Patents by Inventor Masahiro Hamada

Masahiro Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240312712
    Abstract: An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.
    Type: Application
    Filed: May 28, 2024
    Publication date: September 19, 2024
    Inventors: Daiki FUKUNAGA, Hideaki TANAKA, Masahiro WAKASHIMA, Daisuke HAMADA, Hironori TSUTSUMI, Satoshi MAENO, Ryota ASO, Koji MORIYAMA, Akihiro TSURU
  • Patent number: 12036714
    Abstract: A molding material including a melt-fabricable fluororesin and having a metal content of 100 ng/1 g or less as measured by an ashing method. Also disclosed is a tube made of the molding material.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: July 16, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hitoshi Imamura, Hiroyuki Hamada, Eri Mukai, Masahiro Kondo
  • Publication number: 20230382082
    Abstract: Provided is a multilayer foam sheet excellent in flexibility and mechanical strength in the shear direction. A multilayer foam sheet of the present invention is a multilayer foam sheet including: a base layer including a foam layer, and a surface layer including a foam layer or a resin film and laminated on at least one side of the base layer directly or with another layer interposed therebetween, a low-speed shear modulus being 50 MPa or more, and a 25% compressive strength being 125 kPa or less.
    Type: Application
    Filed: October 6, 2021
    Publication date: November 30, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kento SATO, Hiroki MATSUKAWA, Masahiro HAMADA
  • Publication number: 20230374240
    Abstract: A foam sheet having at least one glass transition temperature (Tg) of 0 to 40° C., a peak value of the loss tangent (tan?) in the glass transition temperature (Tg) of 0.30 or more, and a 25% compressive strength of 1000 kPa or less, and further having a glass transition temperature (Tg) of ?40° C. or less. A foam sheet having cushioning properties and vibration resistance in which no cracking occurs even when used in cold areas can be provided.
    Type: Application
    Filed: September 29, 2021
    Publication date: November 23, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventor: Masahiro HAMADA
  • Publication number: 20230321959
    Abstract: A multilayer foam sheet having a resin layer and a foam layer on each of both sides of the resin layer, wherein the thickness of the resin layer is 10 µm or more, and the 25% compressive strength is 1000 kPa or less. A foam sheet having high impact resistance and flexibility can be provided.
    Type: Application
    Filed: August 10, 2021
    Publication date: October 12, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masahiro HAMADA, Masaya ISHIDA, Hiroki MATSUKAWA
  • Patent number: 11456229
    Abstract: A thermally conductive sheet according to the present invention is a thermally conductive sheet comprising a thermally conductive filler, the thermally conductive sheet having a thermal conductivity of 7 W/m·K or more, a 30% compression strength of 1500 kPa or less, and a tensile strength of 0.08 MPa or more. According to the present invention, a thermally conductive sheet having excellent thermally conductive properties, flexibility, and handling properties can be provided.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: September 27, 2022
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventor: Masahiro Hamada
  • Patent number: 11136484
    Abstract: A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: October 5, 2021
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masahiro Hamada, Daisuke Mukohata, Koji Shimonishi, Yuuki Hoshiyama
  • Patent number: 10825995
    Abstract: The present invention provides a material for photoelectric conversion elements for use in imaging elements which comprises a compound represented by the following formula (1). The material for photoelectric conversion elements for use in imaging elements, which comprises a compound represented by the following formula (1), is used to produce a photoelectric conversion element which is excellent in terms of hole- or electron-leakage prevention, thermal resistance to processing temperatures, transparency to visible light, etc. In formula (1), R1 and R2 each independently represent a substituted or unsubstituted aromatic group.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: November 3, 2020
    Assignee: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Hidenori Yakushiji, Kazuki Niimi, Ryoutarou Morita, Tatsuya Yamamoto, Toshifumi Inouchi, Masahiro Hamada
  • Publication number: 20200227337
    Abstract: A thermally conductive sheet according to the present invention is a thermally conductive sheet comprising a thermally conductive filler, the thermally conductive sheet having a thermal conductivity of 7 W/m·K or more, a 30% compression strength of 1500 kPa or less, and a tensile strength of 0.08 MPa or more. According to the present invention, a thermally conductive sheet having excellent thermally conductive properties, flexibility, and handling properties can be provided.
    Type: Application
    Filed: July 24, 2018
    Publication date: July 16, 2020
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventor: Masahiro HAMADA
  • Publication number: 20190241786
    Abstract: A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.
    Type: Application
    Filed: November 30, 2017
    Publication date: August 8, 2019
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masahiro HAMADA, Daisuke MUKOHATA, Koji SHIMONISHI, Yuuki HOSHIYAMA
  • Publication number: 20190176448
    Abstract: The heat conductive sheet of the present invention has a laminated structure of resin layers including a heat-conductive resin layer comprising a platy heat-conductive filler, a sheet major surface being a plane perpendicular to laminated faces of the resin layers, and the major axis of the platy heat-conductive filler being oriented at an angle of 60° or more with respect to the sheet major surface. According to the present invention, a heat conductive sheet that achieves improvement of the heat conductivity thereof can be provided while the amount of the platy heat-conductive filler used is reduced, and the method for producing the same can also be provided.
    Type: Application
    Filed: August 8, 2017
    Publication date: June 13, 2019
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Daisuke MUKOHATA, Koji SHIMONISHI, Masahiro HAMADA, Keisuke FUKANO
  • Patent number: 10232864
    Abstract: There is provided a three-axle truck for a railcar having three wheelsets in a truck frame of the one truck, in which in each of the wheelsets, axle boxes are supported by the truck frame through axle springs, the truck frame has a structure for supporting a carbody whose weight is variable, and making variations in axle loads on the respective wheelsets be maintained at a preset value or less in spite of change of the carbody weight, and in this structure, spring constants of the both-end axle springs in the respective wheelsets located at both ends of three axles are set to be larger than a spring constant of the middle axle spring of the wheelset located in the middle.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: March 19, 2019
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Yoshi Sato, Masahiro Hamada, Junichi Sakamoto, Koichi Murata
  • Publication number: 20180375033
    Abstract: The present invention provides a material for photoelectric conversion elements for use in imaging elements which comprises a compound represented by the following formula (1). The material for photoelectric conversion elements for use in imaging elements, which comprises a compound represented by the following formula (1), is used to produce a photoelectric conversion element which is excellent in terms of hole- or electron-leakage prevention, thermal resistance to processing temperatures, transparency to visible light, etc. In formula (1), R1 and R2 each independently represent a substituted or unsubstituted aromatic group.
    Type: Application
    Filed: August 1, 2018
    Publication date: December 27, 2018
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Hidenori YAKUSHIJI, Kazuki NIIMI, Ryoutarou MORITA, Tatsuya YAMAMOTO, Toshifumi INOUCHI, Masahiro HAMADA
  • Publication number: 20180112115
    Abstract: An acrylic resin heat-dissipating foam sheet according to the present invention is a sheet-shaped foam sheet containing an acrylic resin (A), and thermally conductive particles (B) and cells dispersed in the acrylic resin (A), wherein a content of the thermally conductive particles (B) is 100 to 400 parts by mass based on 100 parts by mass of the acrylic resin (A), and the foam sheet further has a 25% compressive strength of 200 kPa or less and a thickness of 0.8 mm or less. The foam sheet of the present invention has the thinness and flexibility sufficient to be suitably used inside electronic equipment and also has excellent thermal conductivity and further excellent insulating properties.
    Type: Application
    Filed: March 15, 2016
    Publication date: April 26, 2018
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventor: Masahiro HAMADA
  • Publication number: 20180062087
    Abstract: An object is to provide: an organic compound which has excellent solubility in an organic solvent at room temperature, excellent storage stability in a solution state, and excellent heat resistance; an organic semiconductor material containing the organic compound; an organic thin film obtained by a printing process at room temperature using the organic semiconductor material; and an organic semiconductor device containing the organic thin film and having high mobility and high heat resistance. The organic compound is represented by Formula (A) below, and the organic semiconductor material contains this organic compound, wherein one of R1 and R2 represents an alkyl group, an aromatic hydrocarbon group having an alkyl group, or a heterocyclic group having an alkyl group, and another of R1 and R2 represents an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a heterocyclic group, with a proviso that R1 and R2 are not alkyl groups simultaneously.
    Type: Application
    Filed: March 23, 2016
    Publication date: March 1, 2018
    Inventors: Masahiro Hamada, Shoji Shinamura, Yuichi Sadamitsu
  • Patent number: 9859508
    Abstract: [Problem] To provide: a novel compound which has high mobility and on/off ratio and is useful for organic electronic devices; and a method for producing the compound. [Solution] A condensed polycyclic aromatic compound which is represented by general formula (1). (In the formula, A represents a 1,5-dihydronaphthalene ring or a 2,6-dihydronaphthalene ring; each of R1, R2, R3 and R4 independently represents a hydrogen atom, a halogen atom, a substituted or unsubstituted aliphatic hydrocarbon group, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, a substituted or unsubstituted hydrocarbon oxy group, a substituted or unsubstituted ester group, a substituted or unsubstituted acyl group, or a substituted or unsubstituted cyano group; and each of X1 and X2 independently represents an oxygen atom, a sulfur atom or a selenium atom.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: January 2, 2018
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Kazuo Takimiya, Shoji Shinamura, Masahiro Hamada, Yuichi Sadamitsu
  • Patent number: 9583925
    Abstract: A gasket for an electrical junction box of a railcar is fitted in a groove portion formed on a contact surface of a side wall portion or a contact surface of a cover in the electrical junction box including: a box main body having the side wall portion defining an opening communicating with an outer space; and the cover closing the opening. Further, the gasket for the electrical junction box of the railcar includes: small width portions, a width of each of the small width portions being smaller than a width of the groove portion; and large width portions each having projections projecting toward both respective sides of the small width portion in a width direction and having a larger width than the width of the small width portions. The small width portions and the large width portions are alternately provided.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: February 28, 2017
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masahiro Hamada, Hideki Fukumoto, Teruaki Mizukawa, Masahiro Sakahira, Tomohiro Narita
  • Publication number: 20170040550
    Abstract: The present invention provides a material for photoelectric conversion elements for use in imaging elements which comprises a compound represented by the following formula (1). The material for photoelectric conversion elements for use in imaging elements, which comprises a compound represented by the following formula (1), is used to produce a photoelectric conversion element which is excellent in terms of hole- or electron-leakage prevention, thermal resistance to processing temperatures, transparency to visible light, etc. (In formula (1), R1 and R2 each independently represent a substituted or unsubstituted aromatic group.
    Type: Application
    Filed: April 22, 2015
    Publication date: February 9, 2017
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Hidenori YAKUSHIJI, Kazuki NIIMI, Ryoutarou MORITA, Tatsuya YAMAMOTO, Toshifumi INOUCHI, Masahiro HAMADA
  • Patent number: 9564604
    Abstract: The present invention provides a fused aromatic compound represented by general formula (1) or general formula (2): wherein R1 to R8 each independently represent an atom or a functional group selected from the group consisting of a hydrogen atom, a halogen atom, a hydrocarbon oxy group, an aromatic hydrocarbon group, an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an ester group, an acyl group, a cyano group, and a substituted silyl group, X1 to X4 each independently represent a cyano group, an ester group, or an acyl group, and Y1 to Y4 each independently represent an oxygen atom, a sulfur atom, or a selenium atom.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: February 7, 2017
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Kazuo Takimiya, Shoji Shinamura, Masahiro Hamada, Yuichi Sadamitsu
  • Patent number: 9416242
    Abstract: The foamable composition according to the present invention comprises a copolymer of ethylene, an ?-olefin and a non-conjugated diene, a blowing agent, a crosslinking agent, a catalyst and a reaction suppressor, wherein in the foamable composition, the storage elastic modulus at 23° C. as measured by a viscoelasticity measuring apparatus is 2×104 Pa or lower, and the storage elastic modulus after the foamable composition is held at 115° C. for 200 seconds is 5×104 Pa or higher; thereby, a foam body having a low expansion ratio, a low compression strength and a high cushioning property can be produced.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: August 16, 2016
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kazuyuki Yahara, Yozo Toei, Yuji Tanikawa, Masahiro Hamada, Akihito Dohi