contact surface of a side wall portion or a contact surface of a cover in the electrical junction box including: a box main body having the side wall portion defining an opening communicating with an outer space; and the cover closing the opening. Further, the gasket for the electrical junction box of the railcar includes: small width portions, a width of each of the small width portions being smaller than a width of the groove portion; and large width portions each having projections projecting toward both respective sides of the small width portion in a width direction and having a larger width than the width of the small width portions. The small width portions and the large width portions are alternately provided.Type: GrantFiled: December 7, 2015Date of Patent: February 28, 2017Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Masahiro Hamada, Hideki Fukumoto, Teruaki Mizukawa, Masahiro Sakahira, Tomohiro Narita
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Publication number: 20170040550Abstract: The present invention provides a material for photoelectric conversion elements for use in imaging elements which comprises a compound represented by the following formula (1). The material for photoelectric conversion elements for use in imaging elements, which comprises a compound represented by the following formula (1), is used to produce a photoelectric conversion element which is excellent in terms of hole- or electron-leakage prevention, thermal resistance to processing temperatures, transparency to visible light, etc. (In formula (1), R1 and R2 each independently represent a substituted or unsubstituted aromatic group.Type: ApplicationFiled: April 22, 2015Publication date: February 9, 2017Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Hidenori YAKUSHIJI, Kazuki NIIMI, Ryoutarou MORITA, Tatsuya YAMAMOTO, Toshifumi INOUCHI, Masahiro HAMADA
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Patent number: 9564604Abstract: The present invention provides a fused aromatic compound represented by general formula (1) or general formula (2): wherein R1 to R8 each independently represent an atom or a functional group selected from the group consisting of a hydrogen atom, a halogen atom, a hydrocarbon oxy group, an aromatic hydrocarbon group, an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an ester group, an acyl group, a cyano group, and a substituted silyl group, X1 to X4 each independently represent a cyano group, an ester group, or an acyl group, and Y1 to Y4 each independently represent an oxygen atom, a sulfur atom, or a selenium atom.Type: GrantFiled: October 17, 2013Date of Patent: February 7, 2017Assignee: Nippon Kayaku Kabushiki KaishaInventors: Kazuo Takimiya, Shoji Shinamura, Masahiro Hamada, Yuichi Sadamitsu
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Patent number: 9416242Abstract: The foamable composition according to the present invention comprises a copolymer of ethylene, an ?-olefin and a non-conjugated diene, a blowing agent, a crosslinking agent, a catalyst and a reaction suppressor, wherein in the foamable composition, the storage elastic modulus at 23° C. as measured by a viscoelasticity measuring apparatus is 2×104 Pa or lower, and the storage elastic modulus after the foamable composition is held at 115° C. for 200 seconds is 5×104 Pa or higher; thereby, a foam body having a low expansion ratio, a low compression strength and a high cushioning property can be produced.Type: GrantFiled: September 27, 2013Date of Patent: August 16, 2016Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Kazuyuki Yahara, Yozo Toei, Yuji Tanikawa, Masahiro Hamada, Akihito Dohi