Patents by Inventor Masahiro Koizumi
Masahiro Koizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120285015Abstract: This invention provides a retainer assembling apparatus which assembles a retainer to a valve stem via a cotter which engage with an engaging groove formed on the valve stem. The cotter comprises a pair of cotter segments. The apparatus includes a cylindrical body, a holding portion which holds the retainer contacting a lower end of the cylindrical body, a push-up shaft which pushes up the pair of cotter segments into the cylindrical body, and an axial body which is arranged in the cylindrical body to be coaxial with the push-up shaft and to be coaxially movable. The cylindrical body includes a tapered inner circumferential portion on an inner circumferential wall lower portion thereof.Type: ApplicationFiled: May 11, 2012Publication date: November 15, 2012Applicant: HIRATA CORPORATIONInventors: Hiroyuki SHIGA, Kotaro Takamura, Yukihiro Kawamoto, Masahiro Koizumi, Haruo Oka, Koji Matsuda
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Publication number: 20120217556Abstract: A semiconductor device featuring a semiconductor chip having a first main surface and a second, opposing main surface and including a MOSFET having source and gate electrodes formed on the first main surface and a drain electrode thereof formed on the second main surface, first and second conductive members acting as lead terminals for the source and gate electrodes, respectively, are disposed over the first main surface, each of the first and second conductive members has a part overlapped with the chip in a plan view, a sealing body sealing the chip and parts of the first and second conductive members such that a part of the first conductive member is projected outwardly from a first side surface of the sealing body and parts of the first and second conductive members are projected outwardly from the opposing second side surface of the sealing body in a plan view.Type: ApplicationFiled: April 30, 2012Publication date: August 30, 2012Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Patent number: 8183607Abstract: A semiconductor device features a semiconductor chip including a MOSFET, a first electrode of the MOSFET disposed on an obverse surface of the chip, a second, control electrode of the MOSFET disposed on the obverse surface, a third electrode of the MOSFET disposed on a second, opposing surface of the chip, first, second, and third conductive members, each having top surface and opposing bottom surface, the first, second, and third conductive members connecting with the first, second, and third electrodes electrically, respectively, a sealing body having top and bottom surfaces and sealing parts of the first, second, and third conductive members, the first conductive member having first, second, and third contiguous portions, the first portion is positioned over the first electrode, the second is positioned between the first and second portions and the third portion is positioned under the obverse surface of the chip.Type: GrantFiled: July 25, 2011Date of Patent: May 22, 2012Assignees: Renesas Electronics Corporation, Hitachi Tohbu Semiconductor, Ltd.Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Publication number: 20110298020Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: ApplicationFiled: July 25, 2011Publication date: December 8, 2011Inventors: Ryoichi KAJIWARA, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Patent number: 7985991Abstract: A semiconductor device features a semiconductor substrate with a MOSFET, an electrode for main current of the MOSFET disposed on a first major surface of the substrate, an electrode for control of the MOSFET disposed on the first major surface, a rear plane electrode of the MOSFET disposed on a second, opposing surface of the substrate, and an external connection terminal electrically connected to the rear plane electrode, the external electrode contains a first part, a second part and a third part, the first part is positioned over the rear plane electrode, the third part is positioned below the second major surface and the third part is connected via the second part to the first part.Type: GrantFiled: March 12, 2008Date of Patent: July 26, 2011Assignees: Renesas Electronics Corporation, Hitachi Tohbu Semiconductor, Ltd.Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Patent number: 7942216Abstract: A drill rod has a fitting portion protruding toward the distal end of the drill rod. The drill rod fitting portion further encompasses a parallel male thread portion in which a minimum distance from a first axial line in a cross-section perpendicular to the first axial line is constant; and a male thread ending portion is continuous with a proximal end of the parallel male thread portion. The minimum distance of the ending portion increases as a proximal end is approached. Furthermore, the fitting portion is formed such that the minimum distance does not decrease as the proximal end is approached from a distal end thereof. Additionally, the proximal end of the male thread ending portion is positioned where a distance from the first axial line gradually increases as the proximal end of the male thread ending portion is approached from the parallel male thread.Type: GrantFiled: November 21, 2006Date of Patent: May 17, 2011Assignees: Mitsubishi Materials Corporation, Furukawa Rock Drill Co., Ltd.Inventors: Masaya Hisada, Masahiro Koizumi, Takashi Suzuki
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Patent number: 7649159Abstract: The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil.Type: GrantFiled: July 14, 2006Date of Patent: January 19, 2010Assignees: Toyota Jidosha Kabushiki Kaisha, Hirata Corporation, Nihon Den-Netsu Keiki Co., Ltd.Inventors: Masanari Matsuura, Masahiro Koizumi, Masaya Tsuruta, Tomoyuki Kubota, Yoshiyuki Nakamura
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Publication number: 20090260892Abstract: A drill rod having a fitting portion protruding toward the distal end and of the drill rod and extending along a first axial line, wherein the fitting portion includes: a parallel male thread portion in which a minimum distance from the first axial line in a cross-section perpendicular to the first axial line is constant; and a male thread ending portion which is continuous with a proximal end of the parallel male thread portion, and in which the minimum distance increases as approaching toward a proximal end thereof; wherein the fitting portion is formed such that the minimum distance does not decrease as approaching from a distal end to a proximal end thereof; and the proximal end of the male thread ending portion is positioned on a face where a distance from the first axial line gradually increases as approaching from the parallel male thread to the proximal end of the male thread ending portion.Type: ApplicationFiled: November 21, 2006Publication date: October 22, 2009Applicants: Mitsubishi Materials Corporation, Furukawa Rock Drill Co., Ltd.Inventors: Masaya Hisada, Masahiro Koizumi, Takashi Suzuki
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Publication number: 20080169537Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: ApplicationFiled: March 12, 2008Publication date: July 17, 2008Inventors: Ryoichi KAJIWARA, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Patent number: 7400002Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: GrantFiled: October 31, 2006Date of Patent: July 15, 2008Assignees: Renesas Technology Corp., Hitachi Tohbu Semiconductor, Ltd.Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Patent number: 7394146Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: GrantFiled: October 31, 2006Date of Patent: July 1, 2008Assignees: Renesas Tehcnology Corp., Hitachi Tohbu Semiconductor, Ltd.Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Patent number: 7342267Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: GrantFiled: May 2, 2006Date of Patent: March 11, 2008Assignees: Renesas Technology Corp., Hitachi Tohbu Semiconductor, Ltd.Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Patent number: 7332757Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: GrantFiled: May 2, 2006Date of Patent: February 19, 2008Assignees: Renesas Technology Corp., Hitachi Tohbu Semiconductor, Ltd.Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Publication number: 20070040250Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: ApplicationFiled: October 31, 2006Publication date: February 22, 2007Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Publication number: 20070040249Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: ApplicationFiled: October 31, 2006Publication date: February 22, 2007Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Publication number: 20070040248Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: ApplicationFiled: October 31, 2006Publication date: February 22, 2007Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Publication number: 20070029540Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: ApplicationFiled: October 5, 2006Publication date: February 8, 2007Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa
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Publication number: 20070023486Abstract: The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil.Type: ApplicationFiled: July 14, 2006Publication date: February 1, 2007Inventors: Masanari Matsuura, Masahiro Koizumi, Masaya Tsuruta, Tomoyuki Kubota, Yoshiyuki Nakamura
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Patent number: 7141741Abstract: A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.Type: GrantFiled: September 22, 2003Date of Patent: November 28, 2006Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
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Publication number: 20060197196Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.Type: ApplicationFiled: May 2, 2006Publication date: September 7, 2006Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa